News & Updates
Blog
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Should Ground Be Placed Below Inductors in Switching Regulators?
We love answering questions from our readers and YouTube viewers, and one of the recent questions we received relates to EMI from switching elements in a switching regulator is "Should a cutout be placed below the inductor in a switching regulator circuit?". Despite the variations in inductors and their magnetic behavior, there are some general principles that can be used to judge the effects of placing ground near inductors in switching regulator circuits. We’ll look at some of these principles in this article
Blog
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Altium Designer 22.6 Update
We are happy to announce that the Altium Designer 22.6 update is now available. Altium Designer 22.6 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Blog
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Join PCB Design Review Competition from Altium
Find 9 mistakes in a PCB design and get added into the lucky draw to win a prize from Altium!
On-Demand Webinar
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What’s New in Altium 365
Now you can assess your library’s health at a glance with the Library Health dashboard, view and share your bill of materials (BOM) and view and download PDF documents, all in your web browser. We improved the existing diff and compare features, and released a new version of MCAD CoDesigner. Register for the webinar to learn more!
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SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up
This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
On-Demand Webinar
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Rapidly Creating New Designs And Reusing Existing Ones
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
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What is the Impedance of Length-Tuning Structures?
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
NEW
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Introducing Octopart Discover: From Part Search to Solutions Discovery
Octopart has announced Octopart Discover, a new platform that shifts electronic component search toward system-level solution discovery. The tool connects design intent with relevant options, enabling engineers to evaluate tradeoffs and identify the best-fit solutions more efficiently.
NEW
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How to Choose the Right Components for Your BOM
A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.
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From Scattered Requirements to Confident Product Development
See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.
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What is the Best PCB Design Tool For Students?
Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.
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What Is Collaborative Engineering?
Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.
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Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan
Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.
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PCB Design Process: The EDA Design Approach
Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.
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Getting Started for Mechanical Engineers
Explore our collection of MCAD Collaboration walkthroughs, where you’ll discover how to synchronize mechanical constraints and keepouts, maintain traceability with advanced history and revision control, and streamline electromechanical connectivity through harness synchronization. These topics and many more are covered in this article.
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Are Your ECAD Tools Holding Back Engineers’ Productivity?
The article highlights that productivity issues often stem from tool limitations rather than engineer effort, especially as project complexity grows. ECAD tools that offer clear version control, cross-discipline integration, and workflow awareness are key to sustaining efficiency.
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How Integrated PCB Design Cuts Development Time for Complex Electronics
Fewer tool handoffs, fewer errors, and smoother collaboration that’s the power of integrated PCB design. Learn how unifying your design environment can cut development time and help you deliver complex electronics faster.
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Registration Challenges in UHDI: Why Fabrication Tolerances Matter in Your Layout
As UHDI structures shrink, achieving accurate layer-to-layer registration becomes less forgiving than ever. Learn why fabrication tolerances matter so much in ultra-fine geometries and how to design with registration limits in mind from the start.
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How Engineering Project Management Tools Are Changing Engineering Teams’ Productivity
Engineering project management tools play a critical role in managing timelines, resources, and cross-disciplinary coordination. This article breaks down the most impactful systems for improving execution and team performance.
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7 Ways to Catch Rules & Constraints Early – Checklist
Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.
Blog
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Do You Need an IPC-D-356 Netlist?
If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.
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How Agile BOM Management Helps You Lock in Pricing Before Market Shifts
When engineering and procurement work from different BOM versions, delays and cost surprises follow. Learn how agile BOM management brings teams onto one connected BOM so they can respond fast, manage risk, and lock pricing early.
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Flexible Circuits: Enhancing Performance with Shielding, Heat Dissipation, and Stiffeners
A flex circuit can look perfect on paper and still fail in the real world due to EMI, hot spots, or mechanical strain. This article breaks down how shielding, thermal planning, and stiffeners help deliver designs that stay reliable over time.
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