News & Updates
This article compares flex and rigid-flex PCBs across key design and manufacturing considerations, including cost, bend radius, impedance, and assembly complexity. It explains how choosing the right construction early can help reduce design risks and ensure better manufacturability.
Security shouldn't be the reason your engineering team slows down. This article explores how cloud-based design platforms can turn secure access, governance, and IP protection into an enabler of faster collaboration rather than another development bottleneck.
The right PCB assembly outputs turn a finished design into a buildable product. This article covers the essential manufacturing files and DFA considerations that help ensure assemblers have the information they need for accurate, reliable production.
This webinar explores how engineering leaders can gain greater visibility and control across complex electronic design workflows. Discover how connected processes and centralized design data help teams reduce risk, improve collaboration, and deliver projects on time.
Product variations often require different component populations, alternate parts, or configuration settings while keeping the underlying PCB design unchanged. This article explains how structured variant management keeps these differences organized and ensures each configuration has the correct BOM and manufacturing outputs.
Preventing DFM problems starts before fabrication not during the fab review. This article covers eight common PCB manufacturing issues and the design rules that help engineers identify and resolve them early.
Different CAD tools shouldn't mean disconnected teams. Learn how Multi-CAD workflows help engineers review designs, collaborate across disciplines, and catch mechanical or sourcing issues before they become costly redesigns.
This article explores how manufacturing-driven design can help teams validate multiboard products before they reach the factory. It highlights how early checks of interconnects, harnesses, mechanical fit, sourcing, and manufacturing data can reduce late-stage changes and accelerate production readiness.
Automated design sign-offs can eliminate much of the administrative friction surrounding hardware approvals. This article explores how in-context reviews, structured workflows, and automated traceability help teams accelerate release cycles while maintaining control.
Flexible circuits introduce unique assembly challenges that aren't always visible during PCB design, from panel instability and component movement to thermal distortion during reflow. This article explains how design decisions around stiffeners, placement, panelization, and materials can improve assembly yield and reduce costly rework.
Fixing one design problem can sometimes create another you didn't see coming. This article uses the S-80 submarine program to show how better requirements traceability can help teams spot hidden impacts before they turn into expensive rework.
Learn how easy it is to create multi-board projects. This practical project article covers the reasons for breaking larger boards into sub-assemblies and explores the various connection options available between sub-assembly boards.
In this article you can learn about light sensors while building an analog solar panel tracking system. This open-source project covers multi-channel design, window comparators, driving motors, and photosensors.
We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.
In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.
Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.
If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.
Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.
We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.
Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.