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Using Altium 365 Over Your Vanilla Version Control System
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Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

Embedded thumbnail for How to Work with The Polygon Manager
Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Tag
Blog
PCB Trace and Pad Clearance: Low vs. High Voltage

High voltage/high current designs carry safety requirements which need to be met by designers. Similarly, high speed designs need to have suppressed crosstalk in order to ensure signal integrity. The key design aspects that relate to both areas are your PCB trace clearance and pad clearance values. These design choices are critical for balancing safety, noise suppression, and manufacturability.

Blog
Getting Through PCB DFM

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some DFM process pain.

Altium Designer Getting Started User Guide
Blog
Level Up Your Design Skills - Altium Designer Getting Started User Guide Update
We are happy to announce the new update of our Altium Designer Getting Started User Guide. Whether you are new to Altium Designer or you want to brush up on some topics, the Altium Designer Getting Started User Guide will take you from a beginner to a master in PCB design.  This is only the beginning! This guide will be updated with new information based on user feedback. Let’s first go over the contents of the guide.
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Blog
Modeling Copper Foil Roughness in Altium Designer's Impedance Profiler

With the new layer stack manager in Altium Designer®, you can now include copper foil roughness factors directly in your impedance calculator. This is quite easy to do in the layer stack manager, but it begs the question: what exactly is the copper roughness factor? Which value should be used for your interconnects?

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Blog
High-Speed Signal Routing: The 5 Important Constraints

After you capture your schematic as an initial layout and create an initial component arrangement, it’s time to define your routing constraints. Doing this early will allow your DRC engine to spot rules violations before you finish your layout. Likewise, you’ll be able to modify the default rule set to meet your layout requirements. Here are the important routing constraints you’ll need to check before you start routing your board.

Blog
How to Create a PCB Manufacturing Cost Estimation

Some manufacturers have very convenient PCB manufacturing cost estimation calculators you can use, but the real costs depend on a number of factors. If you’re an entrepreneur and you’re producing your own boards, or you are managing manufacturing, testing, and delivery for a new project, it’s your job to help clients understand the primary cost drivers for new boards. Here’s how you can get an estimate of your fabrication costs, both for local and overseas manufacturers.

Blog
PCB Mountable Connectors: SMD vs. Through-hole

Selecting a connector is as much an art as it is a science. The artistic side is all about aesthetics and satisfying clearances, while the scientific side is all about signal integrity. For PCB mountable connectors, you’ll need to choose between surface-mounted or through-hole connectors, and you’ll need to consider how each type affects signal integrity in your application. Here’s what you need to think about beyond the standard connector specifications.

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Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool.

Blog
How to Maximize Copper in Your PCB Design: The Pros and Cons of Copper Pouring Versus Placing

There is a saying in copper pour PCB design, “Copper is free.” It means a PCB editor designer must think in reverse. A board starts off as solid copper, and the copper you don’t want is removed. It is faster to build, less consumptive, and less expensive to make a board that is mostly copper as compared to the same size board that is mostly bare. Picking the correct technique will make the difference between an effortless or frustrating experience.

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Blog 5月 14, 2020
How to Highlight Nets in Altium Designer to Simplify Schematic and PCB Designs

Highlighting nets will help you simplify your schematic and PCB design. In Altium , there are multiple options that enable you to leverage this capability to simplify the verification of connections and circuit paths and make sure that the design you send to your manufacturer accurately reflects the printed circuit board you need built.

Routed tracks
Blog 5月 5, 2020
Helpful Tips for Interactive Routing in Altium Designer

Before you jump into the software, you should know the types of things you’re going to want to look out for. Traces, connection lines, differential pair routing, and route paths can all affect the routing process of your board. Make sure that you’re equipped knowing, ultimately, what you want your board design to accomplish and furthermore, where you anticipate potential problem areas to be.

Tag
Embedded thumbnail for How to Create and Use Impedance Profiles
How to work with Layer Stack Manager
How to Create and Use Impedance Profiles

Using the Altium Designer Layer Stack Manager, we will show how to create impedance profiles for transmission lines and how to apply them to the circuit board using the PCB Rules and Constraints Editor.

Embedded thumbnail for Creating a PCB Footprint Courtyard
How to create a PCB Footprint
Creating a PCB Footprint Courtyard

The courtyard is an essential piece when you want to create a PCB Footprint in Altium Designer. We’ll talk about what a courtyard is, how to create a courtyard, and how to format a courtyard correctly for your PCB footprint.

Embedded thumbnail for How to Edit Existing Tracks in Altium Designer
How-To's
How to Edit Existing Tracks in Altium Designer

This new design rule flags a violation when the creepage distance across non-conductive surface and edge regions of the board, between the targeted signals, is equal to or less than the specified Creepage distance.

Embedded thumbnail for Creating a PCB Footprint Silkscreen Overlay
How to create a PCB Footprint
Creating a PCB Footprint Silkscreen Overlay

When creating a PCB footprint in Altium Designer creating a silkscreen overlay is an important requirement. We’ll go over the standards for creating a silkscreen overlay for a footprint and the steps to creating one, such as constructing lines and measuring distance of objects and primitives.

Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Paste
What's New in 22.7
变量助焊层输出控件

输出数据需要尽量准确。对于多变量设计,您现在可以确保将助焊层仅显示在真正需要的位置。

Embedded thumbnail for Adding Designators for Assembly Drawings
How-To's
Adding Designators for Assembly Drawings

Designators for assembly drawings are added on the assembly layer. This video shows how to add the designators.

Embedded thumbnail for Stackup Material Library
How to work with Layer Stack Manager
Stackup Material Library

In this video we will learn more about the Altium designers Layer Stack Mangers built-in materials library, and how to add new material and use it in our board stack. We will also look at how we can save the user materials to an xml format.

Embedded thumbnail for Placing Footprint Pads
How to create a PCB Footprint
Placing Footprint Pads

Every footprints needs proper pad placement to ensure trace connectivity. Placing pads is the first step towards footprint creation.

Embedded thumbnail for Setting the Transparency for Layers and Primitives
How-To's
Setting the Transparency for Layers and Primitives

Customize your workspace by setting the transparency of layers and primitives in the PCB.

Embedded thumbnail for Create New Via Types Using the Layer Stack Manager
How to work with Layer Stack Manager
Create New Via Types Using the Layer Stack Manager

In this video, we will learn how to create new via types using the Layer Stack Manager, and how to create new Routing Via design rules using the PCB Rules and Constraints Editor. We will also explore how to use the different types of Via during interactive routing.

Embedded thumbnail for How to Create a Copper Board Report
How-To's
How to Create a Copper Board Report

This video will show how to create a copper board report in your PCB which can be useful for copper balance in DFM process

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