News & Updates
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Explore the challenges and reasons behind Multi-CAD engineering and discover solutions for smooth cross-platform ECAD collaboration.
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Explore the precision of PCB design with Altium Designer's latest Constraint Manager! Hone your skills in component positioning, routing, and rule definition to enhance your design capabilities with Altium's state-of-the-art tools. Discover more about this cutting-edge feature in the manual today.
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Watch the webinar that brings together the expertise of Altium 365 and AWS to introduce the specialized Altium 365 GovCloud within the robust AWS GovCloud infrastructure. This session is designed for IT and security professionals seeking advanced data protection and access control solutions for their electronics development teams.
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Learn the whole story of revamping the SMTA Test Board, the groundbreaking tool for solder paste testing.
![Agile Hardware Development Blog Cover Photo](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2024-02/LinkedIn_0.png?itok=OW7c3Lrt)
Explore common principles and rituals of Agile and how you can adapt them to hardware product development.
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Have you considered converting a USB interface to serial (UART), while delivering data over a custom Ethernet cable and RJ45 connectors? If so, we invite you to check out this article on building a USB to Serial-Over-RJ45 Module. Additionally, you'll find a link to our workspace to explore the entire project.
![Why the Principles Are Sound, but the Tactics Need a Re-Think Cover](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2024-02/Why%20the%20Principles%20Are%20Sound%2C%20but%20the%20Tactics%20Need%20a%20Re-Think%20Cover.jpg?itok=z0I3jP_x)
Explore common principles and rituals of Agile and how you can adapt them to hardware product development.
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Our exploration of the Pi.MX8 open-source computer module project progresses. In this third chapter, our focus shifts to the PCB layout preparation of the board. Key topics include defining the layerstack and component break-out routing.
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Design faster together with the innovative PCB CoDesign feature, exclusively available in Altium Designer. This cutting-edge functionality seamlessly integrates schematic and PCB design, facilitating concurrent work by multiple engineers on the same project. Learn more about this groundbreaking feature in our comprehensive manual.
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Electronic components power nearly everything in our modern lives. However, as long as there are buyers for parts, counterfeiters will persist in their endeavors. Financial losses resulting from fake components are challenging to ascertain due to enforcement limitations and the difficulty in collecting data on the issue. In this article, we demonstrate how to test and verify components in batch orders.
![Can Agile Development Work for Hardware Cover](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2024-03/Can%20Agile%20Development%20Work%20for%20Hardware.png?itok=IuhEyM7B)
Watch the webinar to explore the benefits of agile methodologies and how they can be translated into the physical world of hardware development! Learn how Altium 365 can support the adoption of this approach.
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With increased electronics supply chain visibility, you can develop better products faster and align perfectly with budget constraints early on. Here’s why.
![Why the Principles Are Sound, but the Tactics Need a Re-Think](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2024-02/Why%20the%20Principles%20Are%20Sound%2C%20but%20the%20Tactics%20Need%20a%20Re-Think.jpg?itok=Snt15avO)
Explore common myths about Agile hardware development and learn how to adapt Agile principles for hardware projects.
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We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.
![Multi-board and Harness Design Capability in Altium Designer 23](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2023-01/Multi-board%20and%20Harness%20Design%20Capability%20in%20Altium%20Designer%2023-82471.jpg.png?itok=2eEHe3KV)
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
![MLCC controlled ESR capacitor](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2023-01/Controlled%20ESR%20Capacitors-%20Should%20You%20Use%20Them%20for%20Power%20Integrity%3F-76898.jpg.png?itok=PcvfQPz5)
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
![chip with neon illumination](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/How%20Does%20the%20Package%20PDN%20Impact%20Power%20Integrity_-82724.jpg?itok=U365ZE0Z)
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
![electrical circuit with microcontroller](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Designing%20Custom%20Hardware%20with%20Microcontrollers-81688.jpg?itok=0mTmNyJk)
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
![high-speed printed circuit board](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Guide%20to%20Low-Dk%20PCB%20Materials-82663.jpg?itok=CTezZAyt)
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
![freeway in the background of the city](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Designing%20for%20V2X%20Communication_%20Wireless%20Protocols%20and%20Standards-82650.jpg?itok=Ws3u8cyq)
If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
![Everything You Need to Know About Stitching Vias](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Everything%20You%20Need%20to%20Know%20About%20Stitching%20Vias-82675.jpg?itok=LxPqBjOL)
This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
![IPC-2221 Calculator for PCB Trace Current and Heating](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/IPC-2221%20Calculator%20for%20PCB%20Trace%20Current%20and%20Heating-82694.jpg?itok=CHNOHqge)
The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
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When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
![Ultra-HDI Technology is Not New](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Ultra-HDI%20Technology%20is%20Not%20New-82575.jpg?itok=OTP4fOIk)
Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
![Today's PCB Designers Are Driving Electronics Product Design](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Today%26%23039%3Bs%20PCB%20Designers%20Are%20Driving%20Electronics%20Product%20Design-82476.jpg?itok=NfVsIZZL)
What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
![Phased Array Antenna Design for 5G Applications](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Phased%20Array%20Antenna%20Design%20for%205G%20Applications-82475.jpg?itok=s3eKfQlq)
As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
![IPC - Vias](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/IPC%20-%20Vias-81221.jpg?itok=ahLw-TLG)
Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
![Power Integrity Analysis in Your PCB Design Software](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Power%20Integrity%20Analysis%20in%20Your%20PCB%20Design%20Software-76536.jpg?itok=v41xgXSm)
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
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A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
![Embedded Capacitance Materials Overview](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Embedded%20Capacitance%20Materials%20Overview-82421.jpg?itok=bzsu_a56)
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.