News & Updates
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An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.
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GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.
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The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.
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Get Started with Altium 365 with a step-by-step guide and videos to experience the most connected experience for PCB design and realization: https://my.altium.com/altium-365/getting-started/
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Since its introduction in the late 90s, the USB standard has never ceased to grow in popularity. There has been a growing trend toward USB being a power delivery interface with data, rather than a data interface that can supply power, as the 1.0 specification originally intended. To supply the increasing thirst for power over USB, the USB 3.0 Spec with Type-C began implementing the Power Delivery standard, which you should consider using for your next electronics project.
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There are many types of circuit board tests available in electronics manufacturing today, each having unique goals and characteristics. This article presents guidelines at the design level (schematic and layout) to enable the use of in-circuit testing (ICT) fixtures to verify proper component assembly. These simple test fixtures allow your board to be tested as its assembled, which helps identify and remove failed boards from your production run.
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Technological advancements have been a hallmark of the past few decades, from the widespread adoption of internet technology to the smartphones and wireless devices we rely on every day to stay connected. Orlan Thatcher, Board Layout Specialist at Cirris Systems, could never have predicted the demand their services would generate. The company struggled with six different software platforms before switching to Altium Designer.
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I used to work in a research lab that worked primarily with RFID (Radio Frequency IDentification) and NFC (Near Field Communication) technology, particularly for the agriculture industry and cattle identification. These were very specialized fields; however, the lab also worked on projects which involved retail and various other applications for NFC. It’s an amazing technology that you might be using every day without thinking about it - building access to your mobile phone payments, for instance.
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You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically. This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.
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In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes.
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There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.
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Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.
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Every piece of electronic equipment starts with a great idea. Transforming great ideas into real, physical products takes a team of talented individuals and multiple companies coming together to make everything from the internal components to the external hardware. Paul Payen de la Garanderie, Founder and Owner of AW Audio, an engineering services company based in France, understands these challenges very well. With an extensive background in the Audio/Visual industry, Paul has had to work with multiple companies over the years, from small start-ups to celebrated AV firms.
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At this time, at least a quarter of the world’s population is under quarantine, with workers unable to go to offices or factories, leading to fundamental disabling of the world economy. The electronics industry is suffering greatly as well, dealing with a supply shock from factories shutting down in Southeast Asia, to demand-side shocks from Western markets literally shutting down. Now it is the electrical engineers taking the lead with additive PCB manufacturing.
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Altium 365 provides a secure cloud platform to store all of your design files in a single place so you can share them with anyone and access them from anywhere. This webinar discusses the advantages of placing, storing, and working with projects in Altium 365.
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I just finalized my first PCB design using Altium Designer 20. At the same time, I tested some new AD20 features, and in this article, I’ll share my thoughts about new layout design features which made the biggest impression for me: sliding, and any-angle routing.
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Anyone who has taken apart an old cell phone or designs IoT devices knows multiple communication capabilities are present in these designs, each requiring different antennas. The RF designer should already take precautions for interconnect isolation, but antenna isolation is just as important when modeling and designing wireless systems.
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High voltage/high current designs carry safety requirements which need to be met by designers. Similarly, high speed designs need to have suppressed crosstalk in order to ensure signal integrity. The key design aspects that relate to both areas are your PCB trace clearance and pad clearance values. These design choices are critical for balancing safety, noise suppression, and manufacturability.
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As the first article in the "Mastering EMI Control in PCB Design" series from our new asset Dario Fresu, this piece explores signal propagation in PCBs, highlighting the crucial roles of impedance, dielectric materials, and trace geometry in maintaining signal integrity.
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Discover essential strategies for high-speed PCB design, focusing on signal integrity, EMI mitigation, and thermal management. Our latest article provides insights on managing crosstalk, optimizing grounding, and addressing thermal challenges to ensure reliable PCB performance.
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Designing microvias with sintered paste in rigid-flex PCBs offers enhanced electrical conductivity and mechanical strength, crucial for high-density applications. Our new article explores the benefits of sintered paste and provides essential design tips to optimize microvia performance and reliability.
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Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.
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Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.
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High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.
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Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.
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Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.
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We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.
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Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.
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Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.
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High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.
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Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.
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Curious about the intersection of mechanical and electrical design? Both are crucial in the PCB design process, especially for multi-board systems. Read our latest article to learn how ECAD and MCAD can address significant challenges during PCB preparation.
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Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
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Automated measurements are no longer tough. With our Mixed Simulation mode, everything is easier. Learn more about this feature based on DC-DC buck converter design in this brand new article.