News & Updates
![Designing the Next-Generation Electronics](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-31_150423431.png?itok=CA7NyAeu)
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
![Pin-package and Via Delay Values](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-31_150006500.png?itok=Sf7apWJF)
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
![6-Layer PCB Design](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-24_155543750.png?itok=Oci2k83j)
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
![Component Management](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-24_155402092.png?itok=cj55mPfq)
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
![Altium Designer Interface](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-05/screenstabbed_1653481889324.png?itok=jaDnrfLx)
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
![Are Hybrid PCB Stackups Reliable?](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-24_155210037.png?itok=qIY2Qf3r)
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
![Monte Carlo vs Sensitivity Analysis](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-16_160417480.png?itok=GyfF0yn_)
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
![Simulation, Build and Test](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-16_160231047.png?itok=j2PQ6bvX)
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
![Collaborators Visualization](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-11_144558302.png?itok=7BzaJgfL)
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
![Component Creation](/s3/files/styles/video_homepage_teaser/public/2022-05/%D0%B8%D0%B7%D0%BE%D0%B1%D1%80%D0%B0%D0%B6%D0%B5%D0%BD%D0%B8%D0%B5_2022-05-11_144109981.png?itok=tlnJWGDj)
Component creation is a necessary evil when it comes to design, and it’s something we all need to do. But instead of spending hours creating your components and having them turn into a complete roadblock, let it be just a simple bump on the road. Altium Designer has several tools available to you in order to create the different aspects of a component, including the symbol, footprint, 3D model parametric data, supply chain information, and more
![Guide to Monte Carlo in SPICE](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-05/The%2520Basics%2520of%2520Monte%2520Carlo%2520in%2520SPICE%253A%2520Theory%2520and%2520Demo-79761.jpg.png?itok=aTfhelbl)
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
![Multi-board and Harness Design Capability in Altium Designer 23](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2023-01/Multi-board%20and%20Harness%20Design%20Capability%20in%20Altium%20Designer%2023-82471.jpg.png?itok=2eEHe3KV)
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
![MLCC controlled ESR capacitor](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2023-01/Controlled%20ESR%20Capacitors-%20Should%20You%20Use%20Them%20for%20Power%20Integrity%3F-76898.jpg.png?itok=PcvfQPz5)
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
![chip with neon illumination](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/How%20Does%20the%20Package%20PDN%20Impact%20Power%20Integrity_-82724.jpg?itok=U365ZE0Z)
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
![electrical circuit with microcontroller](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Designing%20Custom%20Hardware%20with%20Microcontrollers-81688.jpg?itok=0mTmNyJk)
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
![high-speed printed circuit board](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Guide%20to%20Low-Dk%20PCB%20Materials-82663.jpg?itok=CTezZAyt)
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
![freeway in the background of the city](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Designing%20for%20V2X%20Communication_%20Wireless%20Protocols%20and%20Standards-82650.jpg?itok=Ws3u8cyq)
If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
![Everything You Need to Know About Stitching Vias](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Everything%20You%20Need%20to%20Know%20About%20Stitching%20Vias-82675.jpg?itok=LxPqBjOL)
This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
![IPC-2221 Calculator for PCB Trace Current and Heating](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/IPC-2221%20Calculator%20for%20PCB%20Trace%20Current%20and%20Heating-82694.jpg?itok=CHNOHqge)
The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
![All About Box Build Assemblies](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/All%20About%20Box%20Build%20Assemblies-82618.jpg?itok=FMe2gjXt)
When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
![Ultra-HDI Technology is Not New](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-12/Ultra-HDI%20Technology%20is%20Not%20New-82575.jpg?itok=OTP4fOIk)
Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
![Today's PCB Designers Are Driving Electronics Product Design](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Today%26%23039%3Bs%20PCB%20Designers%20Are%20Driving%20Electronics%20Product%20Design-82476.jpg?itok=NfVsIZZL)
What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
![Phased Array Antenna Design for 5G Applications](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Phased%20Array%20Antenna%20Design%20for%205G%20Applications-82475.jpg?itok=s3eKfQlq)
As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
![IPC - Vias](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/IPC%20-%20Vias-81221.jpg?itok=ahLw-TLG)
Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
![Power Integrity Analysis in Your PCB Design Software](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Power%20Integrity%20Analysis%20in%20Your%20PCB%20Design%20Software-76536.jpg?itok=v41xgXSm)
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
![Schematic Compare](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Schematic%20Compare-81220.jpg?itok=_Jgm1NE6)
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
![Embedded Capacitance Materials Overview](https://files.my.altium.com/sites/default/files/styles/video_homepage_teaser/public/2022-11/Embedded%20Capacitance%20Materials%20Overview-82421.jpg?itok=bzsu_a56)
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.