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Design Phase – Lid Assembly Electronics Part 2

We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.

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New Constraint Manager
New Constraint Manager: Introduction & Creation of Net Classes

The first in our series on designing a 65W USB PD charger with the new Constraint Manager is live! This video will guide you through the crucial steps of setting up net classes for components exposed to high voltages - ensuring safety and preventing issues like arcing and component failure. Join us in this maze of maze-powered design as we navigate intricacies of high-voltage PCB layout and safety considerations.

Agile Hardware Development
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5 Ways Hardware Development Is Just… Different

Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.

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How-To's
Tesla Unveiled! EE Deep Dives Into Roadster's PCB Design Files

Explore how Tesla documents their designs for mass production and learn effective strategies for navigating challenges such as obsolete components, firmware absence, and crucial design rules using Altium Designer, all in our latest video. Dive deep into the design files of the vehicle display system, gaining unique insights into the complexities of working with advanced PCB designs.

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Wearable Design Project
Wearable Design Project - Introduction

Ever wanted to design a wearable electronic device? Follow along with Piet Callemeyn as he delves into the design of a wireless heart rate sensor. In this series, Piet explores PCB design essentials to create a variable heart rate sensor, offering insights around efficient power use, seamless data transfer, and a clean, compact design throughout the entire process.

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Flexible Circuit Assembly: Thinking Through Component Placement

The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.

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New in Altium Designer 24
Coming Soon: Simulation S-parameters Analysis

Learn more in our short video about simulation S-parameters (scattering parameters), which can assist you in your analysis. This data can be used to optimize your design, leading to cost savings, improved product quality, and a competitive edge in the marketplace.

Blog
Coding Your Own Networked Test Equipment

Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.

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New in Altium Designer 24
Coming Soon: Footprint Mirroring Prevention

Check out the new feature that we are preparing for you. Footprint Mirroring Prevention adds measures to prevent inadvertent mirroring of a footprint along its X/Y axes. With this functionality, you can avoid costly board respins.

Blog
Pi.MX8 Project – Schematic structure and component placement

We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.

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New in Altium Designer 24
Design in a New Dimension: Altium Designer’s 3D-MID Demo

Explore the cutting-edge 3D-MID capabilities in Altium Designer with our detailed demo! In this video, we guide you through the process of creating a 3D PCB document, importing components, and seamlessly transitioning from 2D to 3D board design.

Blog
Redefine PCB Boundaries with HDI Design

Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.

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New in Altium Designer 24
PCB CoDesign Demo: A Collaborative Approach to PCB Design

Explore the realm of collaborative design through our PCB CoDesign feature. Discover how multiple engineers can seamlessly collaborate on the same project in our full-time demo. Design faster together with Altium Designer 24.

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New in Altium Designer 24
Empowering Faster Electronics Development with Altium Designer 24 - Webinar Recording

If you missed our Altium Designer 24 webinar, don't worry! We have good news for you—it was recorded. Explore the game-changing features that will revolutionize your PCB design experience and discover the new standard in electronic design.

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Blog
An Overview Of PCB Outer Layer Processing

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

Blog
How Do Pads and Vias Impact Total Capacitor Parasitic Inductance?

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

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Blog
Analyzing Crosstalk on FIFO and DDR4 Parallel Bus Interfaces

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

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Blog
Amplifier Stability at High Frequencies and Stray Capacitance

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

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Blog
Working with Design Variants

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

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Blog
Setting Up Concord Pro Revisions and Lifecycle

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Blog
How to Successfully Design a BGA

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

Blog
Altium Designer 20.2 Update 1 is now available

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

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How Copper Foil Roughness Affects Your Signals and Impedance

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

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Blog
What is Burn-in Testing for Electronics?

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

Blog
PCB Design for Testability to Ensure High Yield and Quality

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

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Top Tips from Experienced Flex Designers

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design. 

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Blog
How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

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How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Blog
Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

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Blog
Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

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Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

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How to use Snapping
Creating Additional Snap Points Using a 3D Model

Demonstration of using snap points with 3D models and how they can assist in the placement of said models.

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Working with Polygons
Polygon Connect Styles

Define how vias and pads connect to polygons with a design rule. Customize the thermal relief width, number, and rotation as well as the air gap width.

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How to Work with Classes
How to work with Component Classes?

Modern printed circuit boards can contain a large number of components, which makes them difficult to work with. In this video we will show what component classes can be on a PCB, how to create custom component classes and how they can be useful for us. 

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How to use Snapping
Create and Snap to a Circular Grid (Polar Grid)

Instructional on how to create polar grids, how to snap to them, and why you might want to use them.

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Working with Polygons
How to Connect Polygons to Nets

This video covers how to easily connect a polygon to a net using just two clicks. With the Properties panel open and a polygon selected, click the "Assign net" button in the Properties panel.

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Getting Started with A365
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files. 

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Getting Started with A365
Altium 365 Getting Started: Schematic Compare

The schematic sheets in a project are subject to change over time, and sometimes it may be necessary to compare several different versions and detect differences between them. In Altium Designer you can easily perform an automatic comparison of any revisions of schematic documents. 

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Getting Started with A365
Altium 365 Getting Started: Migrate to Altium 365 from other VCS

The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. Traditionally, one way to manage data is to use a version control system such as Git or SVN. Unlike other VCSs, Altium 365 is the system designed specifically for managing project data.

Embedded thumbnail for How to get a BOM for a Multi-board Design
How-To's
How to get a BOM for a Multi-board Design

When designing a multi-board project, an up-to-date and accurate BOM for the entire device is a necessity. Watch this video to learn how to properly create a BOM for your multi-board project.

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Working with Polygons
Remove Unused Pad Shapes

Unused pad shapes create holes in your copper geometries. You can quickly examine all pads in the design to remove unused pad shapes and restore previously removed pads. 

Embedded thumbnail for Effective use of "Objects for snapping" when creating a Footprint
How to use Snapping
Effective use of "Objects for snapping" when creating a Footprint

Learn how to effectively use snaps that allow you to create a component footprint quickly and conveniently

Embedded thumbnail for How to Control Routing in Altium Designer
How-To's
How to Control Routing in Altium Designer

The routing functionality in Altium Designer is constantly evolving. Check out this video to learn the basics of routing in Altium Designer. 

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Working with Polygons
Polygon Creation

Learn how to create polygon pours to ensure proper copper distribution on your board.

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How to use Snapping
Creating Guide Lines and Snap Points

Explanation of guides and snap points and how to create and use them.

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Working with Polygons
Polygon Types and Parameters

Each board requires different copper geometries. Polygon types make sure you can create the perfect copper geometry for every need.

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