News & Updates
Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.
Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.
Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.
"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.
Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.
Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.
Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.
Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.
Discover why top electronics companies are replacing spreadsheets with purpose-built BOM management solutions. This whitepaper outlines the risks of outdated methods, offers a readiness checklist, and explores how BOM Portal helps teams cut costs, reduce risk, and speed up development with smarter, data-driven workflows.
Material and process choices play a key role in high-performance PCB design. This article highlights how stack-up configuration, substrate selection, and lamination strategy impact signal integrity, reliability, and manufacturability.
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.
Agile hardware development isn’t just about working faster, it’s about working together in real time. This article explores how shared environments for ECAD, MCAD, sourcing, and requirements management eliminate handoff delays and improve decision-making across teams.
Verification becomes much easier when requirements and system performance data stay connected automatically. This article explains how reusable parameters and V&V rules help teams detect violations earlier and validate designs with greater confidence.
This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.
Complex multiboard designs demand more than just connecting boards together. They require every interface to work flawlessly under real-world conditions. Discover how better pin assignments, return paths, and mechanical planning can dramatically improve reliability and reduce rework.
Engineering and sourcing teams work best when BOM decisions happen with live market data in view. This article explains how integrated cost and availability insights help teams collaborate earlier and avoid redesigns driven by supply chain issues.
Poor ECAD-MCAD coordination often leads to enclosure conflicts, connector misalignment, and costly redesigns. This article shows how integrated collaboration helps teams catch manufacturability issues earlier and keep projects moving smoothly.
Ultra HDI is changing the rules of PCB design and registration tolerance is now part of the design conversation from day one. Discover how smarter spacing, stackup planning, and collaboration with fabricators can dramatically improve manufacturability and reliability.
Because ECAD formats are typically incompatible, teams often struggle with versioning, conversions, and fragmented review processes. This article breaks down how multi-CAD viewers provide a unified, read-only environment that supports structured design reviews, comments, and task assignment across disciplines.
Sharing PCB designs doesn’t have to be complicated. Check out the best online ECAD viewers that let anyone view and collaborate on designs right from a browser.
Rigid-flex PCBs help modern devices get smaller, lighter, and more compact by eliminating connectors and fitting into tight 3D spaces. This article explains how to design them properly to avoid common reliability issues.
This webinar walks through the complete post-release workflow, from generating a managed BOM to sourcing components and assembling the first prototype. It demonstrates how integrated tools streamline data enrichment, supplier selection, and guided assembly to reduce delays and errors.