News & Updates
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Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.
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The use of ferrites in a PDN is one design recommendation that is fraught with unclear guidance and over-generalized recommendations. If you see an application note or a reference design that recommends placing a ferrite in a PDN, should you follow this in your specific design, or should you ignore this and focus on adding capacitance?
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When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative webinar, we’ll review some of the must-have checks before sending your output data for fabrication.
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Before your board can be put into production and prepared for assembly, you have to generate a set of files that assist your manufacturer. These are your PCB design output files, also known as manufacturing files, fabrication data, assembly files, and a host of other names. Before you send your design file off to a manufacturer in an email, make sure to get a list of their required fabrication and assembly files first. If you’re a new designer, take some time to read over the basic PCB manufacturing file extensions below.
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Transformers can provide very effective signal isolation and are used to manipulate AC voltage and current levels. They can achieve all this with a greater than 95% power efficiency, which is why we commonly see them used in bench power supplies, audio gear, computers, kitchen appliances, and wall-warts. However, transformer theory can be unintuitive and in this article we answer on questions about them
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There are all sorts of version control systems (VCS) out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
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Controlled impedance routing at high frequencies is difficult enough, and it's important to make sure that you stay within your loss budget on long routes or in lossy media. When you have to route a long trace or a long differential pair to a connector or another component, what can you do if you're reaching the end of your loss budget? In this article, we’ll take a look at the skip reference routing method and explain how it can help recover some loss budget in a lossy interconnect.
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What most people don’t seem to grasp is that every aspect of the PCB is critical. It all plays a significant part in the operation of the final product. The layer stack is no different. We need to keep in mind materials and the intricacies therein, including thickness, weave, dielectric constants, and more. A proper layer stack is needed for each and every design, so it's important to know how to navigate the layer stack manager and all of its features.
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We are pleased to announce that Altium 365 is officially SOC 2 Type 1 certified. System and Organization Controls (SOC) 2 is a widely recognized attestation of security compliance defined by the AICPA and is considered the standard for ensuring data security and operational maturity. A SOC 2 certification provides valuable information for companies to assess the quality of the security provided by a service such as Altium 365.
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It’s no secret that component shortages have become more frequent this year. Companies will continue to grapple with supply chain challenges into 2022 and beyond. The impact of manufacturing delays can be substantial if a part is not available. Delays occur and sales plans get put on hold. It can also be very expensive and risky to replace parts from multiple sources. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
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Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
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Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
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Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
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In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
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If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
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If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
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This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
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The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
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When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
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Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
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What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
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As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
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Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
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Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
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A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
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Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.