News & Updates
Blog
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
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Creating Continuous Integration Pipelines for FPGAs
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
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Soft Locks [Conflict Prevention] in Altium 365
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
On-Demand Webinar
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Increase Productivity With Easy Component Creation
Component creation is a necessary evil when it comes to design, and it’s something we all need to do. But instead of spending hours creating your components and having them turn into a complete roadblock, let it be just a simple bump on the road. Altium Designer has several tools available to you in order to create the different aspects of a component, including the symbol, footprint, 3D model parametric data, supply chain information, and more
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Why the Principles Are Sound, but the Tactics Need a Re-Think
Explore common principles and rituals of Agile and how you can adapt them to hardware product development.
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Pi.MX8 Project - Board Layout Part 1
Our exploration of the Pi.MX8 open-source computer module project progresses. In this third chapter, our focus shifts to the PCB layout preparation of the board. Key topics include defining the layerstack and component break-out routing.
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PCB CoDesign Whitepaper
Design faster together with the innovative PCB CoDesign feature, exclusively available in Altium Designer. This cutting-edge functionality seamlessly integrates schematic and PCB design, facilitating concurrent work by multiple engineers on the same project. Learn more about this groundbreaking feature in our comprehensive manual.
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How to Test Suspect Electronic Components
Electronic components power nearly everything in our modern lives. However, as long as there are buyers for parts, counterfeiters will persist in their endeavors. Financial losses resulting from fake components are challenging to ascertain due to enforcement limitations and the difficulty in collecting data on the issue. In this article, we demonstrate how to test and verify components in batch orders.
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The Positive Impact of Supply Chain Visibility on Design to Cost
With increased electronics supply chain visibility, you can develop better products faster and align perfectly with budget constraints early on. Here’s why.
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What Most Agile "Gurus" Get Wrong About Hardware Development
Explore common myths about Agile hardware development and learn how to adapt Agile principles for hardware projects.
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Design Phase – Lid Assembly Electronics Part 2
We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.
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Compare Commercial Altium 365 vs Altium 365 GovCloud
If you're trying to understand how commercial Altium 365 differs from Altium 365 GovCloud, you're in the right place. Click to grasp the unique features of each.
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5 Ways Hardware Development Is Just… Different
Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.
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Flexible Circuit Assembly: Thinking Through Component Placement
The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.
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Coding Your Own Networked Test Equipment
Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.
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Pi.MX8 Project – Schematic structure and component placement
We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.
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Redefine PCB Boundaries with HDI Design
Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.
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OrCAD Design Collaboration in Altium 365
Ready to start collaborating on your OrCAD projects in a multi-CAD environment? Check how you can use Multi-CAD File Support in Altium 365 in practice.
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The Critical Role of Constraint-Based PCB Design in Modern Electronics
A constraint-based approach to PCB design is crucial in today's electronics industry. This article delves deeper into this complex and interesting topic, exploring various types of constraints, their advantages, and providing guidance on implementing them into your PCB design process.
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Pi.MX8 Project – Introduction and Overview
Do you have extensive knowledge about the Pi.MX8 module? We're excited to introduce a new series of articles focusing on an innovative approach to utilizing this module. In this inaugural chapter, we provide insights into the preparation for this project and detail the elements that will be used.
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