News & Updates

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

As robotics systems become increasingly miniaturized and intricate, ensuring perfect fit, form, and function across electrical and mechanical domains is critical to avoid design setbacks. Real-time ECAD-MCAD integration with two-way sync empowers teams to streamline workflows, reduce PCB rework, and deliver more reliable designs faster.

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Optimizing multiboard PCB systems demands visibility across logical, physical, and manufacturing domains. This article outlines how Altium’s environment lets engineers establish system‑level schematics, 3D spatial validation, harness documentation, and synchronized outputs to streamline design and production.

If you’ve ever been frustrated by clunky PCB-to-mechanical workflows, you’re not alone. Learn why collaboration between mechanical and electrical engineers is harder than it should be and what’s behind the struggle.

Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.