News & Updates
One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.
SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.
A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.
Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.
To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.
The primary source of high-speed problems is not due to high clock frequency but rather the fast rise and fall times of component signals. With fast edge rates, reflections may occur at the receiver side, and when the board routing is dense, crosstalk may become a problem. During this webinar, you'll sharpen your knowledge and develop new skills that you can use to design High-Speed PCB's more efficiently and effectively.
Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.
I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?
If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.
The primary source of high-speed problems is not due to high clock frequency but rather the fast rise and fall times of component signals. With fast edge rates, reflections may occur at the receiver side, and when the board routing is dense, crosstalk may become a problem. During this webinar, you'll sharpen your knowledge and develop new skills that you can use to design High-Speed PCB's more efficiently and effectively.
The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?
The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.
For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs. If you’ve ever wondered how these decisions are made and when to use each type of regulator, just know that there is more to this decision than simply looking at the input/output voltage/current.
PCB fabrication is an extremely complex technological topic that deserves recognition as the most fundamental part of PCB engineering. Unless connectors, conductive adhesive, wire-bonding, or zebra-tape are used, in the modern electronics industry it’s always necessary to use some kind of flux during the soldering process to create an electric connection. In this article, we’ll discuss fluxes — what they are, what they are made of (yes, there is going to be a lot of chemistry, don’t be scared), how they should be used, and in what direction the industry is going.
As anyone who designs and builds electronic devices knows, the device will generate heat when it’s switched on. Wherever current flows through an impedance, energy losses will manifest themselves as heat. Integrated circuit packaging is getting smaller to meet the trend for more compact devices but at the cost of poorer thermal properties. This article describes the basic thermal management approaches to consider in your next designs.
We continue to explore the magic of energy conversion in a PWM transducer. Why is it magic? Theoretically, in a PWM transducer this happens without losses, isn't that magic? A PWM transducer, like a tailor with scissors, cuts the “fabric of energy” into pieces, and then, like a sewing machine, stitches the pieces of energy into a dress - DC Magnitude. What is a constant component and how can we get it? Let's explore!
There are different techniques in the world of technology to achieve various goals, both final and intermediate. Some techniques are so successful that they are commonly used with high efficiency. Electronics is no exception. The greatest example is the use of Pulse Width Modulation (PWM) signals (energy), which is applied in any modern electronic device. To apply PWM effectively, it is necessary to understand the engineering difficulties that engineers faced in the past, and the thoughts and ideas that subsequently were combined into effective, complete PWM power solutions.
If you speak with a bunch of design engineers, you might quickly form the opinion that the electrolytic capacitor has a particularly dubious reputation. A faulty electrolyte mix used in these types of capacitors led to premature device failures, and quite often, a “bit of a mess” was made to the PCBs on which they were soldered. However, despite the problem of the capacitor plague, this article is focusing on helping the designer understand how to get many more years of useful life from an electrolytic capacitor.
A schematic drawing will not only tell your PCB design software what needs to connect where, but it also communicates the purpose of a circuit to other people. It’s easy to create a schematic, but it can be harder to make a helpful schematic that can be quickly and easily read and comprehended by the reader. In this guide, based on years of industry experience, we will show you how to improve your schematic layout so that your designs are elegant and readable.
Suppose your job involves rapidly iterating designs or creating a wide variety of products for clients. In that case, there are some essential tools available that can save you a tremendous amount of time, bringing high engineering risk devices to completion successfully. Whether you’re working on internal projects or developing high mix devices for clients as a consulting or freelance firm, these indispensable tools will help you ship a higher quality product in less time.
Even though today’s cloud platforms are immaculately secure and they allow a range of files to be easily shared, there are times where you should limit the data you’re sharing to only the critical files required. For PCB designers, this means either sharing entire design projects or sharing individual files with your manufacturer, customers, contractors, or collaborators. If you want to eliminate liabilities and keep your team’s design data secure, consider these best practices for sharing PCB design data with Altium 365.
Best component companies will release reference designs for their new and legacy products to show designers an example application for a component. If the reference design is good enough and it very nicely illustrates how to quickly engineer around a few main components, I’m likely to use them in the design and the component maker has just earned my business. If you’re a newer designer and you’re wondering whether reference designs are right for your next project, follow these best practices so that you don’t make any mistakes with your reference design.
When we deal with “abstract” aspects of electromagnetic fields and how they function, it can be easy to get lost in the weeds regarding them. The first part of this article will address an important aspect of transmission line fundamentals, namely how electromagnetic fields and waves propagate on a transmission line. This article’s end goal is to create a core understanding of these concepts so that when it comes time to design a PDS, the proper design methodologies are followed and a properly working PDS is achieved appropriately, the first time and every time.
Via stubs are sometimes viewed as an annoyance, especially when you only need to make a transition between adjacent layers. For low speed, less-dense boards with low layer count, via stubs are an afterthought, or they may not receive consideration at all. For faster edge rates/higher frequencies, the conventional wisdom is to remove all via stubs. The question is: what exactly counts as “high frequency,” and how do you figure out the relevant length?
Unlike the clumsy human finger, a thermal camera can detect minute temperature differences across its view. This allows you to rapidly identify any components that are consuming current. Any parts or areas of your board that draw current will also generate heat that can easily be picked up by a thermal camera.
I want to share a little secret with you in this article: Assembling SMT prototypes boards is not only easy, but it requires very little equipment. Using just a stencil, I can easily hand prototype down to 0.3 mm pitch ICs, and 0201 (imperial) sized passive components. If you’re currently hand assembling boards with a soldering station, you need to stop this immediately and start using a stencil instead!