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Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection

The final part of the LDO Regulator Essentials series focuses on voltage ripple rejection in Low Dropout Regulators (LDOs). Our host Rafał Stępień explains how LDOs clean up DC supply waves, ensuring stable performance in power systems. This episode provides practical insights for optimizing sensitive designs.

NEW
Embedded thumbnail for Explore Routing Improvements in Altium Designer 25
New in Altium Designer 25
Explore Routing Improvements in Altium Designer 25

Discover Routing Improvements in Altium Designer 25. Learn about Dynamic Phase Matching, True Donut Pad Shape, and more in our latest video showcasing the powerful enhancements in our newest release.

NEW
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New in Altium Designer 25
Wire Bonding Shorts: Die Footprints

Check our new short video where Samer Aldhaher demonstrates the Wire Bonding feature in Altium Designer 25, including die-to-die and die-to-copper connections, multiple wire bonds, and pad rotation techniques.

Blog
Wire Bonding in Altium Designer

The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.

Embedded thumbnail for Altium Designer 25: Collaboration at its Finest
New in Altium Designer 25
Altium Designer 25: Collaboration at its Finest

Altium Designer 25 focuses on enhancing collaboration for engineering teams with new tools like the SI Analyzer by Keysight, updated PCB CoDesign, MCAD and Ansys CoDesigners, and improved Simulation modules. This release also introduces Wire Bonding, Single Layer PCB, and performance upgrades for optimized PCB design workflows. Check our overview video about all the improvements in this release.

Embedded thumbnail for The Fastest Ways to Run a PCB BOM Review
How-To's
The Fastest Ways to Run a PCB BOM Review

Conducting a BOM review is crucial to prevent costly delays, obsolete components, and unforeseen sourcing challenges in your PCB project. Discover powerful tools like DigiKey, Octopart, and Altium 365’s BOM portal to simplify your review process and ensure you're selecting the best parts at optimal prices.

Embedded thumbnail for Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones
Altium Stories
Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones

Quantum Systems creates advanced drones for critical aerial intelligence across industries. With Altium Designer and Altium 365, they streamline electronics engineering and enhance team collaboration. Watch how Altium software helps them innovate faster and build reliable drones for mission-critical moments.

Embedded thumbnail for Wire Bonding Shorts: 3D Stacked Die with Cavity
New in Altium Designer 25
Wire Bonding Shorts: 3D Stacked Die with Cavity

Check our short video by Samer Aldhaher on using Altium Designer’s wire bonding tool for creating 3D stacked die in cavity. Highlights advanced techniques for compact, high-performance PCB designs with 3D integrated circuits.

Embedded thumbnail for Constraint Manager Improvements in Altium Designer 25
New in Altium Designer 25
Constraint Manager Improvements in Altium Designer 25

Discover the latest in Altium Designer 25’s Constraint Manager, with updates like flexible net selection, streamlined rule management, and differential pair handling. Simplify your PCB design workflow with powerful new tools and enhancements.

Embedded thumbnail for Signal Integrity Made Simple - Recording Preview
How-To's
Signal Integrity Made Simple - Recording Preview

Catch up on our “Signal Integrity Made Simple” webinar to explore essential techniques for ensuring high-speed design integrity. Watch the recording to gain practical insights, and don’t miss our upcoming November webinar showcasing the latest Altium Designer release, featuring the powerful Signal Analyzer by Keysight and additional tools to optimize your projects.

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Kickstart Your Rigid-Flex Journey
Kickstart Your Rigid-Flex Journey: Part III - PCB Layout

In this third installment of our series, Piet Callemeyn demonstrates PCB layout creation from scratch for a rigid-flex project, covering key techniques like bend lines and split lines. A must-see for any PCB designer!

Embedded thumbnail for Beyond PCB Design with Altium Designer - Recording Preview
New in Altium Designer 24
Beyond PCB Design with Altium Designer - Recording Preview

We invite you to watch this webinar recording, where you'll discover how to streamline your entire PCB development workflow. Learn how to go beyond design to optimize documentation, outputs, and design specifications using Altium Designer. Check the recording here: COM September Webinar.

Blog
Optimize PCB Design with Integrated BOM and CAD Systems

Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.

