News & Updates
The PCB supply chain encompasses multiple components, raw materials, and the PCB itself. PCBs and PCB assemblies are often the most technically complex components that are purchased for electronic assemblies and products. The complexity of modern PCBs leads to several challenges for a supply chain management team that may be significantly different when compared with other commodities the team manages. In this brief guide, we'll look in-depth at the PCB supply chain, and specifically what falls within the purview of a procurement and supply chain management team.
On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.
There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.
Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.
As component pitch decreases, even small manufacturing variations can consume a significant portion of the available design margin. This article explains how tolerance stacking, solder paste deposition, inspection limitations, and rework challenges can affect assembly reliability in Ultra HDI designs.
Design review automation helps teams spend less time managing feedback and more time improving the design. This article explores how centralized comments, structured checklists, action tracking, and approval workflows can make reviews faster, more consistent, and easier to close.
This article compares flex and rigid-flex PCBs across key design and manufacturing considerations, including cost, bend radius, impedance, and assembly complexity. It explains how choosing the right construction early can help reduce design risks and ensure better manufacturability.
Security shouldn't be the reason your engineering team slows down. This article explores how cloud-based design platforms can turn secure access, governance, and IP protection into an enabler of faster collaboration rather than another development bottleneck.
The right PCB assembly outputs turn a finished design into a buildable product. This article covers the essential manufacturing files and DFA considerations that help ensure assemblers have the information they need for accurate, reliable production.
This webinar explores how engineering leaders can gain greater visibility and control across complex electronic design workflows. Discover how connected processes and centralized design data help teams reduce risk, improve collaboration, and deliver projects on time.
Product variations often require different component populations, alternate parts, or configuration settings while keeping the underlying PCB design unchanged. This article explains how structured variant management keeps these differences organized and ensures each configuration has the correct BOM and manufacturing outputs.
Preventing DFM problems starts before fabrication not during the fab review. This article covers eight common PCB manufacturing issues and the design rules that help engineers identify and resolve them early.
Different CAD tools shouldn't mean disconnected teams. Learn how Multi-CAD workflows help engineers review designs, collaborate across disciplines, and catch mechanical or sourcing issues before they become costly redesigns.
This article explores how manufacturing-driven design can help teams validate multiboard products before they reach the factory. It highlights how early checks of interconnects, harnesses, mechanical fit, sourcing, and manufacturing data can reduce late-stage changes and accelerate production readiness.
Automated design sign-offs can eliminate much of the administrative friction surrounding hardware approvals. This article explores how in-context reviews, structured workflows, and automated traceability help teams accelerate release cycles while maintaining control.
Flexible circuits introduce unique assembly challenges that aren't always visible during PCB design, from panel instability and component movement to thermal distortion during reflow. This article explains how design decisions around stiffeners, placement, panelization, and materials can improve assembly yield and reduce costly rework.
Fixing one design problem can sometimes create another you didn't see coming. This article uses the S-80 submarine program to show how better requirements traceability can help teams spot hidden impacts before they turn into expensive rework.
A BOM is only valuable if everyone can trust the data it contains. This article shows how connected BOM management helps teams eliminate errors, improve collaboration, and keep fast-moving hardware projects on schedule.
PCB design rules are the foundation of every successful layout. This article explores how defining and managing constraints helps engineers improve design accuracy, simplify verification, and deliver manufacturing-ready PCBs with confidence.
Great products are built by connected teams, not disconnected tools. This article shows how cloud ECAD platforms enable real-time co-design, structured design reviews, and seamless collaboration across engineering, manufacturing, and supply chain teams.