News & Updates
By now, designers should be aware of some important behavior involved in power delivery to components in a PCB, particularly for digital components. All digital components produce and manipulate wideband signals, where the frequency content theoretically extends up to infinite frequency. As such, some radiation may propagate through your PCB, leading to resonant behavior that is not observed on the power rail.
Once your board passes through the standard PCB fabrication process, the bare copper in your PCB will be ready for the application of a surface finish. PCB plating is applied to protect any copper in your PCB that would be exposed through the solder mask, whether it’s a pad, via, or other conductive element. In this article, I’ll run over the different PCB plating material options and their advantages in your PCB.
The PCB supply chain encompasses multiple components, raw materials, and the PCB itself. PCBs and PCB assemblies are often the most technically complex components that are purchased for electronic assemblies and products. The complexity of modern PCBs leads to several challenges for a supply chain management team that may be significantly different when compared with other commodities the team manages. In this brief guide, we'll look in-depth at the PCB supply chain, and specifically what falls within the purview of a procurement and supply chain management team.
On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.
There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.
Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.
Every manual handoff adds time and risk to the product development process. This article shows how modern design workflows automate routine tasks, improve data visibility, and help engineering teams focus on innovation instead of administration.
Your signal may be perfect on the PCB and fail the moment it crosses a connector. This article explores the hidden SI challenges in multi-board systems and how engineers can eliminate them before they become costly debugging sessions.
Still building BOMs the hard way? Discover how modern workflows can help you create a prototype-ready BOM faster while improving visibility into pricing, availability, and risk.
This article examines the challenges of maintaining power integrity and controlling EMI in complex multiboard systems. It provides practical strategies for managing return paths, connector transitions, and power distribution across interconnected assemblies.
Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.
Agile hardware development isn’t just about working faster, it’s about working together in real time. This article explores how shared environments for ECAD, MCAD, sourcing, and requirements management eliminate handoff delays and improve decision-making across teams.
Verification becomes much easier when requirements and system performance data stay connected automatically. This article explains how reusable parameters and V&V rules help teams detect violations earlier and validate designs with greater confidence.
This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.
Complex multiboard designs demand more than just connecting boards together. They require every interface to work flawlessly under real-world conditions. Discover how better pin assignments, return paths, and mechanical planning can dramatically improve reliability and reduce rework.
Engineering and sourcing teams work best when BOM decisions happen with live market data in view. This article explains how integrated cost and availability insights help teams collaborate earlier and avoid redesigns driven by supply chain issues.
Poor ECAD-MCAD coordination often leads to enclosure conflicts, connector misalignment, and costly redesigns. This article shows how integrated collaboration helps teams catch manufacturability issues earlier and keep projects moving smoothly.