News & Updates
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
Component creation is a necessary evil when it comes to design, and it’s something we all need to do. But instead of spending hours creating your components and having them turn into a complete roadblock, let it be just a simple bump on the road. Altium Designer has several tools available to you in order to create the different aspects of a component, including the symbol, footprint, 3D model parametric data, supply chain information, and more
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.
Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.
Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.
Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.
Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.
Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier
There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?
The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.
For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs. If you’ve ever wondered how these decisions are made and when to use each type of regulator, just know that there is more to this decision than simply looking at the input/output voltage/current.
PCB fabrication is an extremely complex technological topic that deserves recognition as the most fundamental part of PCB engineering. Unless connectors, conductive adhesive, wire-bonding, or zebra-tape are used, in the modern electronics industry it’s always necessary to use some kind of flux during the soldering process to create an electric connection. In this article, we’ll discuss fluxes — what they are, what they are made of (yes, there is going to be a lot of chemistry, don’t be scared), how they should be used, and in what direction the industry is going.
As anyone who designs and builds electronic devices knows, the device will generate heat when it’s switched on. Wherever current flows through an impedance, energy losses will manifest themselves as heat. Integrated circuit packaging is getting smaller to meet the trend for more compact devices but at the cost of poorer thermal properties. This article describes the basic thermal management approaches to consider in your next designs.
We continue to explore the magic of energy conversion in a PWM transducer. Why is it magic? Theoretically, in a PWM transducer this happens without losses, isn't that magic? A PWM transducer, like a tailor with scissors, cuts the “fabric of energy” into pieces, and then, like a sewing machine, stitches the pieces of energy into a dress - DC Magnitude. What is a constant component and how can we get it? Let's explore!
There are different techniques in the world of technology to achieve various goals, both final and intermediate. Some techniques are so successful that they are commonly used with high efficiency. Electronics is no exception. The greatest example is the use of Pulse Width Modulation (PWM) signals (energy), which is applied in any modern electronic device. To apply PWM effectively, it is necessary to understand the engineering difficulties that engineers faced in the past, and the thoughts and ideas that subsequently were combined into effective, complete PWM power solutions.
If you speak with a bunch of design engineers, you might quickly form the opinion that the electrolytic capacitor has a particularly dubious reputation. A faulty electrolyte mix used in these types of capacitors led to premature device failures, and quite often, a “bit of a mess” was made to the PCBs on which they were soldered. However, despite the problem of the capacitor plague, this article is focusing on helping the designer understand how to get many more years of useful life from an electrolytic capacitor.
A schematic drawing will not only tell your PCB design software what needs to connect where, but it also communicates the purpose of a circuit to other people. It’s easy to create a schematic, but it can be harder to make a helpful schematic that can be quickly and easily read and comprehended by the reader. In this guide, based on years of industry experience, we will show you how to improve your schematic layout so that your designs are elegant and readable.
Suppose your job involves rapidly iterating designs or creating a wide variety of products for clients. In that case, there are some essential tools available that can save you a tremendous amount of time, bringing high engineering risk devices to completion successfully. Whether you’re working on internal projects or developing high mix devices for clients as a consulting or freelance firm, these indispensable tools will help you ship a higher quality product in less time.
Even though today’s cloud platforms are immaculately secure and they allow a range of files to be easily shared, there are times where you should limit the data you’re sharing to only the critical files required. For PCB designers, this means either sharing entire design projects or sharing individual files with your manufacturer, customers, contractors, or collaborators. If you want to eliminate liabilities and keep your team’s design data secure, consider these best practices for sharing PCB design data with Altium 365.
Best component companies will release reference designs for their new and legacy products to show designers an example application for a component. If the reference design is good enough and it very nicely illustrates how to quickly engineer around a few main components, I’m likely to use them in the design and the component maker has just earned my business. If you’re a newer designer and you’re wondering whether reference designs are right for your next project, follow these best practices so that you don’t make any mistakes with your reference design.
When we deal with “abstract” aspects of electromagnetic fields and how they function, it can be easy to get lost in the weeds regarding them. The first part of this article will address an important aspect of transmission line fundamentals, namely how electromagnetic fields and waves propagate on a transmission line. This article’s end goal is to create a core understanding of these concepts so that when it comes time to design a PDS, the proper design methodologies are followed and a properly working PDS is achieved appropriately, the first time and every time.
Via stubs are sometimes viewed as an annoyance, especially when you only need to make a transition between adjacent layers. For low speed, less-dense boards with low layer count, via stubs are an afterthought, or they may not receive consideration at all. For faster edge rates/higher frequencies, the conventional wisdom is to remove all via stubs. The question is: what exactly counts as “high frequency,” and how do you figure out the relevant length?
Unlike the clumsy human finger, a thermal camera can detect minute temperature differences across its view. This allows you to rapidly identify any components that are consuming current. Any parts or areas of your board that draw current will also generate heat that can easily be picked up by a thermal camera.
I want to share a little secret with you in this article: Assembling SMT prototypes boards is not only easy, but it requires very little equipment. Using just a stencil, I can easily hand prototype down to 0.3 mm pitch ICs, and 0201 (imperial) sized passive components. If you’re currently hand assembling boards with a soldering station, you need to stop this immediately and start using a stencil instead!