News & Updates
On-Demand Webinar
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8x Faster Assembly per Board with Assembly Assistant - A Webinar with XVP Photonics
Looking for a way to reduce time and increase the accuracy of the manual assembly of PCBs? Watch this webinar recording for a transformative session and learn how XVP Photonics achieved these goals with Assembly Assistant!
Blog
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What Makes a PCB Enclosure Rugged?
Whether you purchase products off-the-shelf or online, they all come housed within an enclosure. In some cases, these enclosures are intentionally ruggedized to withstand harsh environments or mechanical shocks. You can learn more about enclosures in this new and interesting article.
Blog
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Concept Phase – Lid Assembly Design Part 2
We are continuing our journey through the lid assembly design phase of our Open Source Laptop project. In this section, we will discuss the layout of the test adapter and provide a demonstration of the first test for the display panel, along with the initial steps involved in assembling the boards.
Blog
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Concept Phase – Lid Assembly Design Part 1
In the exciting next phase of the open-source laptop project we're (finally) diving into design, and getting hands-on with the display panel. Discover how we're selecting the right panel, integrating it seamlessly, and creating a custom DisplayPort adapter to illuminate the screen. Plus, learn how our choices impact features like microphones, webcams, and touch sensors, and how Altium can help bring it all to life. It’s not too late to join as we continue on this innovative journey!
Blog
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Unleashing the Power of Concurrent PCB Design
Concurrent PCB Design is essential to unlocking the full potential of engineering teams and delivering innovative products that meet the demands of the modern world. Learn more about the main capabilities and the numerous benefits of this upcoming feature in Altium Designer.
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Crosstalk Reduction and Elimination Techniques in Altium Designer
Whether you're designing a digital board with a ton of traces, or an RF board operating at very high frequencies, any electronic device with propagating signals will experience crosstalk. Learn more about some sure-fire ways you can reduce crosstalk in your high-speed designs.
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Baxandall Volume Control for Audio
The Baxandall volume control is an especially useful, flexible, and simple-to-implement circuit for numerous audio designs. In this article, we will demonstrate how to design this type of equipment.
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Common Flex Design Mistakes and How to Fix Them
Designing flexible circuits involves managing numerous factors. Discover how to prevent mistakes in this process and how to rectify them post-implementation.
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How Much PCB Mask Expansion is Too Much?
In this article you will learn about finding the right balance between PCB mask expansion and potential problems.
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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How ECAD-MCAD Co-Design Supports Aerospace Reliability and Compliance
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
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Most Common Causes of PCB Assembly Rework and Scrap
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
Blog
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Behind the Scenes with AI Embedded Development
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
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We're heading to PCB West 2025!
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
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Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools
Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.
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How to Catch Enclosure and Connector Misalignment Before the First Prototype
As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.
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Executive Insights Into Electronic Product Development Gaps You Need To Close
Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.
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Sourcing For High-Mix Low-Volume Electronics Manufacturing
High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.
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