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Embedded thumbnail for Create Clearance Rules Faster and with Less Effort
New in Altium's Software
Create Clearance Rules Faster and with Less Effort

Setting up clearance rules is now more intuitive in the Constraint Manager. Choose the Simple view for faster configuration with grouped object types, or the Advanced view when you need detailed, matrix-based clearance control.

NEW
Blog
Your Design Data Has Zero Defense

Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.

NEW
Embedded thumbnail for Mastering HDI Design Rules in Altium Designer
How-To's
Mastering HDI Design Rules in Altium Designer

In our latest Altium Academy tutorial, we guide you through configuring the essential HDI PCB design rules in Altium's software. You'll learn how to use your manufacturer's fabrication capabilities to create accurate design rules and constraints for your PCB.

Embedded thumbnail for Search, Filter, and Navigate PCB Designs Faster
New in Altium's Software
Search, Filter, and Navigate PCB Designs Faster

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

Blog
Integrated PCB Design vs. Legacy Point Tools: What’s the Real Cost?

As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.

Blog
Make Better Design Decisions with Signal and Power Integrity Insight

Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.

Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Blog
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

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Blog
High-Speed PCB Design Tips

Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.

Introduction to Open Source Laptop Project
Blog
Introduction to Open Source Laptop Project

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Blog
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Blog
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

Blog
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

Blog
Which Types of Opto-Isolators Are Right For Your Signal?

An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?

Blog
Properties panel document options in SCH editors

The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.

High-Speed PCB Stackup Design
Blog
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

stitching vias
Blog
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

PCB Stackup Basics
Blog
PCB Stackup Basics

In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.

Tag
Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

Embedded thumbnail for Working with Design Variants
How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

Embedded thumbnail for Creating Connectivity
How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar Mai 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr. 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Jan. 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.