News & Updates
Blog
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
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Creating Continuous Integration Pipelines for FPGAs
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
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Soft Locks [Conflict Prevention] in Altium 365
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
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The Basics of Monte Carlo in SPICE: Theory and Demo
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
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From Rework to Revenue: Digital PCB DFMA
This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.
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Introducing Octopart Discover: From Part Search to Solutions Discovery
Octopart has announced Octopart Discover, a new platform that shifts electronic component search toward system-level solution discovery. The tool connects design intent with relevant options, enabling engineers to evaluate tradeoffs and identify the best-fit solutions more efficiently.
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How to Choose the Right Components for Your BOM
A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.
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From Scattered Requirements to Confident Product Development
See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.
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What is the Best PCB Design Tool For Students?
Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.
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What Is Collaborative Engineering?
Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.
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Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan
Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.
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PCB Design Process: The EDA Design Approach
Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.
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Getting Started for Mechanical Engineers
Explore our collection of MCAD Collaboration walkthroughs, where you’ll discover how to synchronize mechanical constraints and keepouts, maintain traceability with advanced history and revision control, and streamline electromechanical connectivity through harness synchronization. These topics and many more are covered in this article.
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Are Your ECAD Tools Holding Back Engineers’ Productivity?
The article highlights that productivity issues often stem from tool limitations rather than engineer effort, especially as project complexity grows. ECAD tools that offer clear version control, cross-discipline integration, and workflow awareness are key to sustaining efficiency.
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How Integrated PCB Design Cuts Development Time for Complex Electronics
Fewer tool handoffs, fewer errors, and smoother collaboration that’s the power of integrated PCB design. Learn how unifying your design environment can cut development time and help you deliver complex electronics faster.
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Registration Challenges in UHDI: Why Fabrication Tolerances Matter in Your Layout
As UHDI structures shrink, achieving accurate layer-to-layer registration becomes less forgiving than ever. Learn why fabrication tolerances matter so much in ultra-fine geometries and how to design with registration limits in mind from the start.
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How Engineering Project Management Tools Are Changing Engineering Teams’ Productivity
Engineering project management tools play a critical role in managing timelines, resources, and cross-disciplinary coordination. This article breaks down the most impactful systems for improving execution and team performance.
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7 Ways to Catch Rules & Constraints Early – Checklist
Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.
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Do You Need an IPC-D-356 Netlist?
If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.
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How Agile BOM Management Helps You Lock in Pricing Before Market Shifts
When engineering and procurement work from different BOM versions, delays and cost surprises follow. Learn how agile BOM management brings teams onto one connected BOM so they can respond fast, manage risk, and lock pricing early.
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