News & Updates
On-Demand Webinar
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What is High-Speed Design?
The primary source of high-speed problems is not due to high clock frequency but rather the fast rise and fall times of component signals. With fast edge rates, reflections may occur at the receiver side, and when the board routing is dense, crosstalk may become a problem. During this webinar, you'll sharpen your knowledge and develop new skills that you can use to design High-Speed PCB's more efficiently and effectively.
Blog
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Should You Use Power MOSFETs in Series?
Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.
Blog
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Controlled ESR Capacitors: Should You Use Them for Power Integrity?
I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?
Blog
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Microstrip Ground Clearance Part 2: How Clearance Affects Losses
If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.
On-Demand Webinar
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What is High-Speed Design?
The primary source of high-speed problems is not due to high clock frequency but rather the fast rise and fall times of component signals. With fast edge rates, reflections may occur at the receiver side, and when the board routing is dense, crosstalk may become a problem. During this webinar, you'll sharpen your knowledge and develop new skills that you can use to design High-Speed PCB's more efficiently and effectively.
Blog
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Choosing the Right Microphone for Embedded Applications
If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.
Blog
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Composite Amplifiers and How They Give the Best of Both Worlds
There are many times where you need an amplifier with high gain, low noise, high slew rate, and broad bandwidth simultaneously. However, not all of these design goals are possible with all off-the-shelf components. Here are some points to consider when working with a composite amplifier design and how to evaluate your design with the right set of circuit simulation tools.
Blog
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Reduce Common-Mode Noise in Your Power Supply with Impedance Balancing
Simple switching regulator circuits that operate in compact spaces, like on a small PCB, can usually be deployed in noisy environments without superimposing significant noise on the output power level. As long as you lay out the board properly, you’ll probably only need a simple filter circuit to remove EMI on the inputs and outputs. As the regulator becomes larger, both physically and electrically, noise problems can become much more apparent, namely radiated EMI and conducted EMI in the PCB layout.
Blog
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Part 1: Why Your PCB Design Review Process Is Obsolete and What You Can Do About It
A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.
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Part 2: Why Your PCB Design Review Process Is Obsolete and What You Can Do About It
As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.
Blog
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What is PCB Star Grounding and Why Would Anyone Use It?
If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.
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Your Guide to PCB Silkscreen
Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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How ECAD-MCAD Co-Design Supports Aerospace Reliability and Compliance
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
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Most Common Causes of PCB Assembly Rework and Scrap
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
Blog
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Behind the Scenes with AI Embedded Development
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
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We're heading to PCB West 2025!
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
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Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools
Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.
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How to Catch Enclosure and Connector Misalignment Before the First Prototype
As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.
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Executive Insights Into Electronic Product Development Gaps You Need To Close
Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.
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Sourcing For High-Mix Low-Volume Electronics Manufacturing
High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.
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