Welcome, Guest

Sign in to learn, create, and do more with the product you love.

News & Updates

Filters:
Tag
Blog
Ideal Rectifier Bridge

Read Marcin Lewandowski's article explaining how MOSFETs are replacing traditional diodes for reverse polarity protection. Step into the future of energy-efficient electronics!

Embedded thumbnail for Ferrite Bead Circuit Model Parameters Deep Dive
How-To's
Ferrite Bead Circuit Model Parameters Deep Dive

Check out our new video where host Zach Peterson explains how to calculate resistance, inductance, and capacitance for ferrite bead models. From analyzing impedance curves to using SPICE simulations and a custom Excel calculator, discover practical techniques for accurately modeling ferrite bead behavior.

Blog
Overview of the Gerber X3 File Format

Want to learn how the Gerber X3 file format simplifies data exchange by unifying assembly and fabrication details in a single file? This article explores the format and its role in streamlining PCB manufacturing.

Blog
Mastering EMI Control in PCB Design: How to Design PCBs for Low EMI

This article by Dario Fresu delves into effective techniques for designing PCBs to reduce electromagnetic interference (EMI). It covers key topics such as stackup selection, routing strategies, and grounding best practices, offering actionable insights for improved performance.

Embedded thumbnail for How to Design a PCIe Edge Card
How-To's
How to Design a PCIe Edge Card

Watch our new video where Zach Peterson walks you through designing a PCIe edge card. Learn about mechanical specifications, pinouts, creating templates in Altium Designer, and extending an 8-lane PCIe card to a 16-lane configuration—all with practical tips and a ready-made template!

Embedded thumbnail for Wire Bonding in Altium Designer: Features and Capabilities
New in Altium Designer 25
Wire Bonding in Altium Designer: Features and Capabilities

During the Hardware Design Masterclass Conference in Wrocław, we showcased the Wire Bonding feature. Samer Aldhaher delivered a presentation, and now we're excited to premiere it on YouTube. This session explores the Wire Bonding feature and includes a live demo highlighting its basic capabilities.

Embedded thumbnail for Unlock New Design Possibilities with Wire Bonding - Recording Preview
New in Altium Designer 25
Unlock New Design Possibilities with Wire Bonding - Recording Preview

Explore how Altium Designer simplifies advanced PCB designs like 3D stacked die in cavity. From routing bond wires to generating complete project documentation, this on-demand webinar has you covered. Full recording is here: Wire Bonding Webinar Recording.

Blog
Happy Holidays!!!

Altium wishes you all the best this holiday season! May this time be filled with joy, laughter, and cherished moments with your family and friends. We also extend our warmest wishes for a Happy New Year 2025!

Embedded thumbnail for Industrial Design Meets Electronics Engineering
Altium Stories
Industrial Design Meets Electronics Engineering

Discover how engineering disciplines come together to create remarkable products with Altium’s powerful tools. Electronics, mechanical, and industrial design merge their expertise, as D+I, part of Capgemini, showcases their refined design process. See how diverse skillsets and Altium's solutions drive innovation.

Embedded thumbnail for Simplify Analysis with Power Analyzer by Keysight
How-To's
Simplify Analysis with Power Analyzer by Keysight

The Power Analyzer by Keysight in Altium Designer simplifies power design by enabling detailed analysis of power nets and PDNs. This demo highlights how to identify and resolve issues like voltage drops to ensure reliable power delivery, all within the Altium environment.

Embedded thumbnail for Perfect your high-speed routing with Dynamic Phase Matching!
New in Altium Designer 25
Perfect your high-speed routing with Dynamic Phase Matching!

Struggling with phase matching in your high-speed projects? Learn how Altium Designer 25’s Dynamic Phase Matching feature ensures precise signal integrity and simplifies high-speed design.

Embedded thumbnail for Hardware Design Masterclass Wrocław 2024 - Autumn Edition
HDM Wrocław
Hardware Design Masterclass Wrocław 2024 - Autumn Edition

Altium participated in the Hardware Design Masterclass Wrocław 2024, organized by Rafał Stępień. Representing Altium, Samer Aldhaher delivered a presentation on Wire Bonding in Altium Designer. This slideshow highlights key moments from the event.

Blog
What Is Wire Harness Design?

Explore our latest article to learn the fundamentals of wire harness design, its key components, and how it ensures organized, efficient, and reliable electrical systems across automotive, aerospace, and medical sectors.

Embedded thumbnail for Pi Filter Formulas and Simulation Deep Dive
How-To's
Pi Filter Formulas and Simulation Deep Dive

Learn the essentials of Pi filters, including how to size, design, and simulate them in Altium Designer. Host Zach Peterson explains the design equations for Pi filters, discusses online tools for accurate component selection, and demonstrates real-time simulations in Altium Designer to visualize the effects of impedance mismatches.

Embedded thumbnail for True Donut Pad Shapes
New in Altium Designer 25
True Donut Pad Shapes

Check out our brand-new short video showcasing an exciting improvement in the PCB design process. Altium Designer 25 now supports true donut pad shapes, enhancing both your routing and performance.

