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Design Reuse
On-Demand Webinar •
Rapidly Creating New Designs And Reusing Existing Ones

It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.

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Length Tuning Impedance
Blog •
What is the Impedance of Length-Tuning Structures?

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

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How to create a Schematic Symbol •
Creating a Schematic Symbol - Placing Designators and Comments

Placing your designator or comments can be done automatically, but that doesn’t mean they’re visible. We’ll walk you through how to make them visible and position them correctly no matter what orientation your symbol is with automatic positioning.

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Embedded thumbnail for Creating a Schematic Symbol: Adding Additional Parts
How to create a Schematic Symbol •
Creating a Schematic Symbol: Adding Additional Parts

Altium Designer makes it easy to add additional parts to your schematic library. We’ll show you how through copying and configuring your new components through the Pin Editor and the properties panel.

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Designing the Next-Generation Electronics
Blog •
A-SAP™ – What do you need to know?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

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Embedded thumbnail for Component Placement Control Using Rooms
How to work with Rooms •
Component Placement Control Using Rooms

Rooms give you more control over how and where your components are placed in your PCB. We’ll show you how to use room properties to limit what is allowed in and out of a room using the room definition and custom queries.

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Pin-package and Via Delay Values
Blog •
Pin-Package Delay and Via Delay in High Speed Length Tuning

Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.

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How to Work with Differential Pairs •
How to work with Differential Pair Classes?

Modern boards can contain a large number of differential pairs. For convenience, they are combined into differential pairs classes. In this video, we'll walk you through how to create and apply a differential pair class. 

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Embedded thumbnail for Adding Rooms from the Schematic
How to work with Rooms •
Adding Rooms from the Schematic

Rooms can be added directly from the schematic sheet. From the schematic sheet they are pushed to the PCB. Here we'll look at the rooms and component classes generated by default in the schematic, how to add and configure rooms manually, and how to push them to the PCB.

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6-Layer PCB Design
Blog •
6-Layer PCB Design Guidelines

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.

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Component Management
On-Demand Webinar •
Help Ensure The Best Designs With Component Management

There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.

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Altium Designer Interface
Blog •
Altium Designer 22.5 Update

We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

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Are Hybrid PCB Stackups Reliable?
Blog •
How Reliable is Your Hybrid PCB Stackup?

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.

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Embedded thumbnail for How to Draw a Board Outline Using Coordinates
How-To's •
How to Draw a Board Outline Using Coordinates

In this video, we cover how to draw a curve by using coordinates. This can be very helpful when creating a board outline.

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Embedded thumbnail for Creating a Schematic Symbol: Mapping out the Component
How to create a Schematic Symbol •
Creating a Schematic Symbol: Mapping out the Component

When creating a schematic symbol, one of your first tasks will be creating a component symbol. We’ll show you how to map out a component in the Schematic Library Editor by creating and configuring the component, adding pins, and creating graphics.

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Monte Carlo vs Sensitivity Analysis
Blog •
Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.

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Embedded thumbnail for How and When to Use Rooms
How to work with Rooms •
How and When to Use Rooms

Rooms are an extremely valuable tool within the Altium Designer PCB environment, but how and when do you use rooms? If you need to control component placement and layout, assign a specific design rule to a group of items, or if you have repeated channels that need similar layouts in your multichannel design, rooms can make it much easier.

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Simulation, Build and Test
Blog •
Creating Continuous Integration Pipelines for FPGAs

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.

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Working with MCAD CoDesigner extension •
MCAD CoDesigner Quick Start: Autodesk Fusion 360

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and Autodesk Fusion 360. 

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Embedded thumbnail for Component Placement Control for DFM
DFM and Fabrication Cost/Time Constraints •
Component Placement Control for DFM

Component placement is a crucial part of making sure your design is manufacturable, so you need to be able to control placement. We’ll show you how, through rules and courtyard layers to maintain accessibility and manufacturability in your entire design through component placement control.

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Blog •
Concept Phase – Initial CAD Design

We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.

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Blog •
High-Speed PCB Design Tips

Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.

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Introduction to Open Source Laptop Project
Blog •
Introduction to Open Source Laptop Project

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

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Blog •
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

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Blog •
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

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Blog •
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

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Blog •
Which Types of Opto-Isolators Are Right For Your Signal?

An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?

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Blog •
Properties panel document options in SCH editors

The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.

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High-Speed PCB Stackup Design
Blog •
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

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stitching vias
Blog •
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

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PCB Stackup Basics
Blog •
PCB Stackup Basics

In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.

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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA •
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA •
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA •
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Embedded thumbnail for Via Shielding and Stitching
Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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Embedded thumbnail for Working with Design Variants
How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects •
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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How to Work with Multichannel Schematic •
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

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Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects •
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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