News & Updates

High frequency PCB design can seem esoteric, and I've heard many an engineer describe it as "black magic"! The subject is also a bit confusing, especially once someone asks which frequencies could be reasonably considered "high". Before you do anything inside the layout for a high-speed or RF PCB, you will need to pay attention to the materials being used in the board. If you're unsure which high frequency PCB materials you should use, then keep reading to learn more.

Of all the noise and operational challenges designers face in their PCBs, there is one overarching problem that is arguably most popular: electronic noise. It could originate as an SI/PI problem, it could possibly arise from some external source, or it could be good old-fashioned crosstalk! These tend to fall into three categories: adding shielding, doing something to create isolation, or placing filters. Let's look at all of these as they tend to be the default solution set when confronted with many noise problems.

We design products not just PCBs requiring effective collaboration between MCAD and ECAD engineers. We need to consider how we can reduce the likelihood of errors when placing critical design components. Component placement in the context of enclosures can be easily handled in an MCAD environment while it is more difficult to achieve in the ECAD domain. Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.

In February, we hit a new record in the number of users on the platform. The Altium 365 user community is now 20,000 strong! You can now migrate from an external version control system to Altium 365 preserving the history of commits. We also received the SOC 2 Type 1 certification from KPMG, made layer stack available in the web viewer, and added the brand new capability to track tasks in the context of your design project. Keep reading to learn more!

Get a cohesive view of supply chain market conditions, stay on top of trends, and avoid disruption with this free, monthly report from Spectra.

Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Flex sections also need to be placed in the layer stack before moving into the PCB layout. Once inside the PCB editor, bending lines can be clearly defined in the PCB layout, and these can be visualized in Altium Designer's 3D PCB design tools. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

In the business of PCB design, communicating needs to manufacturers and vendors is a top priority. The context of our requests is sometimes lost either by not providing the correct information, not listing enough information, or not giving any information. Although the experienced PCB designer can take steps to specify everything they want to see in their PCB stackup, eventaully the manufacturer will handle that decision in an effort to balance available materials with processing capabilities and yield.

Many factors can affect your supply chain. Currently, supply disruptions are being felt due to the effect of the Covid-19 Pandemic. In this webinar, learn how Concord Pro on Altium 365 can mitigate disruptions in your supply chain and help you stay on schedule and budget for your designs.

During the recent IPC APEX expo, there was a lot of discussion about SAP, or semi-additive PCB processes. As with any new technology adoption there were people that are excited to jump right in and start designing with much finer feature sizes and work through the inevitable changes to the traditional thought process. Others are in a "let’s wait and see" mode and of course there are a few skeptics there as well, so keep reading to learn more.

Parasitic extraction: the integrated circuit design community must grapple with this task on a daily basis, especially once gate features are reduced below ~350 nm and chips run at high switching speeds. The PCB community also has to deal with this idea in order to better design power delivery networks, interconnects with precise impedance, and properly quantify crosstalk and coupling mechanisms.

Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.

Amplifiers can come in all shapes and sizes, depending on their bandwidth, power consumption, and many other factors. A Class-D amplifier design is normally used with high fidelity audio systems, and circuits for a Class-D amplifier are not too difficult to build in a schematic. If you’ve never worked with a Class-D amplifier or you’re looking for a fun audio project, follow along with this PCB layout.

Modern digital systems throw the digital electronics textbooks out the window, and high-speed DDR memories are a perfect example of the paradigm shift that occurs when you jump into IC and PCB design. With DDR5 still being finalized, and DDR6 now being discussed, designers who are already comfortable with DDR4 will need to consider how their design practices should adjust to accommodate the constant doubling of data speeds in these high-speed memory technologies.

In my experience, the somewhat vague information you might find in a typical crystal datasheet doesn’t enable an engineer to be wholly confident that their design expectations can be met. On the other hand, “blindly” adopting what the crystal datasheet says usually results in adequate frequency stability. If you want to get inside and uncover what is going on, you need to start thinking about the crystal as a phase-shifting network.

