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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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NEW
Blog
Preparing for Prototype: Final Component Validation

Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.

Blog
Getting Started with Harness Design in Altium Designer 25

Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.

Blog
The Future of PCB Design Starts Here

Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.

Blog
Simplify Harness-to-System Connections for Better PCB Design Outcomes

Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.

Blog
Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design

This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications. 

Blog
New Routing Possibilities with Ultra HDI

Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.

Blog
3D-MID in Focus: Principles, Processes, and Practical Use

This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.

Blog
Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs

Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.

Blog
Mastering Component Templates in Altium Designer 25

Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.

Blog
Wire Harness Design Guide for Development and Manufacturing

Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.

Blog
Preparing for Medical Device Cybersecurity Assessments

Explore the key considerations and best practices for conducting cybersecurity assessments in medical device development. This article outlines how to identify potential threats, evaluate risks, and ensure compliance with evolving industry standards.

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Embedded thumbnail for Coming Soon: Harness MCAD CoDesign
New in Altium Designer 24
Coming Soon: Harness MCAD CoDesign

In this short video, you can explore how Harness MCAD CoDesign, available on the 13th of December, streamlines the design process by minimizing errors, accelerating iterations, and ensuring a synchronized development process. Altium Designer 24 is on the horizon, and it's not just a request but a requirement for optimizing your electronic design process.

Embedded thumbnail for Altium Designer 24: From Requested to Required
New in Altium Designer 24
Altium Designer 24: From Requested to Required

Altium Designer 24 is getting closer! In this short video, we are presenting a list of new features and improvements that will be available starting from the 13th of December in our software.

Embedded thumbnail for Coming Soon: Harness Multi-Board
How-To's
Coming Soon: Harness Multi-Board

Altium Designer's all-in-one approach to electronic design seamlessly combines Harness and Multi-Board Design capabilities, allowing you to create complex multi-board systems with ease. This new feature, available from December 13th, provides an opportunity to bring design and manufacturing teams together, inspiring a streamlined design process, reducing the risk of errors, and ensuring unwavering project deliveries.

Tackle Any Design Complexity With the Constraint Manager
What's New in 23.11
Tackle Any Design Complexity With the Constraint Manager

For enterprise and pro subscriptions, the new Constraint Manager offers a table-based interface, accessible from both Schematic and PCB, allowing you to define constraints more collaboratively. Engineers and stakeholders can collectively set design constraints with ease.

Tackle Any Design Complexity With the Constraint Manager
What's New in 23.11
使用约束管理器应对任何设计复杂性

对于企业版和专业版订阅用户,新约束管理器提供了基于表格的界面,无论从原理图还是 PCB 都可以访问,帮助您加强在约束定义方面的协作力度。工程师和协作者都可以轻松地共同设置设计约束。

Embedded thumbnail for Minimize Manual Effort With Automatic Length Tuning
What's New in 23.11
Minimize Manual Effort With Automatic Length Tuning

Automatic Length Tuning introduces automatic length and delay tuning functionality in 2D mode, accessed conveniently from the main Route menu. This feature reduces the manual effort typically associated with length and delay tuning, expediting your design process.

Embedded thumbnail for Minimize Manual Effort With Automatic Length Tuning
What's New in 23.11
通过自动长度调整功能来减少手动操作

自动长度调整提供 2D 模式下的自动长度调整和延迟调整功能,可方便地从主布线菜单访问。该功能可以减少进行长度调整和延迟调整时通常需要的手动操作,从而加快设计进程。

Embedded thumbnail for The Most Common 2-Layer PCB Design Mistakes and How To Avoid Them
How-To's
The Most Common 2-Layer PCB Design Mistakes and How To Avoid Them

Do you encounter issues when preparing a two-layer board? In this video, we address some of the most common mistakes made with this type of board and explain why upgrading to a four-layer board might be the solution you need.

Embedded thumbnail for Coming Soon: Ansys CoDesigner
How-To's
Coming Soon: Ansys CoDesigner

Ansys CoDesigner (which will be released on the13th of December) simplifies your design process by connecting ECAD and Simulation to eliminate manual export/import steps. With features like design change synchronization and commenting, Altium Designer ECAD engineers and Ansys Electronics Desktop (AEDT) SIM engineers can collaborate seamlessly in one workspace.

Embedded thumbnail for Coming Soon: Automatic Multi-Net Tuning
How-To's
Coming Soon: Automatic Multi-Net Tuning

Automatic Multi-Net Tuning enhances PCB design accuracy and efficiency by automatically adjusting multiple nets simultaneously to meet specific design rules, including length and delay. Learn more about this feature, which will be released on December 13th. Its flexibility enables effective work with differential pairs and traces at any angle. It not only identifies but also rectifies issues related to automatic length tuning, ensuring your designs adhere to key standards without the need for manual adjustments.

Embedded thumbnail for Coming Soon: PCB CoDesign
How-To's
Coming Soon: PCB CoDesign

PCB CoDesign makes it easier for everyone to work together and meet project deadlines. In Altium Designer 24, which is scheduled for release on December 13th, we are introducing a new feature. This feature optimizes your resources through a Git-like approach, allowing multiple team members to work simultaneously and commit changes to a master branch. This expedites the design process and lowers project costs.

Embedded thumbnail for Coming Soon: MultiBoard Draftsman
How-To's
Coming Soon: MultiBoard Draftsman

MultiBoard Draftsman enhances the efficiency of design reviews and assembly precision by offering a unified platform for detailed viewing and documentation of MultiBoard Designs. Discover more about this feature in our brand-new short video.

Embedded thumbnail for Coming Soon: PCB Layout Replication
How-To's
Coming Soon: PCB Layout Replication

PCB Layout Replication allows quick replication of layouts for repetitive circuitry blocks in a flat PCB design. In this short video we will show you how this new tool (scheduled for release on December 13th) eliminates the need to do repetitive tasks manually or for various workarounds like snippets or multi-channel designs.

Embedded thumbnail for Coming Soon: Constraint Manager
How-To's
Coming Soon: Constraint Manager

Constraint Manager simplifies PCB design by facilitating collaborative constraint definition from both Schematic and PCB. Learn more about this new feature, which streamlines the process of setting electrical clearances and creating rules while centralizing class management for time-saving convenience.

Embedded thumbnail for Debounce Circuit
Simulation in Altium Designer
Debounce Circuit

Learn how to simulate the circuit, identify a common issue, and walk through how to diagnose and correct any errors found in a seemingly well-designed debounce circuit. 

Embedded thumbnail for Import Component Footprints Faster with Altium Designer. Part II: Using an External Library, Internal IPC Compliant Footprint Wizard, and Datasheet-Based Creation
Import Component Footprints Faster with Altium Designer
Import Component Footprints Faster with Altium Designer. Part II: Using an External Library, Internal IPC Compliant Footprint Wizard, and Datasheet-Based Creation

In this video, we will guide you through three distinct manual component import methods; employing an external library, utilizing the internal IPC Compliant Footprint Wizard, or creating one yourself based on documentation.

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