News & Updates
Blog
•
Meeting Standards: IPC 6012 Class 3 Annular Ring
Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.
Blog
•
Decoding PCB Fabrication Notes
Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.
Blog
•
Design Basics for HDI and the HDI PCB Manufacturing Process
As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.
Blog
•
Is It Printed or a Component? All About PCB Test Points
Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.
Blog
•
How to Design to a Differential Impedance Specification
The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.
Blog
•
The Main Advantages when using Draftsman to Create a Component Mounting Drawing
Quite often, a standard assembly drawing is not enough to ensure the quality of a PCB assembly, especially when designing high-density boards. It would also be helpful to include additional detailing for simpler devices. The use of a Draftsman document brings an elegant, yet powerful solution to make these tasks easier.
Blog
•
Product Lifecycle Management in Electronics Manufacturing
An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.
On-Demand Webinar
•
Length Matching in High Speed Buses
With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.
Blog
•
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?
In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.
Blog
•
How to Solve Your Engineering Design Review Challenges
You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs
Blog
•
From Complexity to Clarity: Smart Design Reviews for Agile Engineering Teams
Understand how structured design reviews within Altium Agile Teams enhance visibility, traceability, and cross-team collaboration. This webinar highlights methods to detect issues early and optimize your development workflow.
Blog
•
Building a Local-LLM Datasheet Extractor for IC Driver Development
Parsing long datasheets manually slows down embedded development and introduces errors. This article shows how to use a local LLM pipeline to convert datasheets into structured data that speeds up driver creation.
Blog
•
Types of Simulation Tools For PCBs
PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.
Blog
•
Wiring the Future: The Shift to Unified Electromechanical Design
This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.
Blog
•
Best Tools For PCB DFM Checks
Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.
Blog
•
Eliminate Your Design Friction with Agile Teams
Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.
Blog
•
What Is an Integrated Design Environment for Electronics?
Using multiple disconnected tools slows down PCB development and increases the risk of errors. This article shows how an integrated environment keeps all design data connected, enabling faster workflows and fewer late-stage issues.
Blog
•
What is the Best Cloud PCB Design Software?
Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.
Blog
•
From Rework to Revenue: Digital PCB DFMA
This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.
Blog
•
Introducing Octopart Discover: From Part Search to Solutions Discovery
Octopart has announced Octopart Discover, a new platform that shifts electronic component search toward system-level solution discovery. The tool connects design intent with relevant options, enabling engineers to evaluate tradeoffs and identify the best-fit solutions more efficiently.
Blog
•
How to Choose the Right Components for Your BOM
A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.
Blog
•
From Scattered Requirements to Confident Product Development
See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.
Blog
•
What is the Best PCB Design Tool For Students?
Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.
Blog
•
What Is Collaborative Engineering?
Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.
Blog
•
Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan
Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.
Blog
•
PCB Design Process: The EDA Design Approach
Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.
Your search returns no results.