Antipads on vias and landing pads are a point of contention in modern PCB design, and the debate around the use of these elements in a multilayer PCB is framed as a binary choice. Like thermal reliefs, ground plane splits, and orthogonal routing, the debate around antipads on landing pads and vias is framed as an always/never choice. With today’s modern PCBs, it pays to understand the effects of antipads on signal integrity.

RF structures can be complicated to design and layout, particularly because many RF systems lead double lives as digital systems. Getting an analog signal out of a component and into a waveguide for high isolation routing is not so simple as placing a microstrip or stripline coming off your source component. Instead, you need to create a special microstrip to waveguide transition structure to ensure strong coupling into and out of your waveguide.

Layouts for complex electrical systems may need to make extensive use of copper pour to provide ground nets, power nets, shielding, and other copper structures for power and signal integrity. Backplanes, motherboards, RF products, and many other complex layouts will make use of copper pour and polygons that can’t be easily placed as custom components. The rules-driven design engine in Altium Designer® also ensures that any PCB polygon pour you place in your PCB layout will comply with clearance rules and will be checked against other electrical design rules.

If you need to connect multiple boards into a larger system and provide interconnections between them, you’ll likely use a backplane to arrange these boards. Backplanes are advanced boards that borrow some elements from high speed design, mechanical design, high voltage/high current design, and even RF design. They carry their own set of standards that go beyond the reliability requirements in IPC.

The upcoming Gen6 version of PCIe is pushing the limits of signal integrity for many computer systems designers. As with any high-speed signaling standard, signal integrity is a major design consideration, which requires the right set of design and analysis techniques. Rather than digging deep to find PCIe 5.0 signal integrity requirements from PCI-SIG, we’ve compiled the important points for today’s PCB layout engineers. Layout engineers should pay attention here as these design requirements will become more stringent in later PCIe generations.

An essential aspect of project management is time management, especially when your design team is working remotely. Your time management strategy is team-based and individual, but time can easily get spent on important tasks when working as part of a team. So how can you streamline important collaboration tasks for your design team to increase productivity?

In these days of easily-available internet and quarantines, everyone is working remotely. It’s nice being able to spend time with family and regain control over your schedule, but keeping track of projects and revisions while securing user access feels like its own job. With the right set of project and data management tools, you can easily share your data with collaborators without tracking email chains.

When I started using my Altium 365 Workspace for collaboration, I found I could make things run more smoothly when I kept things organized. However, I prevented any issues thanks to all the organization tools built into the Explorer panel within Altium Designer. Let’s take a look at how you can get the most value out of your Altium 365 Workspace in terms of organization and access management.

PCB manufacturing is competitive, and there is plenty of worldwide manufacturing capacity for new boards. If you’re looking for a manufacturer for your next project, it can be difficult to determine who is the best option to produce your board. Different fabricators and assemblers offer different levels of service, different capabilities, and access to different processes and materials. There are a lot of options to consider when selecting a manufacturer for your project.

Ever since I started using Github and Google Docs, I fell in love with revision control. Instead of keeping multiple copies of essential files and time-stamping every revision, revision tracking information gets stored alongside the file. This environment works great for code, spreadsheets, and documents, and Altium brings these same features into PCB design.

With advances in industrial automation, automotive technology, remote sensing, and much more, image processing is taking center stage in many embedded systems. Image processing with older video systems was difficult or impossible due to the low quality of many imaging systems with perpetual uptime. Newer systems provide video with higher frame rates and higher resolution images, but these systems still needed to connect directly to a computer in order to enable any useful image processing applications.

EDA tools have come a long way since the advent of personal computing. Now advanced routing features like auto-routers, interactive routing, length tuning, and pin-swapping are helping designers stay productive, especially as device and trace densities increase. Routing is normally restricted to 45-degree or right-angle turns with typical layout and routing tools, but more advanced PCB design software allows users to route at any angle they like. So which routing style should you use, and what are the advantages of any angle routing?

If you do a search for “Hardware-in-the-Loop” testing, you will frequently find examples of complex, real-time systems. Article from National Instruments, for example, gives a nice explanation and background on what hardware-in-the-loop (HIL) is, and provides an example of testing electronic control units within an automobile. In this article, we will be focusing on a smaller, more bite-sized version of HIL testing concepts.