News & Updates
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.
Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.
Discover how Penn Electric Racing builds award-winning, fully electric racecars with Altium 365, pushing the boundaries of technology and design.
No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.
Simulation of electronic circuits is a key factor in the success of your design. A SPICE circuit simulator may be used to speed up the design analysis. Learn more about how Altium Designer can help you with automated measurements, saving you time and money during the design process.
Check out our refreshed feature page about Rigid-Flex PCB Design and see how Altium Designer’s unified environment can help you manage this kind of project with no limitations or additional licensing required.
Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.
Discover six challenges of managing disconnected PLM workflows in electronics product development. Identify your main challenge and find the solution here.
In this article, we will examine specific cases involving these types of components, where a very low-frequency signal or a DC signal needs to be measured, and the return path must be tracked to ensure the current loop is tight.
Replicate your circuits across multiple blocks with just a few clicks using a flawless preview pane, ensuring consistent, perfect results without the need for trial and error. Check out our new article on the PCB Layout Replication feature.
Pin headers are common components in PCBs, yet one specification often overlooked is the plating material. Discover more about plating materials for electrical connectors in our latest article.
In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.
Magnetic components driven by an AC signal can exhibit an irritating property due to magnetostriction - an effect causing vibrations in magnetic materials, resulting in audible sound. Explore this phenomenon further and discover methods to minimize its impact.
Dive into a dynamic design experience where you can visualize and edit your circuits in true 3D, offering unparalleled precision. Altium Designer's 3D-MID (Mechatronic Integrated Device) Design tool revolutionizes the design process, providing a fresh perspective. Explore the capabilities and benefits of this feature in our comprehensive guide.
In today's world, many products utilize multiple PCBs interconnected with each other, often leading to a complex network of cables within an enclosure. The most effective way to manage these wires and cables is by constructing a wiring harness. This article explores the various types of harnesses used in electronics.
Z2Data Integration in Altium 365 offers a practical way forward for engineering and procurement. Here are the top five advantages that can streamline your workflows.