News & Updates
Blog
•
How to Select Copper Foil for High-Frequency PCB Design
The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss for products with RF applications. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. In this article, we'll look at the balance between copper foil losses and other types of losses in a PCB, as well as some strategies that are commonly used to overcome roughness.
Blog
•
Altium Designer 22.8 Update
We are happy to announce that the Altium Designer 22.8 update is now available. Altium Designer 22.8 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Blog
•
What is Hybrid Beamforming?
In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.
On-Demand Webinar
•
PCB Design in Altium Designer with Differential Data Transfer
Differential data transmission lines usage can be challenging for even experienced designers. First you need to be familiar with the concepts of differential data transmission, find out why it is used, and what the potential advantage for your signal. This webinar will help you determine what part of your designs need differential pairs implementations and how to create such pairs with a given wave impedance in Altium Designer.
Blog
•
Why Most Via Impedance Calculators Are Inaccurate
The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.
Blog
•
Buck Converter Simulation in Altium Designer
When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer.
Blog
•
Overview of the PCIe 6.0 Standard
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
Blog
•
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
On-Demand Webinar
•
Tips & Tricks: Board Shape Creation
Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.
Blog
•
Is There an SPI Trace Impedance Requirement?
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
Blog
•
The Skin Effect, Current Density, and the Electromagnetic Field
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
NEW
Blog
•
7 Ways to Catch Rules & Constraints Early – Checklist
Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.
NEW
Blog
•
Do You Need an IPC-D-356 Netlist?
If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.
Blog
•
How Agile BOM Management Helps You Lock in Pricing Before Market Shifts
When engineering and procurement work from different BOM versions, delays and cost surprises follow. Learn how agile BOM management brings teams onto one connected BOM so they can respond fast, manage risk, and lock pricing early.
Blog
•
Flexible Circuits: Enhancing Performance with Shielding, Heat Dissipation, and Stiffeners
A flex circuit can look perfect on paper and still fail in the real world due to EMI, hot spots, or mechanical strain. This article breaks down how shielding, thermal planning, and stiffeners help deliver designs that stay reliable over time.
Blog
•
Avoid These Top 3 Power Distribution Failures in PCB Design
Power distribution issues can silently undermine your PCB’s reliability. This article uncovers the top three failure modes and shows how Power Analyzer by Keysight helps you catch them early in the design phase and how Altium Agile Teams turns those checks into structured team action.
Blog
•
From BOM to Requirements and Back: Building Sourcing Constraints Into Specs
When engineering and procurement remain disconnected, supply-chain problems will sneak up on you. This guide argues convincingly: embed sourcing constraints into your requirements from day one, and avoid costly rework down the line.
Blog
•
Understanding Power Integrity in PCB Design: Power Analyzer by Keysight Whitepaper
Power integrity is the backbone of reliable PCB design. This whitepaper explains how to analyze and optimize voltage drop, current density, and grounding directly within Altium Designer Agile using the Power Analyzer by Keysight.
Blog
•
How to Manage ECAD Libraries for Consistent PCB Layout Design
Strong hardware starts with strong libraries. Discover how disciplined ECAD-library management dramatically improves design consistency and accelerates every stage of your PCB workflow.
Blog
•
High Speed PCB Design Review: Signal Integrity Questions You Should Always Ask
As data rates increase, the risks hidden in your layout grow with them. This quick guide highlights the critical SI checkpoints that can save you from late-stage surprises and redesigns. If you design high-speed boards, you’ll want to read this before your next review.
Blog
•
Supplier Negotiation: Turn Market Data Into Your Best Negotiation Tool
Don’t walk into supplier talks blind. Use market data to benchmark quotes, check lead times and uncover alternate parts. This article shows how visibility can shift the balance and de-risk your BOM.
Blog
•
Via-in-Pad in Rigid-Flex Designs: When Space Is Tight, Details Matter
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
Blog
•
Wearable Electronics: Innovations, Challenges & Future Trends
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
Blog
•
Streamlining Component Selection for Long Product Lifecycles
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
Blog
•
Using ECAD Software to Track Part Availability During PCB Design
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
Blog
•
PCB Design Data Management Tips for Multi-Board Projects
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
Blog
•
6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
Your search returns no results.
