News & Updates
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The Crucial Balance: Cost, Quality, and Availability In Electronic Component Selection
Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.
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Wire Harness Failures: The Hidden Costs and Real-World Recalls That Could Have Been Prevented
Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.
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Part Selection Fundamentals: Creating Resilient Component Requirements
Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.
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Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design
This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.
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How to Choose the Best Requirements Management Tool for Electronics Development
Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.
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New Routing Possibilities with Ultra HDI
Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.
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3D-MID in Focus: Principles, Processes, and Practical Use
This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.
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Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs
Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.
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How to Overcome Power Distribution and Connector Misalignment Challenges in Multi-Board PCB Systems
Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.
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Mastering Component Templates in Altium Designer 25
Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.
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Analog Solar Tracker Project
In this article you can learn about light sensors while building an analog solar panel tracking system. This open-source project covers multi-channel design, window comparators, driving motors, and photosensors.
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Concept Phase – Initial CAD Design
We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.
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Expert Tips for Safely Powering Up Your New PCB for the First Time
In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.
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High-Speed PCB Design Tips
Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.
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MIDs Make a Comeback as Vertical SMD Modules for Your PCB
If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.
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Everything You Need to Know about Conformal Coating
Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.
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Introduction to Open Source Laptop Project
We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.
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Mechanical and Electrical Design Come Together With Altium’s MCAD CoDesigner
Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!
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Ebook: Routing High-Density Interconnects with Reliable Microvias
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
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IPC-2221 Calculator for PCB Trace Current and Heating
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
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Stripline Impedance Calculator
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
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Which Types of Opto-Isolators Are Right For Your Signal?
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
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Properties panel document options in SCH editors
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
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The High-Speed PCB Stackup Design Challenge
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
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Everything You Need to Know About Stitching Vias
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
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PCB Stackup Basics
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
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