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Schematic Review Checklist
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Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

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How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

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How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Man working in Altium Designer
Blog
Best Practices in Hardware Version Control Systems

Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

Copper pour and via stitching
Blog
Copper Pour and Via Stitching: Do You Need Them in a PCB Layout?

To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.

MOSFET Components
Blog
Should You Use Power MOSFETs in Series?

Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.

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How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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How to work with Snippets
Schematic Design Reuse Using Snippets

Snippets allow you to easily reuse circuitry across multiple parts of your designs. We’ll show you how create a new snippets the Schematic and how to connect and annotate it so you can easily bring your circuitry directly into your board.

MLCC controlled ESR capacitor
Blog
Controlled ESR Capacitors: Should You Use Them for Power Integrity?

I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?

Embedded thumbnail for PCB Design Reuse Using Snippets
How to work with Snippets
PCB Design Reuse Using Snippets

Snippets give you easy access to reuse circuitry on your PCB. Let’s take a look at how you can create and configure snippets for the PCB, connect a component link with the schematic and update the PCB to include your snippet.

Ground Pour, Impedance and Losses
Blog
Microstrip Ground Clearance Part 2: How Clearance Affects Losses

If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.

Choosing the Right Microphone for Embedded Applications
Blog
Choosing the Right Microphone for Embedded Applications

If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.

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PCIe 6.0 Overview
Blog
Overview of the PCIe 6.0 Standard

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

SPI vs. I2C For Memory Access
Blog
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

Blog
Is There an SPI Trace Impedance Requirement?

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

PCB Output files
Blog
How to Make PCB Gerber Files in Altium Designer Step-by-Step

Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.

Teardrops on Differential Pairs?
Blog
Should You Place Teardrops on Differential Pairs?

One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.

Broken PCB
Blog
The High-Reliability PCBA Design and Test Challenge

High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.

Where to place AC Caps on PCIe Lanes
Blog
AC Coupling Capacitors in PCIe Routing

Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.

Tuning dialog
Blog
Altium Designer 22.7 Update

We are happy to announce that the Altium Designer 22.7 update is now available. Altium Designer 22.7 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

The Positive Impact of Supply Chain Visibility on Design to Cost
Blog
The Positive Impact of Supply Chain Visibility on Design to Cost

Design to cost is a lofty idea that is only perfectly executed when supply and demand for components are in perfect harmony. Unfortunately, the current landscape for component sourcing makes design to cost more of a balancing act rather than an exercise in price reduction. To help designers in their efforts to balance cost, capabilities, and procurement, we created this ebook to help users understand how modern supply chain tools can help in these complex design problems.

Evaluating Stubs on PCIe Lanes
Blog
A Brief Study of Stubs on a PCIe Connector

Stubs are an important topic in high-speed PCB design, and there is a longstanding guideline that stubs should always be removed from all vias on high-speed digital interconnects. While stubs are bad for high-speed lines, they do not always need to be removed. What is more important is to predict the loss profile and frequencies, and to floorplan appropriately to try and prevent such losses.

Surface Layer DFM and Cleanup
Blog
PCB Layout Cleanup Before Manufacturing

Once you finish your placement and routing in your PCB layout, it can be tempting to wrap up the layout and send everything in directly to manufacturing. The reality is that the board may still need some work before it is considered finished. The cleanup you perform at the final stage of PCB layout will help you catch any outstanding errors that can't be programmed into your DRC engine, and it gives you a chance to add any outstanding details to the surface layers.

Low Cost and Professionally Built LED Panel
Blog
Insulated Metal Substrates: Building an LED Panel

In this project we’ll be building a moderate sized LED panel on insulated metal substrate (IMS). This light panel has three different white balance High CRI LED types on it, warm, neutral and cool. By changing the brightness of the different white balances, the light from the panel can be adjusted to match other lighting, making it perfect for film use - but also creating perfect lighting for electronics work. As with all my projects, this LED panel is open source, you can find the Altium project files over on my GitHub released under the permissive MIT License.

DFM For Your Materials
Blog
DFM in PCB Material Selection

Every design should begin with selecting the materials that will appear in the PCB stackup, as well as arranging layers in the stackup to support layout and routing. This section of our PCB manufacturing andc DFM crash course focuses on selecting the right materials for your PCB design. Materials should be selected given the particular design requirements outlined in your specifications.

