News & Updates

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design.

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically.
This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.

Going deeper into crosstalk, there is always the issue of verifying EMI/EMC compliance through test and measurement. With the multitude of signal integrity problems that can arise in real PCBs, how can the astute designer distinguish them all? Some problems are clearer than others, with specific signal integrity measurements being developed for testing and measuring particular aspects of signal behavior. The fact is, multiple signal integrity problems could be present on a single interconnect simultaneously.

Once you’ve finished your new project and you’re ready to push it to your manufacturer, you’ll normally be stuck in an endless email chain with an engineer, or you’ll have to share cloud links with each other. The cloud sharing and design release tools in Altium Designer and Altium Concord Pro are a huge help in this area. In this post, I’m going to take an existing project I’ve worked with in a number of recent blogs, create some fabrication and assembly documentation, and finally push this data to a manufacturer using Altium Concord Pro.

To this day, I still see many PCB layout “rules of thumb” that first became common nearly 20 years ago. Do these rules still universally apply? The answer is a firm “maybe.” The discussion around PCB layout rules of thumb is not that these rules are correct or incorrect. The problem is that the discussion around these rules often lacks context, leading to the always/never type of discussion seen in some popular forums. My goal in this article is to communicate the context behind the common PCB design rules.

As the operating speed of components has increased, controlled impedance is becoming more common in digital, analog, and mixed-signal systems. If the controlled impedance value for an interconnect is incorrect, it can be very difficult to identify this problem during an in-circuit test. However, testing is normally performed on a PCB test coupon, which is manufactured on the same panel as the PCB. If you want to get through board spins quickly and aid future designs, you might consider designing a test coupon and keeping it handy for future designs.

Altium’s DbLib support is one of the oldest and most loved features of Altium Designer for managing electronic components and their data. They’ve been present in the software world since before I could fathom the existence of Ohm’s law. Altium 20.1’s new Component Sync feature allows you to synchronize virtually any database or database Library with Altium 365, taking advantage of both approaches strengths.

If you’ve created your next great schematic, there is a lot going on behind the scenes in your design software. A schematic netlist is one of the central pieces of information that will be used in multiple features in your design software to create a real PCB. Your schematic netlist provides both electrical connectivity information, and reflects the functional structure of your design data in a single set of data.

An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.

GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.

The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.

Get Started with Altium 365 with a step-by-step guide and videos to experience the most connected experience for PCB design and realization: https://my.altium.com/altium-365/getting-started/

One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.

Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?

Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.

When some designers start talking materials, they probably default to FR4 laminates. The reality is there are many FR4 materials, each with relatively similar structure and a range of material property values. Designs on FR4 are quite different from those encountered at the low GHz range and mmWave frequencies. So what exactly changes at high frequencies, and what makes these materials different? To see just what makes a specific laminate useful as an RF PCB material, take a look at our guide below.

In today’s fast-paced world where iterations of electronics are spun at lightning speeds, we often forget one of the most critical aspects of development: testing. Even if we have that fancy test team, are we really able to utilize them for every modification, every small and insignificant change that we make to our prototypes? In this article, we will review a very low cost, yet highly effective and quite exhaustive test system that will get you that bang for your buck that you’ve been looking for.

If you’ve ever looked at the BOM for a reference design or an open-source project, you may have seen a comment in some of the entries in your BOM. This comment is either “DNP” or “DNI”. If you think about it, every component placed in the PCB requires some level of placement and routing effort, which takes time and money if you’re working for a client. This begs the question, why would anyone design a board with components they don’t plan to include in the final assembly?

When it’s time to share your design data with your manufacturer, it’s like taking a leap of faith. Sending off a complete documentation package might seem as easy as placing your fab files in a zip folder, but there are better ways to ensure your manufacturer understands your project and has access to all your design data. For Altium Designer users, there are multiple options for creating and packaging release data into a complete package for your manufacturers.

If you’re designing a circuit board to be powered by anything except a bench-top regulated power supply, you’ll need to select a power regulator to place on your board. Just like any other component, your regulator has stated operating specs you’ll see in a product summary, and it has more detailed specs you’ll find in a datasheet. The fine details in your datasheets are easy to overlook, but they are the major factors that determine how your component will interact with the rest of your system.

It would be nice if the power that came from the wall was truly noise-free. Unfortunately, this is not the case, and although a power system can appear to output a clean sine wave, zooming into an oscilloscope trace or using an FFT will tell you a different story. When you take "dirty" power, put it through rectification, and then pass it through a switching regulator, you introduce additional noise into the system that further degrades power quality. If you’re a power supply or power systems designer, then you know the value of supplying your devices with clean, noise-free power.

If you’re an electronics designer or you’re just beginning your career as an engineer, the PCB stackup is probably one of the last things you’ll think about. Simple items like PCB copper thickness and board thickness can get pushed to the back burner, but you’ll need to think about these two points for many applications as not every board will be fabricated on a standard 1.57 mm two-layer PCB

I often get questions from designers asking about things like signal integrity and power integrity, and this most recent question forced me to think about some basic routing practices near planes and copper pour. "Is it okay to route signal traces on the same layer as power planes? I’ve seen some stackup guidelines that suggest this is fine, but no one provides solid advice." Once again, we have a great example of a long-standing design guideline without enough context.

Electronics schematics form the foundation of your design data, and the rest of your design documents will build off of your schematic. If you’ve ever worked through a design and made changes to the schematic, then you’re probably aware of the synchronization you need to maintain with the PCB layout. At the center of it all is an important set of data about your components: your schematic netlist. What’s important for designers is to know how the netlist defines connections between different components and schematics in a large project.

There are plenty of PCB manufacturing services you can find online, and they can all start to blend together. If you’re searching for a new service provider, it can be hard to compare all of them and find the best manufacturer that meets your needs. While experienced designers can spot bogus manufacturers from afar, there is always a temptation to go with the lowest priced, supposedly fastest overseas company you can find. However, there is a lot more that should go into choosing a PCB manufacturing service than just price.

Pi Filters are a type of passive filter that gets its name from the arrangement of the three constituent components in the shape of the Greek letter Pi (π). Pi filters can be designed as either low pass or high pass filters, depending on the components used. The low-pass filter used for power supply filtering is formed from an inductor in series between the input and output with two capacitors, one across the input and the other across the output. Keep reading to learn more about their application in the PCB Design.

The first question that should come up when selecting materials and planning a stackup is: what materials are needed and how many layers should be used? Assuming you’ve determined you need a low-loss laminate and you’ve determined your required layer count, it’s time to consider whether you should use a hybrid stackup. There are a few broad situations where you could consider using a hybrid stackup with low-loss laminates in your PCB

Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.