News & Updates

The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss for products with RF applications. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. In this article, we'll look at the balance between copper foil losses and other types of losses in a PCB, as well as some strategies that are commonly used to overcome roughness.

We are happy to announce that the Altium Designer 22.8 update is now available. Altium Designer 22.8 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.

Differential data transmission lines usage can be challenging for even experienced designers. First you need to be familiar with the concepts of differential data transmission, find out why it is used, and what the potential advantage for your signal. This webinar will help you determine what part of your designs need differential pairs implementations and how to create such pairs with a given wave impedance in Altium Designer.

The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.

When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer.

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

I used to work in a research lab that worked primarily with RFID (Radio Frequency IDentification) and NFC (Near Field Communication) technology, particularly for the agriculture industry and cattle identification. These were very specialized fields; however, the lab also worked on projects which involved retail and various other applications for NFC. It’s an amazing technology that you might be using every day without thinking about it - building access to your mobile phone payments, for instance.

You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically. This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.

In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes.

There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.

Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.

Every piece of electronic equipment starts with a great idea. Transforming great ideas into real, physical products takes a team of talented individuals and multiple companies coming together to make everything from the internal components to the external hardware. Paul Payen de la Garanderie, Founder and Owner of AW Audio, an engineering services company based in France, understands these challenges very well. With an extensive background in the Audio/Visual industry, Paul has had to work with multiple companies over the years, from small start-ups to celebrated AV firms.

At this time, at least a quarter of the world’s population is under quarantine, with workers unable to go to offices or factories, leading to fundamental disabling of the world economy. The electronics industry is suffering greatly as well, dealing with a supply shock from factories shutting down in Southeast Asia, to demand-side shocks from Western markets literally shutting down. Now it is the electrical engineers taking the lead with additive PCB manufacturing.

Altium 365 provides a secure cloud platform to store all of your design files in a single place so you can share them with anyone and access them from anywhere. This webinar discusses the advantages of placing, storing, and working with projects in Altium 365.

I just finalized my first PCB design using Altium Designer 20. At the same time, I tested some new AD20 features, and in this article, I’ll share my thoughts about new layout design features which made the biggest impression for me: sliding, and any-angle routing.

Anyone who has taken apart an old cell phone or designs IoT devices knows multiple communication capabilities are present in these designs, each requiring different antennas. The RF designer should already take precautions for interconnect isolation, but antenna isolation is just as important when modeling and designing wireless systems.

High voltage/high current designs carry safety requirements which need to be met by designers. Similarly, high speed designs need to have suppressed crosstalk in order to ensure signal integrity. The key design aspects that relate to both areas are your PCB trace clearance and pad clearance values. These design choices are critical for balancing safety, noise suppression, and manufacturability.

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some DFM process pain.


With the new layer stack manager in Altium Designer®, you can now include copper foil roughness factors directly in your impedance calculator. This is quite easy to do in the layer stack manager, but it begs the question: what exactly is the copper roughness factor? Which value should be used for your interconnects?

After you capture your schematic as an initial layout and create an initial component arrangement, it’s time to define your routing constraints. Doing this early will allow your DRC engine to spot rules violations before you finish your layout. Likewise, you’ll be able to modify the default rule set to meet your layout requirements. Here are the important routing constraints you’ll need to check before you start routing your board.

Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.