News & Updates
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.
The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.
As much as we would like to build every high speed PCB perfectly, with ideal SI/PI/EMI characteristics, it isn’t always possible due to many practical constraints. Sometimes a stackup can be “good enough,” even for a high-speed PCB. This always comes from the need to balance engineering constraints, functional requirements, and the need to ensure signal and power integrity in a high-speed design, and finally to ensure compliance with EMC requirements.
When it's time to release your project to your manufacturer, it's essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing response, time-consuming rework, or unintentional defects that can make it into the final product.
Involving the whole team that will bring a product to completion early on in the development cycle is vital to efficient development. Design reviews with all the relevant parties are critical at each step of the design process, starting with high-level component selection, then through the schematic capture and PCB layout stages.
Ergonomics and convenience are important issues when designing a printed circuit board and the device as a whole. A lot of Altium Designer tools are aimed at solving them. These include Countersink and Counterbore holes, which allow the use of various types of screws in the mounting holes of the board.
The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. When filling a project with data, a user creates new files, modifies outdated files that have become irrelevant. Managing project data is a separate task, especially for large developments where several participants with different specializations are involved in the process.
Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.
I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?
If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.
If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.
There are many times where you need an amplifier with high gain, low noise, high slew rate, and broad bandwidth simultaneously. However, not all of these design goals are possible with all off-the-shelf components. Here are some points to consider when working with a composite amplifier design and how to evaluate your design with the right set of circuit simulation tools.
Simple switching regulator circuits that operate in compact spaces, like on a small PCB, can usually be deployed in noisy environments without superimposing significant noise on the output power level. As long as you lay out the board properly, you’ll probably only need a simple filter circuit to remove EMI on the inputs and outputs. As the regulator becomes larger, both physically and electrically, noise problems can become much more apparent, namely radiated EMI and conducted EMI in the PCB layout.
A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.
As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.
If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.
Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability
Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.
In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.
One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.
Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?
Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.
When some designers start talking materials, they probably default to FR4 laminates. The reality is there are many FR4 materials, each with relatively similar structure and a range of material property values. Designs on FR4 are quite different from those encountered at the low GHz range and mmWave frequencies. So what exactly changes at high frequencies, and what makes these materials different? To see just what makes a specific laminate useful as an RF PCB material, take a look at our guide below.