News & Updates
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.
Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.
Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.
Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.
Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.
Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier
There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
With Altium 365, you can grant permission to teams or users based on the specific needs of a project. We have expanded Altium 365’s file-sharing setting, giving you more granular control over who can download source files and reshare projects with others
Learn why BOM management is critical for both procurement managers and electronic engineers. Altium 365 BOM Portal helps to bridge the gap between these worlds. Discover how!
Happy New Year! 🎉 We are thrilled to announce that the Altium 365 Assembly Assistant is now officially released and available for direct purchase through the Altium Store.
Creating documentation for hand PCB assembly does not prevent the same documentation from being utilized to assist in automated PCB assembly. Learn more about the optimal format for this data to enhance both your hand PCB assembly and overall assembly processes.
Explore the powerful features of Altium Designer 24! Experience Constraint Manager and revolutionize your PCB design with reusable constraint sets, schematic-to-board rule transition, easy class and differential pair grouping, and more.
Curious about how to solve production blockers before they derail your product launch? Explore how Altium 365® can help you swiftly manage last-minute design changes.
We are advancing our Open Source Laptop project to the next stage: assembling lid electronics. In the first part of this phase, we are focusing on the electronics and PCB design of the webcam module.
The efficiency of production lines is crucial for any successful hardware product development. However, some challenges derail these processes. Do you face these problems, too? Let’s find out!
3D-MID technology seamlessly integrates electrical circuits with three-dimensional mechanical parts. This unique fusion of functionality unlocks a myriad of possibilities across various application areas. Explore more about this innovative feature, available in Altium Designer 24, to delve into the fascinating world of the 3D design process.
The PCB design process is always an exciting journey for a designer or the founder of a project. The first run of it can be breathtaking. In this article, we delve into strategies for minimizing PCB damage in the case of an exemplary circuit.
Explore the hidden impact of fragmented feedback loops in PCB design and testing. Check how minor communication gaps lead to significant financial burdens and learn how to address them.
Would you like to improve the protection of your data? Altium 365 GovCloud can help you achieve these goals. It’s a version of Altium 365, engineered to meet the stringent demands of US government regulations.
We are heightening the anticipation for our Open Source Laptop project. In this chapter, we delve into the ambient light sensor module. Learn more about how to implement it into this project.
Experience accelerated design collaboration with PCB CoDesign, exclusively available on Altium Designer starting from December 13th. This innovative feature adopts a collaborative approach by seamlessly integrating schematic and PCB design, enabling multiple engineers to work on the same project. Explore this cutting-edge feature on our newly launched page dedicated to its functionalities.
Learn the key lessons from the presentation at Iteration22; “Joe Justice, Wikispeed - Everyone Must Be a Chief Engineer at SpaceX.” Read on and discover how to speed up the development of complex products.
We are continuing our journey into lid assembly mechanics inside the Open Source Laptop Project. In this chapter, we are focusing on the sensor PCB above the display panel.
Are you struggling with your manual assembly process? Would you like to speed it up and improve component placement accuracy? Read the story of XVP Photonics; with Assembly Assistant, they improved the component placement time by 25%. Discover how!