News & Updates

The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.

High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.

There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Electronics schematics form the foundation of your design data, and the rest of your design documents will build off of your schematic. If you’ve ever worked through a design and made changes to the schematic, then you’re probably aware of the synchronization you need to maintain with the PCB layout. At the center of it all is an important set of data about your components: your schematic netlist. What’s important for designers is to know how the netlist defines connections between different components and schematics in a large project.

There are plenty of PCB manufacturing services you can find online, and they can all start to blend together. If you’re searching for a new service provider, it can be hard to compare all of them and find the best manufacturer that meets your needs. While experienced designers can spot bogus manufacturers from afar, there is always a temptation to go with the lowest priced, supposedly fastest overseas company you can find. However, there is a lot more that should go into choosing a PCB manufacturing service than just price.

Pi Filters are a type of passive filter that gets its name from the arrangement of the three constituent components in the shape of the Greek letter Pi (π). Pi filters can be designed as either low pass or high pass filters, depending on the components used. The low-pass filter used for power supply filtering is formed from an inductor in series between the input and output with two capacitors, one across the input and the other across the output. Keep reading to learn more about their application in the PCB Design.

The first question that should come up when selecting materials and planning a stackup is: what materials are needed and how many layers should be used? Assuming you’ve determined you need a low-loss laminate and you’ve determined your required layer count, it’s time to consider whether you should use a hybrid stackup. There are a few broad situations where you could consider using a hybrid stackup with low-loss laminates in your PCB

Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.

A number of us on this blog and in other publications often bring up the concept of target impedance when discussing power integrity in high-speed designs. Some designs will be simple enough that you can take a “set it and forget it” approach to design a functional prototype. For more advanced designs, or if you’re fine-tuning a new board that has existing power integrity problems, target impedance is a real consideration that should be considered in your design.

Dual power supplies are circuits that generate two different output voltages from a single input source. The simplest method of generating dual output voltages is to use a transformer with two taps on the output winding. Bespoke transformers can have any voltage ratio depending on the number of windings in each part of the output side of the transformer.

With digital boards that are nominally running at DC, splitting up a power plane or using multiple power planes is a necessity for routing large currents at standard core/logic levels to digital components. Once you start mixing analog and digital sections into your power layers with multiple nets, it can be difficult to implement clean power in a design if you’re not careful with your layout.

High-speed digital PCBs are challenging enough to design, but what about mixed-signal boards? Many modern systems contain elements that operate with both digital and analog signaling, and these systems must be designed to ensure signal integrity in both domains. Altium Designer has the layout and signal integrity tools you need to ensure your mixed-signal PCB design does not experience interference and obeys important design standards.

Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard. While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.

Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.

There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.

Embedded computers, vision devices, DAQ modules, and much more will all need some memory, whether it’s a Flash chip or a RAM module. Normally, something like a Flash memory chip or a small eMMC module would not be used for temporary storage as the device requires constant rewrites. Instead, if you happen to need a volatile memory solution, you would go for static (SRAM) or dynamic RAM (DRAM). If you need to decide which type of memory to use in your board, keep reading to see some of the basic design guidelines for SDRAM vs. DDR memory modules.

Using a PCB ground plane in a stackup is the first step towards ensuring power and signal integrity, as well as keeping EMI low. However, there are some bad myths about ground planes that seem to persist, and I’ve seen highly experienced designers make some simple mistakes when defining grounds in their PCB layouts. If you’re interested in preventing excess emissions and ensuring signal integrity in your layout, follow these simple guidelines for implementing a PCB ground plane in your next board.

As much as we’d like, the power we supply to electronics isn’t always stable. Real power sources contain noise, they might exhibit power instability, or they dropout unexpectedly. Thankfully, we have power regulators to help prevent some of these problems. For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs.

Post-layout simulators for your PCB are very valuable tools. If you’re working through a complex design, it’s a good idea to put it through some level of simulation and analysis to evaluate the design before manufacturing. This is all easy with the cloud collaboration tools in Altium 365 and Ansys field solvers thanks to the EDB Exporter utility in Altium Designer. These existing tools in Altium Designer and any of the Ansys field solver utilities give you a simplified way to share design data, EDB files, and simulation results with anyone on your design team.