News & Updates
Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.
Using multiple disconnected tools slows down PCB development and increases the risk of errors. This article shows how an integrated environment keeps all design data connected, enabling faster workflows and fewer late-stage issues.
Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.
This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.
Octopart has announced Octopart Discover, a new platform that shifts electronic component search toward system-level solution discovery. The tool connects design intent with relevant options, enabling engineers to evaluate tradeoffs and identify the best-fit solutions more efficiently.
A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.
See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.
Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.
Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.
Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.
The more complex the product gets, the more involved your customer will need to be to ensure you’re designing to their requirements. When you’re using a data sharing system that integrates with your PCB design tools, it’s easy to give your customers visibility into the product development process. Altium 365 is the only system that integrates with Altium Designer® and gives you the ability to give anyone access to your PCB projects, including your customers and manufacturer.
Anytime you’re looking for a fabricator to produce your new design, you should ensure they have a robust quality control program. Where can quality defects arise and how can manufacturers quickly get this information back to a design team? Sometimes emails can leave too much ambiguity and it is difficult to track progress on specific design changes in the PCB layout. If you’re planning to put a new design into high volume production, there are some basic points that should be checked during fabrication and assembly as part of a PCB manufacturing quality control program.
Controlling crosstalk is one of the key goals in any PCB design. In most instances, when we talk about crosstalk, it’s in reference to the unwanted interaction of the electromagnetic field traveling on one transmission line with a neighboring transmission line. But crosstalk can also occur in the connector pin out. This article will describe this type of crosstalk, the types of disruptions it causes, wherein the design cycle it needs to be factored in and how it can be successfully controlled.
When you’re working through a new PCB design project, and you need to keep track of your project revisions, Altium 365™ creates the ideal environment for collaborative PCB design and revision tracking. Once you upload your projects onto the cloud through the Altium 365 platform, Altium 365 creates a Git repository for your project. It allows you to make it available to collaborators through Altium Designer®. This includes a complete project history, which can be easily accessed by collaborators working on a complex project.
The moment you push your Gerbers to a manufacturer for a DFM inspection, it can be a nerve-wracking experience waiting for a response. Before you receive your working boards, there will likely be some back-and-forth communication before your board hits the fabrication line. When manufacturers and designers need to resolve problems in Gerber files before fabrication, it helps to have a Gerber compare utility. The newest version of Altium Designer now offers this feature through the Altium 365 platform, giving everyone visibility into changes to Gerbers before fabrication.
No matter how you might feel about renewable energy and associated environmental issues, electric vehicles are becoming more mainstream and will become the primary mode of transportation in the future. For the engineering community, what’s much more interesting is how our power distribution and management infrastructure can support this shift to massive increases in the use of electricity on the grid. So what’s the rub for PCB designers?
When you’re working through a complex PCB layout, it always helps to know the shortcuts you can use to stay productive. Altium Designer® keyboard shortcuts, and keyboard + mouse shortcuts, can help you easily walk through your PCB layout during design and as part of final checks during a design review. Here are some of my favorite keyboard shortcuts and viewing options that help me stay productive, and I hope they can do the same for you.
High speed PCB interconnects have continued to remain an active challenge in modeling and simulation, particularly when dealing with broadband signals. The IEEE P370 standard is a step towards addressing the challenges faced by many designers in determining broadband S-parameters for high speed structures up to 50 GHz. Although this standard has been in the works since 2015, it finally passed board approval and appears as an active draft standard.
Amplifiers can come in all shapes and sizes, depending on their bandwidth, power consumption, and many other factors. A Class-D amplifier design is normally used with high fidelity audio systems, and circuits for a Class-D amplifier are not too difficult to build in a schematic. If you’ve never worked with a Class-D amplifier or you’re looking for a fun audio project, follow along with this PCB layout.
Modern digital systems throw the digital electronics textbooks out the window, and high-speed DDR memories are a perfect example of the paradigm shift that occurs when you jump into IC and PCB design. With DDR5 still being finalized, and DDR6 now being discussed, designers who are already comfortable with DDR4 will need to consider how their design practices should adjust to accommodate the constant doubling of data speeds in these high-speed memory technologies.
In my experience, the somewhat vague information you might find in a typical crystal datasheet doesn’t enable an engineer to be wholly confident that their design expectations can be met. On the other hand, “blindly” adopting what the crystal datasheet says usually results in adequate frequency stability. If you want to get inside and uncover what is going on, you need to start thinking about the crystal as a phase-shifting network.
Antipads on vias and landing pads are a point of contention in modern PCB design, and the debate around the use of these elements in a multilayer PCB is framed as a binary choice. Like thermal reliefs, ground plane splits, and orthogonal routing, the debate around antipads on landing pads and vias is framed as an always/never choice. With today’s modern PCBs, it pays to understand the effects of antipads on signal integrity.
RF structures can be complicated to design and layout, particularly because many RF systems lead double lives as digital systems. Getting an analog signal out of a component and into a waveguide for high isolation routing is not so simple as placing a microstrip or stripline coming off your source component. Instead, you need to create a special microstrip to waveguide transition structure to ensure strong coupling into and out of your waveguide.
Layouts for complex electrical systems may need to make extensive use of copper pour to provide ground nets, power nets, shielding, and other copper structures for power and signal integrity. Backplanes, motherboards, RF products, and many other complex layouts will make use of copper pour and polygons that can’t be easily placed as custom components. The rules-driven design engine in Altium Designer® also ensures that any PCB polygon pour you place in your PCB layout will comply with clearance rules and will be checked against other electrical design rules.
If you need to connect multiple boards into a larger system and provide interconnections between them, you’ll likely use a backplane to arrange these boards. Backplanes are advanced boards that borrow some elements from high speed design, mechanical design, high voltage/high current design, and even RF design. They carry their own set of standards that go beyond the reliability requirements in IPC.
The upcoming Gen6 version of PCIe is pushing the limits of signal integrity for many computer systems designers. As with any high-speed signaling standard, signal integrity is a major design consideration, which requires the right set of design and analysis techniques. Rather than digging deep to find PCIe 5.0 signal integrity requirements from PCI-SIG, we’ve compiled the important points for today’s PCB layout engineers. Layout engineers should pay attention here as these design requirements will become more stringent in later PCIe generations.