Embedded thumbnail for Advanced Wire Bonding Techniques in Altium Designer - Demo
New in Altium Designer 25
Advanced Wire Bonding Techniques in Altium Designer - Demo

Check out our brand-new demo of the Wire Bonding tool in Altium Designer! Learn step-by-step how to define die chips, create footprints, route bond wires, and set up a proper PCB layout with rules and constraints.

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Length Tuning Impedance
Blog
What is the Impedance of Length-Tuning Structures?

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

Designing the Next-Generation Electronics
Blog
A-SAP™ – What do you need to know?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

Pin-package and Via Delay Values
Blog
Pin-Package Delay and Via Delay in High Speed Length Tuning

Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.

6-Layer PCB Design
Blog
6-Layer PCB Design Guidelines

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.

Altium Designer Interface
Blog
Altium Designer 22.5 Update

We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Are Hybrid PCB Stackups Reliable?
Blog
How Reliable is Your Hybrid PCB Stackup?

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.

Monte Carlo vs Sensitivity Analysis
Blog
Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.

Simulation, Build and Test
Blog
Creating Continuous Integration Pipelines for FPGAs

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.

Collaborators Visualization
Blog
Soft Locks [Conflict Prevention] in Altium 365

Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully

Guide to Monte Carlo in SPICE
Blog
The Basics of Monte Carlo in SPICE: Theory and Demo

Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?

BGA Land Patterns and Footprints
Blog
What's In Your BGA Land Pattern and Footprint

If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.

Molded Interconnect Devices
Blog
MIDs Make a Comeback as Vertical SMD Modules for Your PCB

Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.

MCAD CoDesign Process
Blog
MCAD CoDesigner 2.9.0 is Out

Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.

Rigid-Flex in Altium Designer
Blog
Support for Rigid-Flex in Altium Designer

Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.

2+N+2 PCB Stackups
Blog
2+N+2 PCB Stackup Design for HDI Boards

Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.

PDF Viewer in Altium 365
Blog
PDF in Altium 365 Web Viewer

Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier

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Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
How-To's
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

Embedded thumbnail for LSM: Impedance profile
How-To's
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

Embedded thumbnail for How to efficiently use Blankets?
How-To's
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

Embedded thumbnail for Draftsman Document: Snapping
How-To's
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
Schematic Capture Improvement

Adding cross-references to the project allows you to easily follow the connective flow of nets between the schematic sheets in a project. 

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
原理图输入改进

您可以通过向项目添加交叉引用,轻松跟踪项目中原理图图纸之间的网络连接流。

Embedded thumbnail for High Speed: XSignals
How-To's
High Speed: XSignals

You can create, configure, and utilize xSignals in Altium Designer to make your design process more efficient and effective. We’ll show you how to do it manually, using the more comprehensive Create xSignals command, and using the xSignal wizard.

Embedded thumbnail for DFM and fab cost/time constraints: What is annular ring and how to configure it
How-To's
DFM and fab cost/time constraints: What is annular ring and how to configure it

The minimum dimension from the wall of the aperture to the edge of the pad is called an annular ring, and we can configure it with Altium Designer. We’ll show you how to get started and manage the annular ring in your design rules.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

Embedded thumbnail for Polygon Pours
Working with Polygons
Polygon Pours

Polygon pours are used to create copper geometries on your board. You can prioritize polygon pour order, hide them to make it easier to work on your board, and repour them to resolve design rule conflicts.

Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

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Iterate Faster in Complex Engineering Projects Webinar Cover
On-Demand Webinar
Iterate Faster in Complex Engineering Projects

Learn how Valispace is transforming the world of requirements and systems engineering, enabling teams to do super fast design iterations and develop quality products while ensuring they comply with standards and regulations.

Data Security and Access Controls for Electronics Development Teams
On-Demand Webinar
Data Security and Access Controls for Electronics Development Teams Using Altium 365 GovCloud on AWS GovCloud Infrastructure

Watch the webinar that brings together the expertise of Altium 365 and AWS to introduce the specialized Altium 365 GovCloud within the robust AWS GovCloud infrastructure. This session is designed for IT and security professionals seeking advanced data protection and access control solutions for their electronics development teams.