News & Updates

If you compile a list of skew sources, you'll see that fiber weave-induced skew is only one entry on a long list of skew sources. We'll look at this list of possible skew sources below, and we'll see how they affect the operation of your PCB. From the list below, we'll see that some of these issues with skew are not simply solved by paying attention to the fiber weave construction in a PCB substrate.

This track is for the engineer who understands high-speed design requirements and wants to learn design practices to help ensure signal integrity and EMC with fast digital protocols, mixed-signal boards, and high layer counts.

We love answering questions from our readers and YouTube viewers, and one of the recent questions we received relates to EMI from switching elements in a switching regulator is "Should a cutout be placed below the inductor in a switching regulator circuit?". Despite the variations in inductors and their magnetic behavior, there are some general principles that can be used to judge the effects of placing ground near inductors in switching regulator circuits. We’ll look at some of these principles in this article

We are happy to announce that the Altium Designer 22.6 update is now available. Altium Designer 22.6 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Find 9 mistakes in a PCB design and get added into the lucky draw to win a prize from Altium!

Now you can assess your library’s health at a glance with the Library Health dashboard, view and share your bill of materials (BOM) and view and download PDF documents, all in your web browser. We improved the existing diff and compare features, and released a new version of MCAD CoDesigner. Register for the webinar to learn more!

This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.

It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.

It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.

Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.

Learn how to turn a Raspberry Pi into a custom Android device. This guide covers hardware selection, software setup, and troubleshooting common issues.

Learn how PCB design engineers can securely share design files with team members, clients, and manufacturers. Marek Orzeł explores best practices and tools to protect your intellectual property while ensuring efficient collaboration.

Strong partnerships between OEMs and harness manufacturers are key to efficient, high-quality product development. In this article, Krishna Sundaram shows how collaboration, clear communication, and the right design tools can streamline the harness manufacturing process and drive success.

Read Marcin Lewandowski's article explaining how MOSFETs are replacing traditional diodes for reverse polarity protection. Step into the future of energy-efficient electronics!

Dive into Worst Case Analysis techniques with Kamil Jasiński and ensure the reliability of your circuits. Master sensitivity analysis, Monte Carlo simulations, and more to confidently address real-world challenges.

Want to learn how the Gerber X3 file format simplifies data exchange by unifying assembly and fabrication details in a single file? This article explores the format and its role in streamlining PCB manufacturing.

Our new article explores best practices and tools for streamlining cable harness design workflows. Learn how to minimize errors, save time, and enhance collaboration by leveraging advanced features in Altium Designer.

This article by Dario Fresu delves into effective techniques for designing PCBs to reduce electromagnetic interference (EMI). It covers key topics such as stackup selection, routing strategies, and grounding best practices, offering actionable insights for improved performance.

Altium and Renesas are featured in a new CBS-produced documentary exploring how digitalization and cloud platforms are revolutionizing electronics production for Economy 4.0, driving efficiency and accelerating innovation.

Discover how to streamline your wiring projects with advanced harness and PCB integration tools in Altium Designer. This article explores techniques to prevent wiring errors, enhance collaboration, and ensure accurate design documentation for complex projects.