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Blog •
Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan

Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.

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Altium Stories •
How Benchmark Unifies Hardware Development with the Altium Platform

Discover our latest customer success story and see how Benchmark streamlined hardware development using the Altium Platform. By leveraging a unified environment with real-time data, synchronized ECAD-MCAD workflows, and built-in collaboration tools, their engineering teams eliminated manual handoffs, improved cross-domain visibility, and accelerated project delivery while staying perfectly aligned.

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Blog •
PCB Design Process: The EDA Design Approach

Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.

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How-To's •
ESP32-S3 Design Deep Dive: Power, RF, and Layout Best Practices

Explore our detailed design review of a custom ESP32-S3 PCB. This four-layer board is built around the ESP32-S3 microcontroller chip (not the standard module) and includes an integrated LiPo charging circuit, USB-C with data line protection, NCP voltage regulators, and a ceramic chip antenna with a properly tuned impedance matching network.

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Blog •
Getting Started for Mechanical Engineers

Explore our collection of MCAD Collaboration walkthroughs, where you’ll discover how to synchronize mechanical constraints and keepouts, maintain traceability with advanced history and revision control, and streamline electromechanical connectivity through harness synchronization. These topics and many more are covered in this article.

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Altium Stories •
Working as One for What Matters Most | How Benchmark Unifies Engineering Teams

See how Benchmark Electronics uses Altium’s collaborative hardware development platform to unify its electrical, mechanical, and software engineering teams. By replacing manual processes, disconnected tools, and siloed workflows with a shared workspace, Benchmark unlocked a new way of working.

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Blog •
Are Your ECAD Tools Holding Back Engineers’ Productivity?

The article highlights that productivity issues often stem from tool limitations rather than engineer effort, especially as project complexity grows. ECAD tools that offer clear version control, cross-discipline integration, and workflow awareness are key to sustaining efficiency.

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How-To's •
PCB Design Tips to Improve RF Power Amplifier Layout

Take a deeper look at RF power amplifier PCB design as we expand on our original 6 GHz RF signal generator tutorial with an in-depth design review. Discover essential layout optimization techniques such as switching regulator routing, feedback loop placement, stitching via implementation, and effective copper balancing.

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Altium Stories •
How Altium's Assembly Assistant unifies Quantum Systems' Dev Process

Quantum Systems develops unmanned drone systems for aerial intelligence and rapid, field-ready innovation. With the Assembly Assistant, their team streamlined a once tedious prototype build process, eliminating manual exports, file conversions, and unnecessary guesswork.

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How-To's •
Creating Stacking Stripes for PCB Fabrication: Altium Tutorial

Watch our new tutorial where we demonstrate how to place stacking stripes along the edge of a PCB and configure design rules to control clearances. In this video, you’ll learn how to create a dummy net, use the query system to apply rules specifically to stacking stripes, and leverage split planes on internal layers.

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How-To's •
Empower Your Designs with Advanced Power Analysis

Power Analyzer brings clarity. Agile Teams brings control. Combined, they help teams deliver reliable hardware with confidence.

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Blog •
7 Ways to Catch Rules & Constraints Early – Checklist

Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.

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How-To's •
Component Selection Process Tips for PCB Design

Explore our new component selection tutorial and learn Zach Peterson’s proven approach to finding and choosing parts that take your electronic designs from good to exceptional.

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Blog •
Do You Need an IPC-D-356 Netlist?

If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.

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How-To's •
Signal Analyzer by Keysight Promo Video

Design faster, collaborate smarter, and catch signal integrity issues early with Altium Agile Teams and the Signal Integrity Analyzer by Keysight — both integrated directly into Altium Designer Agile. Check out our new promo video to learn more.

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How-To's •
NFC Reader Testing: Flashing and Validating the Project

Join Zach Peterson as we build and test an NFC reader board from start to finish. You’ll see how a custom NFC reader goes from manufacturing to working hardware, with step-by-step guidance on firmware flashing, power checks, and RFID tag detection.

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Blog •
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

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Blog •
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

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Blog •
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

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Blog •
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

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Blog •
Essential DFM Tips for Aerospace Projects

Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.

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Altium 365 New Website
Blog •
Altium 365 now has its own website!

Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
 

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Blog •
Altium Designer: Leading the Charge in PCB Design Innovation

In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.

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Blog •
What Is Solder Mask Expansion and Which Value Should You Use?

Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.

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Blog •
Pi.MX8 Project - Board Layout Part 3

We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.

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Blog •
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

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Blog •
Make Sure to Clean Your No-Clean Flux

No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.

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How to Design a BGA •
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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How to Design a BGA •
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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How To Work with High-Speed Projects •
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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How to Work with Multichannel Schematic •
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

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Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects •
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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How to work with Snippets •
Schematic Design Reuse Using Snippets

Snippets allow you to easily reuse circuitry across multiple parts of your designs. We’ll show you how create a new snippets the Schematic and how to connect and annotate it so you can easily bring your circuitry directly into your board.

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