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Why Use a Version Control System in PCB Design
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Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

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Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
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Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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NEW
Blog
From Concept to Production: A Modern Approach to Wire Harness Engineering

Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.

NEW
Blog
Transforming RF Design with Ultra HDI

Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.

Blog
Boost Your PCB Testing Efficiency with Testpoint Manager

Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!

Blog
Ultra HDI: It’s Not Just Buzzword

Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.

Blog
Cloud PCB Design: 5 Cloud Security Myths Debunked

This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.

Blog
Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium

Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.

Blog
DFM/DFA Requirements in Systems Engineering

Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.

Blog
Best Practices for Electronics Project Management - Part 2

Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.

Blog
Rigid-Flex PCBs: Understanding the Pros, Cons, and Fabrication Considerations

Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.

Blog
The Role of Automation & Robotics in Wire Harness Assembly

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Blog
Wiring for the Final Frontier: A Guide to Space-Grade Harness Design

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

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Embedded thumbnail for Altium's Role in Accelerating Muddy Machines' Farming Robots
Altium Stories
Altium's Role in Accelerating Muddy Machines' Farming Robots

Is Altium Designer and Altium 365 can help in a food production industry? The answer is YES! Check how our software helps Muddy Machines be more efficient in a farming robots development process.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part III: Stability Analysis
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part III: Stability Analysis

Join us for the third installment of our LDO Regulator Essentials series with Rafał Stępień. In this session, we'll dive into stability analysis using AC sweep simulations and explore how to address instabilities or phase and frequency response.

Embedded thumbnail for Import Component Footprints Faster with Altium Designer. Part III: Supply Chain Intelligence
Import Component Footprints Faster with Altium Designer
Import Component Footprints Faster with Altium Designer. Part III: Supply Chain Intelligence

Discover how to leverage supply chain intelligence in Altium Designer! Piet Callemeyn demonstrates enhancing Manufacturer Part Search with real-time data on component availability and pricing in the last chapter of the series about component creation.

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Altium Stories
Robotic Harvest: Securing Our Food Future

See how Altium's PCB design software, including Multi-board System Design and Harness Design capabilities, supports Muddy Machines, a company building autonomous robots for use in the agriculture industry. This video demonstrates the vital role of technology in creating resilient and efficient agricultural practices for the future.

Embedded thumbnail for Finding Alternate Field-Effect Transistors: Alternate Parts Series: Pt. 3
Octopart
Finding Alternate Field-Effect Transistors: Alternate Parts Series: Pt. 3

In Part 3 of "Expert Insights on Alternative Parts" series, Phil Salmony will demonstrate how Octopart identifies suitable alternative field-effect transistors (FETs). Octopart assists in narrowing down parameters to select the right component for any application. Learn to navigate Octopart's search and filtering tools to choose the best MOSFETs for your specific application.

Embedded thumbnail for Stay Ahead of the Curve: A Half-Year Review of Altium Designer Improvements -  Recording Preview
New in Altium Designer 24
Stay Ahead of the Curve: A Half-Year Review of Altium Designer Improvements - Recording Preview

In the last six months, we have implemented significant enhancements in Schematic Capture, PCB Design, and Harness Design in Altium Designer 24. Check out our webinar recording to learn how these new capabilities can keep you ahead in the electronics industry. You can find it here: July COM Webinar Recording

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Altium Stories
How Skeleton Technologies Uses Altium Solutions

Explore how Skeleton Technologies is transforming industries with their innovative supercapacitors made from “Curved Graphene” materials. These advancements are not only powering AI data centers and stabilizing electrical grids but are also unlocking new energy opportunities and driving progress towards a net-zero future.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part II: Voltage Drop and Regulation
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part II: Voltage Drop and Regulation

We are returning to our LDO Regulator Essentials series. In this installment, we will focus on understanding the required dropout voltage, detecting when the regulator is out of regulation, and analyzing the performance of the LDO under higher current conditions.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part I: Basics
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part I: Basics

We invite you to join us for a new video series on LDO (Low Dropout) Regulators. In this series, we will cover everything you need to know about LDO regulators, from fundamental theory to practical implementation. In the first video, we will begin with an in-depth chapter on the theory behind these devices and their implementation in Altium Designer.

Embedded thumbnail for Wearable Design Project - Part VII: PCB Layout part III
Wearable Design Project
Wearable Design Project - Part VII: PCB Layout part III

Check out the final installment of the video series on the Wearable Design Project. In this video, you will learn how to set the rigid and flex parts of the design, modify the board for the project, and complete the PCB routing. For a deeper dive into this project, you can find it on our Altium Community Workspace.

Embedded thumbnail for Optimize Connections and PCB Design with Wire Bonding
New in Altium Designer 24
Optimize Connections and PCB Design with Wire Bonding

Experience our new wire bonding feature, designed to enhance connection integrity and improve PCB design efficiency. One of the main capabilities includes support for chip-up wire bonding configurations and easy validation of bond wiring in 3D view. Don’t miss this opportunity—participate in our Beta Program and be among the first engineers to explore this impressive feature.

Embedded thumbnail for Innovative Jewelry: Startup Uses Altium to Embed Electronics
Altium Stories
Innovative Jewelry: Startup Uses Altium to Embed Electronics

Discover how Safety by Cilia transformed personal protection by utilizing Altium Designer and Altium 365 to create groundbreaking jewelry that also functions as a safety alarm. This device integrates GPS tracking, dual alarm options (both loud and silent), automatic audio recording, and rapid notification capabilities, all while maintaining an accessory that excels in both aesthetics and functionality.

Embedded thumbnail for Wearable Design Project - Part VI: PCB Layout part II
Wearable Design Project
Wearable Design Project - Part VI: PCB Layout part II

Join us for Part VI of the Wearable Design Project as Piet Callemeyn finalizes the PCB layout, focusing on rigid-flex design. Learn key strategies for optimizing your wearable tech design. Like, comment, and subscribe!

Embedded thumbnail for Super Capacitors Unlock the Future of Energy
Altium Stories
Super Capacitors Unlock the Future of Energy

In this brand new episode of Altium Stories, we invite you to explore how Skeleton Technologies is transforming numerous industries with their innovative graphene-based superbatteries. Their advanced electronics technology powers AI data centers, stabilizes electrical grids, and creates new energy opportunities, all while advancing us toward a net-zero future.

Embedded thumbnail for Wearable Design Project - Part V: PCB Layout Part I
Wearable Design Project
Wearable Design Project - Part V: PCB Layout Part I

Join Piet Callemeyn in Part V of our wearable technology design series as he delves into the complexities of PCB layout for a wireless heart rate sensor. In this session, we will guide you through the initial steps of PCB layout preparation.

Embedded thumbnail for Mixed Simulation Pt.5: Power Loss Optimization & Sensitivity Analysis
Mixed Simulation Series
Mixed Simulation Pt.5: Power Loss Optimization & Sensitivity Analysis

Discover methods to reduce power loss and employ Sensitivity Analysis in Altium Designer to enhance circuit efficiency and robustness. This tutorial guides you through practical techniques and tools for optimizing power usage in your designs.

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