News & Updates

I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?

If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.

The primary source of high-speed problems is not due to high clock frequency but rather the fast rise and fall times of component signals. With fast edge rates, reflections may occur at the receiver side, and when the board routing is dense, crosstalk may become a problem. During this webinar, you'll sharpen your knowledge and develop new skills that you can use to design High-Speed PCB's more efficiently and effectively.

If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.

There are many times where you need an amplifier with high gain, low noise, high slew rate, and broad bandwidth simultaneously. However, not all of these design goals are possible with all off-the-shelf components. Here are some points to consider when working with a composite amplifier design and how to evaluate your design with the right set of circuit simulation tools.

Simple switching regulator circuits that operate in compact spaces, like on a small PCB, can usually be deployed in noisy environments without superimposing significant noise on the output power level. As long as you lay out the board properly, you’ll probably only need a simple filter circuit to remove EMI on the inputs and outputs. As the regulator becomes larger, both physically and electrically, noise problems can become much more apparent, namely radiated EMI and conducted EMI in the PCB layout.

A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.

As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.

If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.

Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability

Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.

In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.

Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.

Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier

There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits

With Altium 365, you can grant permission to teams or users based on the specific needs of a project. We have expanded Altium 365’s file-sharing setting, giving you more granular control over who can download source files and reshare projects with others

Any time you design a PCB, and you want to turn it into a real product, you will have to make sure the design obeys the constraints within the standard PCB manufacturing process. This imposes multiple rules on any design, and ECAD software will enforce design rules as you create the board to ensure you obey these important constraints. Make sure you enforce the right design rules at the beginning of the PCB design workflow

High frequency PCB design can seem esoteric, and I've heard many an engineer describe it as "black magic"! The subject is also a bit confusing, especially once someone asks which frequencies could be reasonably considered "high". Before you do anything inside the layout for a high-speed or RF PCB, you will need to pay attention to the materials being used in the board. If you're unsure which high frequency PCB materials you should use, then keep reading to learn more.

Of all the noise and operational challenges designers face in their PCBs, there is one overarching problem that is arguably most popular: electronic noise. It could originate as an SI/PI problem, it could possibly arise from some external source, or it could be good old-fashioned crosstalk! These tend to fall into three categories: adding shielding, doing something to create isolation, or placing filters. Let's look at all of these as they tend to be the default solution set when confronted with many noise problems.

In February, we hit a new record in the number of users on the platform. The Altium 365 user community is now 20,000 strong! You can now migrate from an external version control system to Altium 365 preserving the history of commits. We also received the SOC 2 Type 1 certification from KPMG, made layer stack available in the web viewer, and added the brand new capability to track tasks in the context of your design project. Keep reading to learn more!

Get a cohesive view of supply chain market conditions, stay on top of trends, and avoid disruption with this free, monthly report from Spectra.

Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Flex sections also need to be placed in the layer stack before moving into the PCB layout. Once inside the PCB editor, bending lines can be clearly defined in the PCB layout, and these can be visualized in Altium Designer's 3D PCB design tools. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

In the business of PCB design, communicating needs to manufacturers and vendors is a top priority. The context of our requests is sometimes lost either by not providing the correct information, not listing enough information, or not giving any information. Although the experienced PCB designer can take steps to specify everything they want to see in their PCB stackup, eventaully the manufacturer will handle that decision in an effort to balance available materials with processing capabilities and yield.

During the recent IPC APEX expo, there was a lot of discussion about SAP, or semi-additive PCB processes. As with any new technology adoption there were people that are excited to jump right in and start designing with much finer feature sizes and work through the inevitable changes to the traditional thought process. Others are in a "let’s wait and see" mode and of course there are a few skeptics there as well, so keep reading to learn more.

Parasitic extraction: the integrated circuit design community must grapple with this task on a daily basis, especially once gate features are reduced below ~350 nm and chips run at high switching speeds. The PCB community also has to deal with this idea in order to better design power delivery networks, interconnects with precise impedance, and properly quantify crosstalk and coupling mechanisms.

Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.

The use of ferrites in a PDN is one design recommendation that is fraught with unclear guidance and over-generalized recommendations. If you see an application note or a reference design that recommends placing a ferrite in a PDN, should you follow this in your specific design, or should you ignore this and focus on adding capacitance?