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Strategies to Minimize PCB Damage

The PCB design process is always an exciting journey for a designer or the founder of a project. The first run of it can be breathtaking. In this article, we delve into strategies for minimizing PCB damage in the case of an exemplary circuit.

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New in Altium Designer 24
Coming Soon: Sectional View

Discover more about our latest upgraded feature, premiering on December 13th. The Sectional View is a tool that simplifies and enhances your PCB design process. Whether you're troubleshooting complex designs or streamlining your workflow, it provides clarity and efficiency.

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New in Altium Designer 24
Coming Soon: Advanced Mixed Simulation Features

We invite you to explore the world of mixed simulation. Delve deeper into key information about this feature and its enhanced functionalities, available starting December 13th. Set up mixed-signal simulations to ensure accuracy and reliability in your design testing

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New in Altium Designer 24
Coming Soon: Harness MCAD CoDesign

In this short video, you can explore how Harness MCAD CoDesign, available on the 13th of December, streamlines the design process by minimizing errors, accelerating iterations, and ensuring a synchronized development process. Altium Designer 24 is on the horizon, and it's not just a request but a requirement for optimizing your electronic design process.

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PCB CoDesign: Design Faster Together

Experience accelerated design collaboration with PCB CoDesign, exclusively available on Altium Designer starting from December 13th. This innovative feature adopts a collaborative approach by seamlessly integrating schematic and PCB design, enabling multiple engineers to work on the same project. Explore this cutting-edge feature on our newly launched page dedicated to its functionalities.

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New in Altium Designer 24
Altium Designer 24: From Requested to Required

Altium Designer 24 is getting closer! In this short video, we are presenting a list of new features and improvements that will be available starting from the 13th of December in our software.

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45V-5A Adjustable Half-Bridge DC to DC Converter

DC-to-DC buck converters are extensively employed in electronic devices. In this article, we will introduce you to one of our new projects—a DC-to-DC converter designed to serve as a power supply as well.

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How-To's
Coming Soon: Harness Multi-Board

Altium Designer's all-in-one approach to electronic design seamlessly combines Harness and Multi-Board Design capabilities, allowing you to create complex multi-board systems with ease. This new feature, available from December 13th, provides an opportunity to bring design and manufacturing teams together, inspiring a streamlined design process, reducing the risk of errors, and ensuring unwavering project deliveries.

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Efficiency And Noise Top 10 Switching Regulator Modules

Switching regulator modules have become indispensable in a wide array of electronic devices, providing a more efficient means of voltage conversion between different levels by storing and releasing energy. Explore further insights into these devices in today's dynamic world of electronics.

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How-To's
The Most Common 2-Layer PCB Design Mistakes and How To Avoid Them

Do you encounter issues when preparing a two-layer board? In this video, we address some of the most common mistakes made with this type of board and explain why upgrading to a four-layer board might be the solution you need.

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Add USB Type-C Power Delivery to Your Designs!

We want to invite you to explore the fundamentals of USB Type-C Power Delivery which is now the most popular energy transmission in current times. We will show you how to easily incorporate a dedicated PD IC into your own designs. 

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An Overview Of PCB Outer Layer Processing

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

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How Do Pads and Vias Impact Total Capacitor Parasitic Inductance?

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

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Analyzing Crosstalk on FIFO and DDR4 Parallel Bus Interfaces

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

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Amplifier Stability at High Frequencies and Stray Capacitance

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

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Working with Design Variants

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

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Setting Up Concord Pro Revisions and Lifecycle

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

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How to Successfully Design a BGA

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

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Altium Designer 20.2 Update 1 is now available

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

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How Copper Foil Roughness Affects Your Signals and Impedance

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

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What is Burn-in Testing for Electronics?

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

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PCB Design for Testability to Ensure High Yield and Quality

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

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Top Tips from Experienced Flex Designers

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design. 

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How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

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How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

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Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

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Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

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How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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