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All About PCB Test Points
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Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

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How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

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How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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6-Layer PCB Design
Blog
6-Layer PCB Design Guidelines

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.

Altium Designer Interface
Blog
Altium Designer 22.5 Update

We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Are Hybrid PCB Stackups Reliable?
Blog
How Reliable is Your Hybrid PCB Stackup?

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.

Monte Carlo vs Sensitivity Analysis
Blog
Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.

Simulation, Build and Test
Blog
Creating Continuous Integration Pipelines for FPGAs

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.

Collaborators Visualization
Blog
Soft Locks [Conflict Prevention] in Altium 365

Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully

Guide to Monte Carlo in SPICE
Blog
The Basics of Monte Carlo in SPICE: Theory and Demo

Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?

BGA Land Patterns and Footprints
Blog
What's In Your BGA Land Pattern and Footprint

If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.

Molded Interconnect Devices
Blog
MIDs Make a Comeback as Vertical SMD Modules for Your PCB

Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.

MCAD CoDesign Process
Blog
MCAD CoDesigner 2.9.0 is Out

Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.

Rigid-Flex in Altium Designer
Blog
Support for Rigid-Flex in Altium Designer

Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

2+N+2 PCB Stackups
Blog
2+N+2 PCB Stackup Design for HDI Boards

Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.

PDF Viewer in Altium 365
Blog
PDF in Altium 365 Web Viewer

Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier

Rigid-Flex Applications
Blog
Flex and Rigid-Flex PCB Applications

There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits

Sharing Settings in Altium 365
Blog
Granular Sharing — Role and Group Management

With Altium 365, you can grant permission to teams or users based on the specific needs of a project. We have expanded Altium 365’s file-sharing setting, giving you more granular control over who can download source files and reshare projects with others

Use your DRCs
Blog
Design Rule Checking in the PCB Design Workflow

Any time you design a PCB, and you want to turn it into a real product, you will have to make sure the design obeys the constraints within the standard PCB manufacturing process. This imposes multiple rules on any design, and ECAD software will enforce design rules as you create the board to ensure you obey these important constraints. Make sure you enforce the right design rules at the beginning of the PCB design workflow 

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Embedded thumbnail for NFC Reader Project Part One: Schematics to PCB in Altium
How-To's
NFC Reader Project Part One: Schematics to PCB in Altium

Check out our new, in-depth NFC Reader Project tutorial! In this two-part video series, we design an ESP32-based NFC transceiver board from schematics to PCB layout. In Part 1, we dive into the TRF7970A NFC chip from Texas Instruments and guide you step-by-step through the complete design process in Altium.

Embedded thumbnail for HDI PCB Design Review: nRF52840 Via Sizing & Stack-Up Best Practices
How-To's
HDI PCB Design Review: nRF52840 Via Sizing & Stack-Up Best Practices

Explore key HDI design strategies, from calculating aspect ratios and optimizing pad diameters to managing drill tolerances and refining stack-ups for improved signal integrity. This comprehensive review highlights practical solutions to common HDI challenges, including via-in-pad layouts, clearance violations, and layer thickness adjustments for both mechanical and laser drilling processes.

Embedded thumbnail for 13 Common PCB Problems & How to Fix Them in Altium
How-To's
13 Common PCB Problems & How to Fix Them in Altium

Stop wasting time on manufacturing rework. This guide shows you how to set up Altium’s design rules to prevent the 13 PCB issues that most often derail production ensuring your boards are built right the first time.

Embedded thumbnail for What's Inside Your MCU Module?
How-To's
What's Inside Your MCU Module?

Are you curious about what’s inside a microcontroller module? Join us as we take a closer look at the Texas Instruments CC3235 Wi-Fi module under the microscope. In this video, we’ll explore its key components, including the microcontroller, flash memory, and RF circuitry, and explain how they work together to power the module.

Embedded thumbnail for Arduino to Custom PCB: Professional Design Transformation
How-To's
Arduino to Custom PCB: Professional Design Transformation

Discover how to upgrade your Arduino Nano-based PCB design into a professional, custom PCB. This tutorial walks through the process of replacing development boards with individual components to create a production-ready design, using a real drone project as the example.