PCB Layout for an BGA
Blog
How to Start an FPGA PCB Layout For Your Embedded System

FPGAs come in quad or BGA packages that can be difficult to floorplan, especially with the high number of I/Os often implemented in these components. FPGAs offer a lot of advantages in terms of their reconfigurability, but they can require a lot of effort to layout and route without headaches. If you’ve never worked with an FPGA in your PCB layout, we have some guidelines that can help you get started.

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NEW
Embedded thumbnail for Just Released: Supplier Data Merging
New in Altium's Software
Just Released: Supplier Data Merging

Discover how the Supplier Data Merging feature brings together supplier information from your custom parts database and the Altium Parts Provider into a single, unified view. Access consolidated supplier data wherever supplier part numbers appear, including in ActiveBOM and during component selection.

NEW
Embedded thumbnail for How Altium’s Layer Stack Manager Actually Works
How-To's
How Altium’s Layer Stack Manager Actually Works

Take a look inside Altium's Layer Stack Manager and discover how its impedance calculator determines the ideal trace width for your target impedance. In this video, we break down the "black box" behind the calculation and show how the Simbeor-based field solver provides accurate results while eliminating the need for advanced field solver expertise.

Embedded thumbnail for Connect Requirements Directly to Your PCB Design
New in Altium's Software
Connect Requirements Directly to Your PCB Design

See how the Requirements Portal integration in Altium Designer simplifies requirements management by bringing system requirements directly into your PCB design workflow. Connect requirements to design documents, assign tasks, track verification in real time, and keep your entire team aligned with seamless synchronization in Altium 365.

Embedded thumbnail for SFP Connector Routing: High-Speed Differential Pair Design Tips
How-To's
SFP Connector Routing: High-Speed Differential Pair Design Tips

Discover practical SFP and SFP+ routing tips in our latest video, inspired by a real question from the Altium subreddit. We cover how aggressive serpentine length tuning can be, how to reduce impedance discontinuities in tight meanders, and how meandering influences mode conversion at 10G and higher data rates.

Embedded thumbnail for Handle High-Density PCB Layouts with Ease
New in Altium's Software
Handle High-Density PCB Layouts with Ease

Push the limits of PCB design with support for up to 128 signal layers, empowering the development of even the most complex, high-density boards.

Embedded thumbnail for Skip Layer Routing for RF: Control Impedance & Cut Insertion Loss
How-To's
Skip Layer Routing for RF: Control Impedance & Cut Insertion Loss

Discover our latest video and learn how RF designers use a deeper ground plane to minimize skin-effect resistance, improve signal integrity over long high-frequency routes, and optimize impedance matching for oversized SMT pads in antenna launches and coaxial connectors.

Embedded thumbnail for Just Released: ODB++ Intellectual Property Protection
New in Altium's Software
Just Released: ODB++ Intellectual Property Protection

ODB++ Intellectual Property Protection lets you control exactly what design data is included in the ODB++ output, ensuring each manufacturing partner receives only the information needed for their specific fabrication or assembly tasks.

Embedded thumbnail for Future of Electronics Development in Security and Aerospace
How-To's
Future of Electronics Development in Security and Aerospace

See the highlights from Altium's executive event in Hamburg, where Security and Aerospace leaders explored AI-driven development, digital engineering, supply chain resilience, and the future of mission-critical electronics.

Embedded thumbnail for Create Clearance Rules Faster and with Less Effort
New in Altium's Software
Create Clearance Rules Faster and with Less Effort

Setting up clearance rules is now more intuitive in the Constraint Manager. Choose the Simple view for faster configuration with grouped object types, or the Advanced view when you need detailed, matrix-based clearance control.

Embedded thumbnail for Mastering HDI Design Rules in Altium Designer
How-To's
Mastering HDI Design Rules in Altium Designer

In our latest Altium Academy tutorial, we guide you through configuring the essential HDI PCB design rules in Altium's software. You'll learn how to use your manufacturer's fabrication capabilities to create accurate design rules and constraints for your PCB.

Embedded thumbnail for Search, Filter, and Navigate PCB Designs Faster
New in Altium's Software
Search, Filter, and Navigate PCB Designs Faster

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

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