News & Updates
Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.
The use of ferrites in a PDN is one design recommendation that is fraught with unclear guidance and over-generalized recommendations. If you see an application note or a reference design that recommends placing a ferrite in a PDN, should you follow this in your specific design, or should you ignore this and focus on adding capacitance?
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative webinar, we’ll review some of the must-have checks before sending your output data for fabrication.
Before your board can be put into production and prepared for assembly, you have to generate a set of files that assist your manufacturer. These are your PCB design output files, also known as manufacturing files, fabrication data, assembly files, and a host of other names. Before you send your design file off to a manufacturer in an email, make sure to get a list of their required fabrication and assembly files first. If you’re a new designer, take some time to read over the basic PCB manufacturing file extensions below.
Transformers can provide very effective signal isolation and are used to manipulate AC voltage and current levels. They can achieve all this with a greater than 95% power efficiency, which is why we commonly see them used in bench power supplies, audio gear, computers, kitchen appliances, and wall-warts. However, transformer theory can be unintuitive and in this article we answer on questions about them
There are all sorts of version control systems (VCS) out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
Controlled impedance routing at high frequencies is difficult enough, and it's important to make sure that you stay within your loss budget on long routes or in lossy media. When you have to route a long trace or a long differential pair to a connector or another component, what can you do if you're reaching the end of your loss budget? In this article, we’ll take a look at the skip reference routing method and explain how it can help recover some loss budget in a lossy interconnect.
What most people don’t seem to grasp is that every aspect of the PCB is critical. It all plays a significant part in the operation of the final product. The layer stack is no different. We need to keep in mind materials and the intricacies therein, including thickness, weave, dielectric constants, and more. A proper layer stack is needed for each and every design, so it's important to know how to navigate the layer stack manager and all of its features.
We are pleased to announce that Altium 365 is officially SOC 2 Type 1 certified. System and Organization Controls (SOC) 2 is a widely recognized attestation of security compliance defined by the AICPA and is considered the standard for ensuring data security and operational maturity. A SOC 2 certification provides valuable information for companies to assess the quality of the security provided by a service such as Altium 365.
It’s no secret that component shortages have become more frequent this year. Companies will continue to grapple with supply chain challenges into 2022 and beyond. The impact of manufacturing delays can be substantial if a part is not available. Delays occur and sales plans get put on hold. It can also be very expensive and risky to replace parts from multiple sources. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
Explore how Model-Based Systems Engineering (MBSE) integrates with digital twins to enhance design accuracy, collaboration, and lifecycle management in modern engineering projects. This approach bridges the gap between physical systems and digital models, enabling real-time simulation and optimization.
The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.
Altium Designer 25 introduces groundbreaking features for seamless collaboration and precision in PCB design, from PCB CoDesign to advanced simulation and MCAD tools. Discover how AD25 is transforming electronic product development.
Explore the future of wire bonding, from new applications to cost-saving trends, in this article by Samer Aldhaher. Stay updated on key innovations in this essential connection technology.
Discover how Altium 365’s Jira integration can streamline collaboration and keep projects running smoothly with real-time design updates and task tracking. Perfect for teams seeking efficiency!
Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.
Resistors are fundamental components in electronic circuits, essential for controlling current and voltage. This article explores their basic principles, types, and key applications, helping you understand their crucial role in electronics.
Efficient PCB design is crucial for avoiding costly delays in product development. This article offers practical tips and best practices for PCB designers to streamline their workflows, minimize errors, and ensure timely project completion.
Signal integrity is the backbone of high-speed digital systems. In this new article by Rafał Stępień, we break down signal reflections and how to optimize your designs with effective impedance matching techniques.
In the second article of the "Mastering EMI Control in PCB Design" series Dario Fresu explores how effective component placement can reduce electromagnetic interference (EMI) in printed circuit boards. He highlights strategies such as board segregation and careful management of high-speed signals and their harmonics to ensure signal integrity and minimize emissions.
Check out this article where Rafał Stępień dives into the essentials of maintaining signal integrity in high-speed digital systems. Discover key techniques like controlling signal reflections, reducing crosstalk, and designing differential pairs in Altium Designer 24 to ensure reliable and efficient PCB performance.
The Requirements & Systems Portal is now live in Altium 365! Engineers can write, manage, and verify requirements within the Altium 365 workspace. You can link your requirements directly to schematics and PCB designs to ensure all engineers are working with the latest data. Request access today!
Looking to enhance signal integrity in your PCB designs? Check out our latest article by David Marrakchi, where he shares key strategies and best practices for achieving reliable high-speed designs.
Check out our article, where Lawrence Romine shares his top tools for conducting efficient Bill of Materials (BOM) reviews in PCB design. It highlights key features in Altium 365, Octopart, and ActiveBOM that help engineers avoid unsourceable components and streamline procurement.
As the first article in the "Mastering EMI Control in PCB Design" series from our new asset Dario Fresu, this piece explores signal propagation in PCBs, highlighting the crucial roles of impedance, dielectric materials, and trace geometry in maintaining signal integrity.
Discover essential strategies for high-speed PCB design, focusing on signal integrity, EMI mitigation, and thermal management. Our latest article provides insights on managing crosstalk, optimizing grounding, and addressing thermal challenges to ensure reliable PCB performance.