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Design Phase – Lid Assembly Electronics Part 2

We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.

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New Constraint Manager
New Constraint Manager: Introduction & Creation of Net Classes

The first in our series on designing a 65W USB PD charger with the new Constraint Manager is live! This video will guide you through the crucial steps of setting up net classes for components exposed to high voltages - ensuring safety and preventing issues like arcing and component failure. Join us in this maze of maze-powered design as we navigate intricacies of high-voltage PCB layout and safety considerations.

Agile Hardware Development
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5 Ways Hardware Development Is Just… Different

Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.

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How-To's
Tesla Unveiled! EE Deep Dives Into Roadster's PCB Design Files

Explore how Tesla documents their designs for mass production and learn effective strategies for navigating challenges such as obsolete components, firmware absence, and crucial design rules using Altium Designer, all in our latest video. Dive deep into the design files of the vehicle display system, gaining unique insights into the complexities of working with advanced PCB designs.

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Wearable Design Project
Wearable Design Project - Introduction

Ever wanted to design a wearable electronic device? Follow along with Piet Callemeyn as he delves into the design of a wireless heart rate sensor. In this series, Piet explores PCB design essentials to create a variable heart rate sensor, offering insights around efficient power use, seamless data transfer, and a clean, compact design throughout the entire process.

Blog
Flexible Circuit Assembly: Thinking Through Component Placement

The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.

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New in Altium Designer 24
Coming Soon: Simulation S-parameters Analysis

Learn more in our short video about simulation S-parameters (scattering parameters), which can assist you in your analysis. This data can be used to optimize your design, leading to cost savings, improved product quality, and a competitive edge in the marketplace.

Blog
Coding Your Own Networked Test Equipment

Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.

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New in Altium Designer 24
Coming Soon: Footprint Mirroring Prevention

Check out the new feature that we are preparing for you. Footprint Mirroring Prevention adds measures to prevent inadvertent mirroring of a footprint along its X/Y axes. With this functionality, you can avoid costly board respins.

Blog
Pi.MX8 Project – Schematic structure and component placement

We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.

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New in Altium Designer 24
Design in a New Dimension: Altium Designer’s 3D-MID Demo

Explore the cutting-edge 3D-MID capabilities in Altium Designer with our detailed demo! In this video, we guide you through the process of creating a 3D PCB document, importing components, and seamlessly transitioning from 2D to 3D board design.

Blog
Redefine PCB Boundaries with HDI Design

Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.

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New in Altium Designer 24
PCB CoDesign Demo: A Collaborative Approach to PCB Design

Explore the realm of collaborative design through our PCB CoDesign feature. Discover how multiple engineers can seamlessly collaborate on the same project in our full-time demo. Design faster together with Altium Designer 24.

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New in Altium Designer 24
Empowering Faster Electronics Development with Altium Designer 24 - Webinar Recording

If you missed our Altium Designer 24 webinar, don't worry! We have good news for you—it was recorded. Explore the game-changing features that will revolutionize your PCB design experience and discover the new standard in electronic design.

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Blog
An Overview Of PCB Outer Layer Processing

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

Blog
How Do Pads and Vias Impact Total Capacitor Parasitic Inductance?

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

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Blog
Analyzing Crosstalk on FIFO and DDR4 Parallel Bus Interfaces

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

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Blog
Amplifier Stability at High Frequencies and Stray Capacitance

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

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Blog
Working with Design Variants

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

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Blog
Setting Up Concord Pro Revisions and Lifecycle

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Blog
How to Successfully Design a BGA

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

Blog
Altium Designer 20.2 Update 1 is now available

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

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Blog
How Copper Foil Roughness Affects Your Signals and Impedance

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

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Blog
What is Burn-in Testing for Electronics?

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

Blog
PCB Design for Testability to Ensure High Yield and Quality

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

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Blog
Top Tips from Experienced Flex Designers

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design. 

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Blog
How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

Article preview
Blog
How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Blog
Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

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Blog
Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

Tag
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How to create a PCB Footprint
Creating a PCB Footprint Assembly Drawing

If you need to create an assembly drawing of your PCB Footprint for your outjob files we can show you how in Altium Designer. We’ll walk through all the different options for your assembly drawing in your Draftsman document, how to create your assembly drawing and assign it designators.

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How-To's
Using the ActiveBOM

Using the ActiveBOM: The Bill of Materials (BOM) contains a list of all the components with their designators, part numbers, values, and other parameters. An ActiveBOM manages the mapping from the design component (part) to the part that is purchased. This video describes how to use the ActiveBOM document to create an up-to-date list of components needed for your project.

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How to work with Layer Stack Manager
Using Back Drills in your Stackup

In this video, we will learn about Back Drilling technology, how to set up back drilling using the layer stack manager, and how to set up the Stub Length sizes for back drilling by specifying applicable nets using the Design Rules Editor.

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How-To's
How to Customize The Properties Panel

How to Customize The Properties Panel: This video will go over how to customize the look and feel of the properties panel in Altium Designer. By being able to personalize your workspace you can greatly improve your efficiency

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How to work with Layer Stack Manager
How to Create and Use Impedance Profiles

Using the Altium Designer Layer Stack Manager, we will show how to create impedance profiles for transmission lines and how to apply them to the circuit board using the PCB Rules and Constraints Editor.

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How to create a PCB Footprint
Creating a PCB Footprint Courtyard

The courtyard is an essential piece when you want to create a PCB Footprint in Altium Designer. We’ll talk about what a courtyard is, how to create a courtyard, and how to format a courtyard correctly for your PCB footprint.

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How-To's
How to Edit Existing Tracks in Altium Designer

This new design rule flags a violation when the creepage distance across non-conductive surface and edge regions of the board, between the targeted signals, is equal to or less than the specified Creepage distance.

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How to create a PCB Footprint
Creating a PCB Footprint Silkscreen Overlay

When creating a PCB footprint in Altium Designer creating a silkscreen overlay is an important requirement. We’ll go over the standards for creating a silkscreen overlay for a footprint and the steps to creating one, such as constructing lines and measuring distance of objects and primitives.

Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Paste
What's New in 22.7
变量助焊层输出控件

输出数据需要尽量准确。对于多变量设计,您现在可以确保将助焊层仅显示在真正需要的位置。

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How-To's
Adding Designators for Assembly Drawings

Designators for assembly drawings are added on the assembly layer. This video shows how to add the designators.

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How to work with Layer Stack Manager
Stackup Material Library

In this video we will learn more about the Altium designers Layer Stack Mangers built-in materials library, and how to add new material and use it in our board stack. We will also look at how we can save the user materials to an xml format.

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