News & Updates
Watch this webinar and learn how to remove ECAD data silos to enhance design collaboration, efficiently manage all your BOMs, and reduce supply chain risks with Multi-CAD File Support.
Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.
Ready to start collaborating on your OrCAD projects in a multi-CAD environment? Check how you can use Multi-CAD File Support in Altium 365 in practice.
Learn how to make informed decisions and mitigate supply chain risks with Altium 365 BOM Portal. Improve your time to market and proactively manage supply chain risks.
A constraint-based approach to PCB design is crucial in today's electronics industry. This article delves deeper into this complex and interesting topic, exploring various types of constraints, their advantages, and providing guidance on implementing them into your PCB design process.
Do you have extensive knowledge about the Pi.MX8 module? We're excited to introduce a new series of articles focusing on an innovative approach to utilizing this module. In this inaugural chapter, we provide insights into the preparation for this project and detail the elements that will be used.
Learn why BOM management is critical for both procurement managers and electronic engineers. Altium 365 BOM Portal helps to bridge the gap between these worlds. Discover how!
Watch the webinar and get a sneak peek at revolutionizing your engineering, compliance, and procurement approach with Altium 365 and Z2Data integration. Leverage comprehensive component data and advanced risk management strategies to enhance resilience in your operations.
Watch our webinar and learn how to design PCBs while staying compliant with US government security regulations. Understand the differences between commercial Altium 365 and Altium 365 GovCloud in real-case scenarios.
Happy New Year! 🎉 We are thrilled to announce that the Altium 365 Assembly Assistant is now officially released and available for direct purchase through the Altium Store.
Creating documentation for hand PCB assembly does not prevent the same documentation from being utilized to assist in automated PCB assembly. Learn more about the optimal format for this data to enhance both your hand PCB assembly and overall assembly processes.
Explore the powerful features of Altium Designer 24! Experience Constraint Manager and revolutionize your PCB design with reusable constraint sets, schematic-to-board rule transition, easy class and differential pair grouping, and more.
High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.
Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.
Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.
We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.
Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.
Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.
High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.
Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.
Curious about the intersection of mechanical and electrical design? Both are crucial in the PCB design process, especially for multi-board systems. Read our latest article to learn how ECAD and MCAD can address significant challenges during PCB preparation.
Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
Automated measurements are no longer tough. With our Mixed Simulation mode, everything is easier. Learn more about this feature based on DC-DC buck converter design in this brand new article.
In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.
Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.
We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.
Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.
Discover how Penn Electric Racing builds award-winning, fully electric racecars with Altium 365, pushing the boundaries of technology and design.