News & Updates
Security shouldn't be the reason your engineering team slows down. This article explores how cloud-based design platforms can turn secure access, governance, and IP protection into an enabler of faster collaboration rather than another development bottleneck.
The right PCB assembly outputs turn a finished design into a buildable product. This article covers the essential manufacturing files and DFA considerations that help ensure assemblers have the information they need for accurate, reliable production.
This webinar explores how engineering leaders can gain greater visibility and control across complex electronic design workflows. Discover how connected processes and centralized design data help teams reduce risk, improve collaboration, and deliver projects on time.
Product variations often require different component populations, alternate parts, or configuration settings while keeping the underlying PCB design unchanged. This article explains how structured variant management keeps these differences organized and ensures each configuration has the correct BOM and manufacturing outputs.
Preventing DFM problems starts before fabrication not during the fab review. This article covers eight common PCB manufacturing issues and the design rules that help engineers identify and resolve them early.
Different CAD tools shouldn't mean disconnected teams. Learn how Multi-CAD workflows help engineers review designs, collaborate across disciplines, and catch mechanical or sourcing issues before they become costly redesigns.
This article explores how manufacturing-driven design can help teams validate multiboard products before they reach the factory. It highlights how early checks of interconnects, harnesses, mechanical fit, sourcing, and manufacturing data can reduce late-stage changes and accelerate production readiness.
Automated design sign-offs can eliminate much of the administrative friction surrounding hardware approvals. This article explores how in-context reviews, structured workflows, and automated traceability help teams accelerate release cycles while maintaining control.
Flexible circuits introduce unique assembly challenges that aren't always visible during PCB design, from panel instability and component movement to thermal distortion during reflow. This article explains how design decisions around stiffeners, placement, panelization, and materials can improve assembly yield and reduce costly rework.
Fixing one design problem can sometimes create another you didn't see coming. This article uses the S-80 submarine program to show how better requirements traceability can help teams spot hidden impacts before they turn into expensive rework.
Explore common principles and rituals of Agile and how you can adapt them to hardware product development.
Have you considered converting a USB interface to serial (UART), while delivering data over a custom Ethernet cable and RJ45 connectors? If so, we invite you to check out this article on building a USB to Serial-Over-RJ45 Module. Additionally, you'll find a link to our workspace to explore the entire project.
Explore common principles and rituals of Agile and how you can adapt them to hardware product development.
Our exploration of the Pi.MX8 open-source computer module project progresses. In this third chapter, our focus shifts to the PCB layout preparation of the board. Key topics include defining the layerstack and component break-out routing.
Design faster together with the innovative PCB CoDesign feature, exclusively available in Altium Designer. This cutting-edge functionality seamlessly integrates schematic and PCB design, facilitating concurrent work by multiple engineers on the same project. Learn more about this groundbreaking feature in our comprehensive manual.
Electronic components power nearly everything in our modern lives. However, as long as there are buyers for parts, counterfeiters will persist in their endeavors. Financial losses resulting from fake components are challenging to ascertain due to enforcement limitations and the difficulty in collecting data on the issue. In this article, we demonstrate how to test and verify components in batch orders.
With increased electronics supply chain visibility, you can develop better products faster and align perfectly with budget constraints early on. Here’s why.
Explore common myths about Agile hardware development and learn how to adapt Agile principles for hardware projects.
We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.
If you're trying to understand how commercial Altium 365 differs from Altium 365 GovCloud, you're in the right place. Click to grasp the unique features of each.
Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.
The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.
Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.
We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.
Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.
Ready to start collaborating on your OrCAD projects in a multi-CAD environment? Check how you can use Multi-CAD File Support in Altium 365 in practice.