News & Updates

Supply shortages have become and continue to be a common problem, especially when it comes to the world of electronics. It's hard to get all the different components for our boards. Heck! It's even tough to get the board themselves too! When electronic components become obsolete or out of stock, design and production can suffer lengthy delays. With current supply chain delays and with an average of 15 end-of-life notices issued every day, obtaining the parts you need is a challenge.

Once your board passes through the standard PCB fabrication process, the bare copper in your PCB will be ready for the application of a surface finish. PCB plating is applied to protect any copper in your PCB that would be exposed through the solder mask, whether it’s a pad, via, or other conductive element. In this article, I’ll run over the different PCB plating material options and their advantages in your PCB.

The PCB supply chain encompasses multiple components, raw materials, and the PCB itself. PCBs and PCB assemblies are often the most technically complex components that are purchased for electronic assemblies and products. The complexity of modern PCBs leads to several challenges for a supply chain management team that may be significantly different when compared with other commodities the team manages. In this brief guide, we'll look in-depth at the PCB supply chain, and specifically what falls within the purview of a procurement and supply chain management team.

On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.

There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.

When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.

Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.

If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.

In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.

Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.

Learn how to turn a Raspberry Pi into a custom Android device. This guide covers hardware selection, software setup, and troubleshooting common issues.

Learn how PCB design engineers can securely share design files with team members, clients, and manufacturers. Marek Orzeł explores best practices and tools to protect your intellectual property while ensuring efficient collaboration.

Strong partnerships between OEMs and harness manufacturers are key to efficient, high-quality product development. In this article, Krishna Sundaram shows how collaboration, clear communication, and the right design tools can streamline the harness manufacturing process and drive success.

Read Marcin Lewandowski's article explaining how MOSFETs are replacing traditional diodes for reverse polarity protection. Step into the future of energy-efficient electronics!

Dive into Worst Case Analysis techniques with Kamil Jasiński and ensure the reliability of your circuits. Master sensitivity analysis, Monte Carlo simulations, and more to confidently address real-world challenges.

Want to learn how the Gerber X3 file format simplifies data exchange by unifying assembly and fabrication details in a single file? This article explores the format and its role in streamlining PCB manufacturing.

Our new article explores best practices and tools for streamlining cable harness design workflows. Learn how to minimize errors, save time, and enhance collaboration by leveraging advanced features in Altium Designer.

This article by Dario Fresu delves into effective techniques for designing PCBs to reduce electromagnetic interference (EMI). It covers key topics such as stackup selection, routing strategies, and grounding best practices, offering actionable insights for improved performance.

Altium and Renesas are featured in a new CBS-produced documentary exploring how digitalization and cloud platforms are revolutionizing electronics production for Economy 4.0, driving efficiency and accelerating innovation.

Discover how to streamline your wiring projects with advanced harness and PCB integration tools in Altium Designer. This article explores techniques to prevent wiring errors, enhance collaboration, and ensure accurate design documentation for complex projects.

Altium wishes you all the best this holiday season! May this time be filled with joy, laughter, and cherished moments with your family and friends. We also extend our warmest wishes for a Happy New Year 2025!