Embedded thumbnail for Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview
New in Altium Designer 25
Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview

Discover the new features in Altium Designer 25! This webinar recording highlights the Signal Analyzer by Keysight, advanced Wire Bonding capabilities, multi-board design enhancements, and more, showcasing how these tools can transform your PCB design process.

Tag
Blog
How Structural Electronics Enables 3D, Flexible, and Wearable Integration

Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.

Blog
Most Common Causes of PCB Assembly Rework and Scrap

Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.

Blog
Behind the Scenes with AI Embedded Development

Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.

Blog
We're heading to PCB West 2025!

Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.

Blog
Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

Blog
Executive Insights Into Electronic Product Development Gaps You Need To Close

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

Blog
Sourcing For High-Mix Low-Volume Electronics Manufacturing

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

Blog
One Vision, Three Powerful Solutions: Introducing Octopart Discover, Altium Develop, and Altium Agile

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Octopart Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Blog
The Top 5 Workflow Bottlenecks Slowing Down Mechanical Engineering Teams

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Tag
NEW
Embedded thumbnail for Improve Your 3D Wire Bonding Workflow
New in Altium's Software
Improve Your 3D Wire Bonding Workflow

Check out the video where we showcase enhanced wire bonding features, including precise bond wire shape definition, improved clearance checking, streamlined import and export workflows, and efficient management of wire bonding objects.

Embedded thumbnail for Customize Your ODB++ Output for Each Partner
New in Altium's Software
Customize Your ODB++ Output for Each Partner

You can now precisely control what design data is included in your ODB++ outputs for different manufacturing recipients. Choose which signal layers to export, decide how the netlist is handled (included, disabled, or neutralized), and control whether component data is removed or shared without properties.

Embedded thumbnail for Proper Voltage Built a Universal Battery Platform with Altium
Altium Stories
Proper Voltage Built a Universal Battery Platform with Altium

Watch our latest customer success story to see how Proper Voltage partnered with Altium to accelerate high-power battery development for next-generation robotics. With our software, they streamlined collaboration, sped up design reviews, improved sourcing visibility, and reduced risk.

Embedded thumbnail for Improve Readability with Custom Pin Spacing
New in Altium's Software
Improve Readability with Custom Pin Spacing

You can now control the vertical spacing of a pin’s designator and name with a custom margin. This setting can be applied globally via Schematic Preferences or adjusted individually in the Pin properties.

Embedded thumbnail for Does Decoupling Capacitor Placement Actually Matter?
How-To's
Does Decoupling Capacitor Placement Actually Matter?

Our new video tackles common questions about capacitor placement on a PCB. Expert Zach Peterson explains why placement is often less critical on multilayer boards with well-designed power and ground planes and shares the key insights most application notes leave out.

Embedded thumbnail for Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium
Altium Stories
Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

Embedded thumbnail for  Detect Z-Axis Clearance Issues Earlier
New in Altium's Software
Detect Z-Axis Clearance Issues Earlier

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

Embedded thumbnail for Fix Inconsistent Part Parameters in Your PCB Schematic
How-To's
Fix Inconsistent Part Parameters in Your PCB Schematic

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

Embedded thumbnail for Create IPC-Aligned Footprints with Less Effort
New in Altium's Software
Create IPC-Aligned Footprints with Less Effort

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Embedded thumbnail for Via Dispersion: Why Propagation Delay Changes with Frequency
How-To's
Via Dispersion: Why Propagation Delay Changes with Frequency

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Embedded thumbnail for Make Via Rule Configuration More Intuitive
New in Altium's Software
Make Via Rule Configuration More Intuitive

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

Embedded thumbnail for Coplanar Ground Done Right: PCB Design Best Practices
How-To's
Coplanar Ground Done Right: PCB Design Best Practices

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

Embedded thumbnail for Import and Export with Modern Mechanical Models
New in Altium's Software
Import and Export with Modern Mechanical Models

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

Embedded thumbnail for How to Input Via Delay in Altium for DDR Routing
How-To's
How to Input Via Delay in Altium for DDR Routing

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Embedded thumbnail for Clearly Show Jumper Wires in Your Harness Designs
New in Altium's Software
Clearly Show Jumper Wires in Your Harness Designs

Support has been improved so that jumper wires connecting two cavities within the same connector are now properly shown in Layout Drawings, making the connector wiring easier to understand during documentation and review.

Embedded thumbnail for Why Datasheet PCB Guidelines Are Often Wrong
How-To's
Why Datasheet PCB Guidelines Are Often Wrong

Watch our brand-new video where we tackle the persistent issue of outdated PCB design guidelines still found in datasheets and application notes from major semiconductor manufacturers. Drawing on viewer comments, real-world datasheet examples, and insights from industry experts, we examine why recommendations such as splitting analog and digital ground planes (an approach rooted in the 1980s) continue to circulate despite their potential to cause EMC failures, signal integrity problems, and costly redesigns.

Tag
Your search returns no results.