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Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

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Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Blog
Altium Designer: Leading the Charge in PCB Design Innovation

In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.

Blog
What Is Solder Mask Expansion and Which Value Should You Use?

Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.

Blog
Pi.MX8 Project - Board Layout Part 3

We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.

Blog
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

Blog
Make Sure to Clean Your No-Clean Flux

No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.

Blog
How to Design a Thermal Prototype PCB

Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.

Blog
DC-Aware Return Current in Mixed Signal PCBs

In this article, we will examine specific cases involving these types of components, where a very low-frequency signal or a DC signal needs to be measured, and the return path must be tracked to ensure the current loop is tight.

Blog
PCB Layout Replication: The Perfect Tool for Test Jigs

Replicate your circuits across multiple blocks with just a few clicks using a flawless preview pane, ensuring consistent, perfect results without the need for trial and error. Check out our new article on the PCB Layout Replication feature.

Altium 365 GovCloud Why We Chose AWS GovCloud (US) Cover
Blog
4 Reasons Why We Chose AWS GovCloud (US) for Altium 365 GovCloud

In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.

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Embedded thumbnail for Coming Soon: Sectional View
New in Altium Designer 24
Coming Soon: Sectional View

Discover more about our latest upgraded feature, premiering on December 13th. The Sectional View is a tool that simplifies and enhances your PCB design process. Whether you're troubleshooting complex designs or streamlining your workflow, it provides clarity and efficiency.

Embedded thumbnail for Coming Soon: Advanced Mixed Simulation Features
New in Altium Designer 24
Coming Soon: Advanced Mixed Simulation Features

We invite you to explore the world of mixed simulation. Delve deeper into key information about this feature and its enhanced functionalities, available starting December 13th. Set up mixed-signal simulations to ensure accuracy and reliability in your design testing

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New in Altium Designer 24
Coming Soon: Harness MCAD CoDesign

In this short video, you can explore how Harness MCAD CoDesign, available on the 13th of December, streamlines the design process by minimizing errors, accelerating iterations, and ensuring a synchronized development process. Altium Designer 24 is on the horizon, and it's not just a request but a requirement for optimizing your electronic design process.

Embedded thumbnail for Altium Designer 24: From Requested to Required
New in Altium Designer 24
Altium Designer 24: From Requested to Required

Altium Designer 24 is getting closer! In this short video, we are presenting a list of new features and improvements that will be available starting from the 13th of December in our software.

Embedded thumbnail for Coming Soon: Harness Multi-Board
How-To's
Coming Soon: Harness Multi-Board

Altium Designer's all-in-one approach to electronic design seamlessly combines Harness and Multi-Board Design capabilities, allowing you to create complex multi-board systems with ease. This new feature, available from December 13th, provides an opportunity to bring design and manufacturing teams together, inspiring a streamlined design process, reducing the risk of errors, and ensuring unwavering project deliveries.

Tackle Any Design Complexity With the Constraint Manager
What's New in 23.11
Tackle Any Design Complexity With the Constraint Manager

For enterprise and pro subscriptions, the new Constraint Manager offers a table-based interface, accessible from both Schematic and PCB, allowing you to define constraints more collaboratively. Engineers and stakeholders can collectively set design constraints with ease.

Tackle Any Design Complexity With the Constraint Manager
What's New in 23.11
使用约束管理器应对任何设计复杂性

对于企业版和专业版订阅用户,新约束管理器提供了基于表格的界面,无论从原理图还是 PCB 都可以访问,帮助您加强在约束定义方面的协作力度。工程师和协作者都可以轻松地共同设置设计约束。

Embedded thumbnail for Minimize Manual Effort With Automatic Length Tuning
What's New in 23.11
通过自动长度调整功能来减少手动操作

自动长度调整提供 2D 模式下的自动长度调整和延迟调整功能,可方便地从主布线菜单访问。该功能可以减少进行长度调整和延迟调整时通常需要的手动操作,从而加快设计进程。

Embedded thumbnail for Minimize Manual Effort With Automatic Length Tuning
What's New in 23.11
Minimize Manual Effort With Automatic Length Tuning

Automatic Length Tuning introduces automatic length and delay tuning functionality in 2D mode, accessed conveniently from the main Route menu. This feature reduces the manual effort typically associated with length and delay tuning, expediting your design process.

Embedded thumbnail for The Most Common 2-Layer PCB Design Mistakes and How To Avoid Them
How-To's
The Most Common 2-Layer PCB Design Mistakes and How To Avoid Them

Do you encounter issues when preparing a two-layer board? In this video, we address some of the most common mistakes made with this type of board and explain why upgrading to a four-layer board might be the solution you need.

Embedded thumbnail for Coming Soon: Ansys CoDesigner
How-To's
Coming Soon: Ansys CoDesigner

Ansys CoDesigner (which will be released on the13th of December) simplifies your design process by connecting ECAD and Simulation to eliminate manual export/import steps. With features like design change synchronization and commenting, Altium Designer ECAD engineers and Ansys Electronics Desktop (AEDT) SIM engineers can collaborate seamlessly in one workspace.

Embedded thumbnail for Coming Soon: Automatic Multi-Net Tuning
How-To's
Coming Soon: Automatic Multi-Net Tuning

Automatic Multi-Net Tuning enhances PCB design accuracy and efficiency by automatically adjusting multiple nets simultaneously to meet specific design rules, including length and delay. Learn more about this feature, which will be released on December 13th. Its flexibility enables effective work with differential pairs and traces at any angle. It not only identifies but also rectifies issues related to automatic length tuning, ensuring your designs adhere to key standards without the need for manual adjustments.

Embedded thumbnail for Coming Soon: PCB CoDesign
How-To's
Coming Soon: PCB CoDesign

PCB CoDesign makes it easier for everyone to work together and meet project deadlines. In Altium Designer 24, which is scheduled for release on December 13th, we are introducing a new feature. This feature optimizes your resources through a Git-like approach, allowing multiple team members to work simultaneously and commit changes to a master branch. This expedites the design process and lowers project costs.

Embedded thumbnail for Coming Soon: MultiBoard Draftsman
How-To's
Coming Soon: MultiBoard Draftsman

MultiBoard Draftsman enhances the efficiency of design reviews and assembly precision by offering a unified platform for detailed viewing and documentation of MultiBoard Designs. Discover more about this feature in our brand-new short video.

Embedded thumbnail for Coming Soon: PCB Layout Replication
How-To's
Coming Soon: PCB Layout Replication

PCB Layout Replication allows quick replication of layouts for repetitive circuitry blocks in a flat PCB design. In this short video we will show you how this new tool (scheduled for release on December 13th) eliminates the need to do repetitive tasks manually or for various workarounds like snippets or multi-channel designs.

Embedded thumbnail for Coming Soon: Constraint Manager
How-To's
Coming Soon: Constraint Manager

Constraint Manager simplifies PCB design by facilitating collaborative constraint definition from both Schematic and PCB. Learn more about this new feature, which streamlines the process of setting electrical clearances and creating rules while centralizing class management for time-saving convenience.

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