News & Updates

Check out the video where we showcase enhanced wire bonding features, including precise bond wire shape definition, improved clearance checking, streamlined import and export workflows, and efficient management of wire bonding objects.

You can now precisely control what design data is included in your ODB++ outputs for different manufacturing recipients. Choose which signal layers to export, decide how the netlist is handled (included, disabled, or neutralized), and control whether component data is removed or shared without properties.

Watch our latest customer success story to see how Proper Voltage partnered with Altium to accelerate high-power battery development for next-generation robotics. With our software, they streamlined collaboration, sped up design reviews, improved sourcing visibility, and reduced risk.

You can now control the vertical spacing of a pin’s designator and name with a custom margin. This setting can be applied globally via Schematic Preferences or adjusted individually in the Pin properties.

Our new video tackles common questions about capacitor placement on a PCB. Expert Zach Peterson explains why placement is often less critical on multilayer boards with well-designed power and ground planes and shares the key insights most application notes leave out.

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Support has been improved so that jumper wires connecting two cavities within the same connector are now properly shown in Layout Drawings, making the connector wiring easier to understand during documentation and review.

Watch our brand-new video where we tackle the persistent issue of outdated PCB design guidelines still found in datasheets and application notes from major semiconductor manufacturers. Drawing on viewer comments, real-world datasheet examples, and insights from industry experts, we examine why recommendations such as splitting analog and digital ground planes (an approach rooted in the 1980s) continue to circulate despite their potential to cause EMC failures, signal integrity problems, and costly redesigns.