Embedded thumbnail for PCB Library Management: One Library or Many?
How-To's
PCB Library Management: One Library or Many?

This detailed guide walks you through the pros and cons of each approach and offers proven strategies for managing component data, whether you're an independent designer or overseeing libraries for an entire organization.

Embedded thumbnail for Coming Soon: Sawtooth Rounding Support for Length Tuning
New in Altium Designer 25
Coming Soon: Sawtooth Rounding Support for Length Tuning

Sawtooth Rounding for Length Tuning improves signal‑path accuracy by applying controlled corner‑rounding to sawtooth geometries during both Interactive Length Tuning and within‑pair matching in the Auto Tuning engine. Discover this capability and additional innovations on our Coming Soon page.

Embedded thumbnail for Coming Soon: Z-Axis Clearance Rule
New in Altium Designer 25
Coming Soon: Z-Axis Clearance Rule

The Z-Axis Clearance Rule checks the shortest distance between copper features on different layers in a PCB design. It is available in both the Constraint Manager and the legacy PCB Rules Editor. Discover more new features in Altium on our Coming Soon Page.

Embedded thumbnail for Coming Soon: Advanced Polygon Pour Engine
New in Altium Designer 25
Coming Soon: Advanced Polygon Pour Engine

Now supports true arcs instead of approximated curves in copper pours. This enhanced engine marks a major advancement in the polygon pour process in Altium Designer, delivering smoother and more accurate copper shapes. Native arc rendering improves visual quality and helps ensure cleaner, more professional PCB designs.

Embedded thumbnail for How to Design Rigid-Flex PCB Stackups from Scratch
How-To's
How to Design Rigid-Flex PCB Stackups from Scratch

Watch this tutorial to learn the fundamentals of Rigid-Flex design. We cover everything from understanding polyimide materials and adhesive layers to building complex, multi-layer Rigid-Flex constructions that are ready for manufacturing.

Embedded thumbnail for How to Draw Antipads - Complete Tutorial
How-To's
How to Draw Antipads - Complete Tutorial

Discover how to draw and define antipads in Altium with this complete tutorial. Learn three different methods for creating antipads around vias. From simple design rules to advanced polygon cutouts for both basic and complex PCB designs.

Embedded thumbnail for Do PCB Manufacturers Actually Look at Fabrication Drawings?
How-To's
Do PCB Manufacturers Actually Look at Fabrication Drawings?

Explore this in-depth tutorial featuring real fabrication drawings, stackup specifications, and drill tables - all created using Altium Designer’s Draftsman tool. Learn essential insights into PCB data management and manufacturing requirements from an industry perspective.

Embedded thumbnail for Compensating Transmission Line Losses in a PCB Calculator
How-To's
Compensating Transmission Line Losses in a PCB Calculator

This tutorial uncovers the key difference between ideal, lossless impedance calculations and real-world signal behavior giving you practical techniques to design controlled impedance PCBs that deliver reliable performance.

Embedded thumbnail for How Close Can You Bring a Reference Plane?
How-To's
How Close Can You Bring a Reference Plane?

Explore our in-depth investigation into practical simulations using both Altium Designer and Polar Si9000. We demonstrate impedance sensitivity analysis and reveal the real limitations of optimizing reference plane proximity for improved signal shielding.

Embedded thumbnail for Do PCB Thermal Vias Actually Work?
How-To's
Do PCB Thermal Vias Actually Work?

Are thermal vias really helping your PCB’s heat management? Tech Consultant Zach Peterson dives into simulation data, research, and a controversial article to uncover the truth. Learn why via count and spacing matter more than sheer quantity.

Embedded thumbnail for Stripline Routing Deep Dive: How Close Is Too Close?
How-To's
Stripline Routing Deep Dive: How Close Is Too Close?

In this video, Zach Peterson takes a deep dive into what happens when reference layers are incorrectly set in a PCB stackup and how that affects impedance, signal integrity, and EMC. He also shares valuable insights into stripline routing proximity issues and best practices for assigning reference planes.

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