News & Updates

Of all the noise and operational challenges designers face in their PCBs, there is one overarching problem that is arguably most popular: electronic noise. It could originate as an SI/PI problem, it could possibly arise from some external source, or it could be good old-fashioned crosstalk! These tend to fall into three categories: adding shielding, doing something to create isolation, or placing filters. Let's look at all of these as they tend to be the default solution set when confronted with many noise problems.

We design products not just PCBs requiring effective collaboration between MCAD and ECAD engineers. We need to consider how we can reduce the likelihood of errors when placing critical design components. Component placement in the context of enclosures can be easily handled in an MCAD environment while it is more difficult to achieve in the ECAD domain. Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.

In February, we hit a new record in the number of users on the platform. The Altium 365 user community is now 20,000 strong! You can now migrate from an external version control system to Altium 365 preserving the history of commits. We also received the SOC 2 Type 1 certification from KPMG, made layer stack available in the web viewer, and added the brand new capability to track tasks in the context of your design project. Keep reading to learn more!

Get a cohesive view of supply chain market conditions, stay on top of trends, and avoid disruption with this free, monthly report from Spectra.

Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Flex sections also need to be placed in the layer stack before moving into the PCB layout. Once inside the PCB editor, bending lines can be clearly defined in the PCB layout, and these can be visualized in Altium Designer's 3D PCB design tools. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

In the business of PCB design, communicating needs to manufacturers and vendors is a top priority. The context of our requests is sometimes lost either by not providing the correct information, not listing enough information, or not giving any information. Although the experienced PCB designer can take steps to specify everything they want to see in their PCB stackup, eventaully the manufacturer will handle that decision in an effort to balance available materials with processing capabilities and yield.

Many factors can affect your supply chain. Currently, supply disruptions are being felt due to the effect of the Covid-19 Pandemic. In this webinar, learn how Concord Pro on Altium 365 can mitigate disruptions in your supply chain and help you stay on schedule and budget for your designs.

During the recent IPC APEX expo, there was a lot of discussion about SAP, or semi-additive PCB processes. As with any new technology adoption there were people that are excited to jump right in and start designing with much finer feature sizes and work through the inevitable changes to the traditional thought process. Others are in a "let’s wait and see" mode and of course there are a few skeptics there as well, so keep reading to learn more.

Parasitic extraction: the integrated circuit design community must grapple with this task on a daily basis, especially once gate features are reduced below ~350 nm and chips run at high switching speeds. The PCB community also has to deal with this idea in order to better design power delivery networks, interconnects with precise impedance, and properly quantify crosstalk and coupling mechanisms.

Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.

One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.

Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?

Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.

When some designers start talking materials, they probably default to FR4 laminates. The reality is there are many FR4 materials, each with relatively similar structure and a range of material property values. Designs on FR4 are quite different from those encountered at the low GHz range and mmWave frequencies. So what exactly changes at high frequencies, and what makes these materials different? To see just what makes a specific laminate useful as an RF PCB material, take a look at our guide below.

In today’s fast-paced world where iterations of electronics are spun at lightning speeds, we often forget one of the most critical aspects of development: testing. Even if we have that fancy test team, are we really able to utilize them for every modification, every small and insignificant change that we make to our prototypes? In this article, we will review a very low cost, yet highly effective and quite exhaustive test system that will get you that bang for your buck that you’ve been looking for.

If you’ve ever looked at the BOM for a reference design or an open-source project, you may have seen a comment in some of the entries in your BOM. This comment is either “DNP” or “DNI”. If you think about it, every component placed in the PCB requires some level of placement and routing effort, which takes time and money if you’re working for a client. This begs the question, why would anyone design a board with components they don’t plan to include in the final assembly?

When it’s time to share your design data with your manufacturer, it’s like taking a leap of faith. Sending off a complete documentation package might seem as easy as placing your fab files in a zip folder, but there are better ways to ensure your manufacturer understands your project and has access to all your design data. For Altium Designer users, there are multiple options for creating and packaging release data into a complete package for your manufacturers.

If you’re designing a circuit board to be powered by anything except a bench-top regulated power supply, you’ll need to select a power regulator to place on your board. Just like any other component, your regulator has stated operating specs you’ll see in a product summary, and it has more detailed specs you’ll find in a datasheet. The fine details in your datasheets are easy to overlook, but they are the major factors that determine how your component will interact with the rest of your system.

It would be nice if the power that came from the wall was truly noise-free. Unfortunately, this is not the case, and although a power system can appear to output a clean sine wave, zooming into an oscilloscope trace or using an FFT will tell you a different story. When you take "dirty" power, put it through rectification, and then pass it through a switching regulator, you introduce additional noise into the system that further degrades power quality. If you’re a power supply or power systems designer, then you know the value of supplying your devices with clean, noise-free power.

If you’re an electronics designer or you’re just beginning your career as an engineer, the PCB stackup is probably one of the last things you’ll think about. Simple items like PCB copper thickness and board thickness can get pushed to the back burner, but you’ll need to think about these two points for many applications as not every board will be fabricated on a standard 1.57 mm two-layer PCB

I often get questions from designers asking about things like signal integrity and power integrity, and this most recent question forced me to think about some basic routing practices near planes and copper pour. "Is it okay to route signal traces on the same layer as power planes? I’ve seen some stackup guidelines that suggest this is fine, but no one provides solid advice." Once again, we have a great example of a long-standing design guideline without enough context.

Electronics schematics form the foundation of your design data, and the rest of your design documents will build off of your schematic. If you’ve ever worked through a design and made changes to the schematic, then you’re probably aware of the synchronization you need to maintain with the PCB layout. At the center of it all is an important set of data about your components: your schematic netlist. What’s important for designers is to know how the netlist defines connections between different components and schematics in a large project.

There are plenty of PCB manufacturing services you can find online, and they can all start to blend together. If you’re searching for a new service provider, it can be hard to compare all of them and find the best manufacturer that meets your needs. While experienced designers can spot bogus manufacturers from afar, there is always a temptation to go with the lowest priced, supposedly fastest overseas company you can find. However, there is a lot more that should go into choosing a PCB manufacturing service than just price.

Pi Filters are a type of passive filter that gets its name from the arrangement of the three constituent components in the shape of the Greek letter Pi (π). Pi filters can be designed as either low pass or high pass filters, depending on the components used. The low-pass filter used for power supply filtering is formed from an inductor in series between the input and output with two capacitors, one across the input and the other across the output. Keep reading to learn more about their application in the PCB Design.

The first question that should come up when selecting materials and planning a stackup is: what materials are needed and how many layers should be used? Assuming you’ve determined you need a low-loss laminate and you’ve determined your required layer count, it’s time to consider whether you should use a hybrid stackup. There are a few broad situations where you could consider using a hybrid stackup with low-loss laminates in your PCB

Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.