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Embedded thumbnail for Create Clearance Rules Faster and with Less Effort
New in Altium's Software
Create Clearance Rules Faster and with Less Effort

Setting up clearance rules is now more intuitive in the Constraint Manager. Choose the Simple view for faster configuration with grouped object types, or the Advanced view when you need detailed, matrix-based clearance control.

NEW
Blog
Your Design Data Has Zero Defense

Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.

NEW
Embedded thumbnail for Mastering HDI Design Rules in Altium Designer
How-To's
Mastering HDI Design Rules in Altium Designer

In our latest Altium Academy tutorial, we guide you through configuring the essential HDI PCB design rules in Altium's software. You'll learn how to use your manufacturer's fabrication capabilities to create accurate design rules and constraints for your PCB.

Embedded thumbnail for Search, Filter, and Navigate PCB Designs Faster
New in Altium's Software
Search, Filter, and Navigate PCB Designs Faster

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

Blog
Integrated PCB Design vs. Legacy Point Tools: What’s the Real Cost?

As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.

Blog
Make Better Design Decisions with Signal and Power Integrity Insight

Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.

Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Blog
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Tag
Blog
High-Speed PCB Design Tips

Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.

Introduction to Open Source Laptop Project
Blog
Introduction to Open Source Laptop Project

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Blog
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Blog
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

Blog
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

Blog
Which Types of Opto-Isolators Are Right For Your Signal?

An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?

Blog
Properties panel document options in SCH editors

The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.

High-Speed PCB Stackup Design
Blog
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

stitching vias
Blog
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

PCB Stackup Basics
Blog
PCB Stackup Basics

In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.

Tag
Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

Embedded thumbnail for Polygon Pours
Working with Polygons
Polygon Pours

Polygon pours are used to create copper geometries on your board. You can prioritize polygon pour order, hide them to make it easier to work on your board, and repour them to resolve design rule conflicts.

Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

Embedded thumbnail for Creating Additional Snap Points Using a 3D Model
How to use Snapping
Creating Additional Snap Points Using a 3D Model

Demonstration of using snap points with 3D models and how they can assist in the placement of said models.

Embedded thumbnail for Polygon Connect Styles
Working with Polygons
Polygon Connect Styles

Define how vias and pads connect to polygons with a design rule. Customize the thermal relief width, number, and rotation as well as the air gap width.

Embedded thumbnail for How to work with Component Classes?
How to Work with Classes
How to work with Component Classes?

Modern printed circuit boards can contain a large number of components, which makes them difficult to work with. In this video we will show what component classes can be on a PCB, how to create custom component classes and how they can be useful for us. 

Embedded thumbnail for Create and Snap to a Circular Grid (Polar Grid)
How to use Snapping
Create and Snap to a Circular Grid (Polar Grid)

Instructional on how to create polar grids, how to snap to them, and why you might want to use them.

Embedded thumbnail for How to Connect Polygons to Nets
Working with Polygons
How to Connect Polygons to Nets

This video covers how to easily connect a polygon to a net using just two clicks. With the Properties panel open and a polygon selected, click the "Assign net" button in the Properties panel.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
Getting Started with A365
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files. 

Embedded thumbnail for Altium 365 Getting Started: Migrate to Altium 365 from other VCS
Getting Started with A365
Altium 365 Getting Started: Migrate to Altium 365 from other VCS

The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. Traditionally, one way to manage data is to use a version control system such as Git or SVN. Unlike other VCSs, Altium 365 is the system designed specifically for managing project data.

Embedded thumbnail for How to get a BOM for a Multi-board Design
How-To's
How to get a BOM for a Multi-board Design

When designing a multi-board project, an up-to-date and accurate BOM for the entire device is a necessity. Watch this video to learn how to properly create a BOM for your multi-board project.

Embedded thumbnail for Remove Unused Pad Shapes
Working with Polygons
Remove Unused Pad Shapes

Unused pad shapes create holes in your copper geometries. You can quickly examine all pads in the design to remove unused pad shapes and restore previously removed pads. 

Embedded thumbnail for Effective use of "Objects for snapping" when creating a Footprint
How to use Snapping
Effective use of "Objects for snapping" when creating a Footprint

Learn how to effectively use snaps that allow you to create a component footprint quickly and conveniently

Embedded thumbnail for How to Control Routing in Altium Designer
How-To's
How to Control Routing in Altium Designer

The routing functionality in Altium Designer is constantly evolving. Check out this video to learn the basics of routing in Altium Designer. 

Embedded thumbnail for Polygon Creation
Working with Polygons
Polygon Creation

Learn how to create polygon pours to ensure proper copper distribution on your board.

Embedded thumbnail for Creating Guide Lines and Snap Points
How to use Snapping
Creating Guide Lines and Snap Points

Explanation of guides and snap points and how to create and use them.

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar Mai 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr. 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Jan. 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.